NTC电阻的规格书-精品文档.docx
NTC电阻的规格书1.文档讲明：本文档是针对我司MT6575项目，配带NTC温度检测电池制作讲明。在这以前我司的项目配用的电池都是不带NTC检测的，为了让提高智能机检测电池电量的准确性，必须获得电池的温度，通过软件的运算能够让手机能够准确的显示当前电池的百分比。我司要求MT6575平台的项目都要增加NTC温度检测，该文档就是讲明和以前电池内部短路不同的地方。2.引脚定义：带NTC温度检测的电池一般要有3个引脚，这3个引脚的功能分别是电池正极、电池负极、电池的ID引脚定义顺序要根据不同项目有所不同，要详细确认。3.电池内部接线：带NTC的电池和一般的电池最大的不区别就是IDPin和电池的负极之间加一个NTC器件，这个器件我司指定使用47K的，当然不能用固定电阻替代，由于NTC的阻值是随温度变化而变化的，只要这样才能检测到电池的实际温度。4.NTC的选型：我司目前验证过的NTC型号为顺络的SDNT1005X473F4100FTF联络方式：杨蕊:136*，021-*，ann_yang:/docsj/doc/1b8003d784254b35eefd3491.html，请务必使用这个料。以后等验证新的代用料在做更新。在电池打样期间要将样品寄到我司验证，验证合格后才能批量生产。5.NTC物料的详细参数：1.ScopeThisspecificationappliestoSDNT1005X473F4100FTFofchipNTCthermistors.2.ProductDescriptionandIdentification(PartNumber)1)DescriptionExample:NTC,1005,47KOhm±1%,4100K±1%.2)ProductIdentification(PartNumber)SDNT1005X473F4100FTF3.ElectricalCharacteristicsPartNumberResistanceat25R25(k?)Bconstant(25-50)(K)Max.PermissiveOperatingCurrent(25)(mA)ThermalTimeConstantDissipationFactor(mW/)RatedElectricPower(mW)SDNT1005X473F4100FTF47±1%4100±1%0.124.ShapeandDimensions1)Dimensions:SeeFig.4-1andTable4-1.2)RecommendedPCBpatternforreflowsoldering:SeeFig.4-2andTable4-1.5.TestandMeasurementProcedures5.1TestConditions5.1.1Unlessotherwisespecified,thestandardatmosphericconditionsformeasurement/testas:a.AmbientTemperature:20±15b.RelativeHumidity:65±20%c.AirPressure:86kPato106kPa5.1.2Ifanydoubtontheresults,measurements/testsshouldbemadewithinthefollowinglimits:a.AmbientTemperature:20±2b.RelativeHumidity:65±5%c.AirPressure:86kPato106kPa5.2VisualExaminationa.InspectionEquipment:20×magnifierTypeLWTaABC100504021.0±0.150.039±0.0060.5±0.150.020±0.0060.5±0.150.020±0.0060.25±0.10.010±0.0040.450.550.400.500.450.55Table4-1Unit:mminchFig.4-2Fig.4-15.3.5RatedPowerRefertoItem3Thenecessaryelectricpowermakesthermistorstemperaturerise100byself-heatingatambienttemperature25.5.3.6PermissiveoperatingcurrentRefertoItem3ThecurrentthatkeepbodytemperatureofchipNTConthePCboardinstillairrising1°Cbyself-heating.SunlordSpecificationsforChipNTCThermistorPage6of86.PackagingandStorage6.1Packaging6.1.1TapeCarrierPackaging:Packagingcode:Ta.TapecarrierpackagingarespecifiedinattachedfigureFig.6.1-13b.Tapecarrierpackagingquantitypleaseseethefollowingtable: (1).TapingDrawings(Unit:mm)Remark:Thesprocketholesaretotherightasthetapeispulledtowardtheuser.Type10050402T(mm)0.5±0.15TapePaperTapeQuantity10K (2)TapingDimensions(Unit:mm)(3)ReelDimensions(Unit:mm)6.2Storagea.Thesolderabilityoftheexternalelectrodemaybedeterioratedifpackagesarestoredwheretheyareexposedtohighhumidity.Packagemustbestoredat40orlessand70%RHorless.b.Thesolderabilityoftheexternalelectrodemaybedeterioratedifpackagesarestoredwheretheyareexposedtodustofharmfulgas(e.g.HCl,sulfurousgasofH2S)c.Packagingmaterialmaybedeform-edifpackagearestoredwheretheyareexposedtoheatofdirectsunlight.d.SolderabilityspecifiedinClause5.4.6shallbeguaranteedfor3monthsfromthedateofdeliveryonconditionthattheyarestoredattheenvironmentspecifiedinClause3.Forthoseparts,whichpassedmorethan3monthsshallbecheckedsolder-abilitybeforeuse.7.RecommendedSolderingTechnologies7.1Re-flowingProfile:Preheatcondition:150200/60120sec.Allowedtimeabove217:6090sec.Maxtemp:260Maxtimeatmaxtemp:10sec.Solderpaste:Sn/3.0Ag/0.5CuAllowedReflowtime:2xmax7.2IronSolderingProfile.Ironsolderingpower:Max.30WPre-heating:150/60sec.SolderingTiptemperature:350Max.Solderingtime:3sec.Max.Solderpaste:Sn/3.0Ag/0.5CuMax.1timesforironsolderingNote:Takecarenottoapplythetipofthesolderingirontotheterminalelectrodes.TypeABPTmax100504020.65±0.11.15±0.12.0±0.050.8Fig.6.1-310.0±1.5mm4.3±0.2mm4.0±0.1mm5.0±0.1mmChipCavityDirectionofFeedFig6.1-2Note:Thereflowprofileintheabovetableisonlyforqualificationandisnotmeanttospecifyboardassemblyprofiles.Actualboardassemblyprofilesmustbebasedonthecustomer'sspecificboarddesign,solderpasteandprocess,andshouldnotexceedtheparametersastheReflowprofileshows.26015020021725Tc3508.SupplierInformationa)Supplier:ShenzhenSunlordElectronicsCo.,Ltd.b)Manufacturer:ShenzhenSunlordElectronicsCo.,Ltd.c)ManufacturingAddress:SunlordIndustrialPark,DafuyuanIndustrialZone,Guanlan,Shenzhen,ChinaZip:518110
