欢迎来到淘文阁 - 分享文档赚钱的网站! | 帮助中心 好文档才是您的得力助手!
淘文阁 - 分享文档赚钱的网站
全部分类
  • 研究报告>
  • 管理文献>
  • 标准材料>
  • 技术资料>
  • 教育专区>
  • 应用文书>
  • 生活休闲>
  • 考试试题>
  • pptx模板>
  • 工商注册>
  • 期刊短文>
  • 图片设计>
  • ImageVerifierCode 换一换

    (完整版)_毕业设计外文翻译_61443715.docx

    • 资源ID:26966730       资源大小:18.03KB        全文页数:14页
    • 资源格式: DOCX        下载积分:30金币
    快捷下载 游客一键下载
    会员登录下载
    微信登录下载
    三方登录下载: 微信开放平台登录   QQ登录  
    二维码
    微信扫一扫登录
    下载资源需要30金币
    邮箱/手机:
    温馨提示:
    快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
    如填写123,账号就是123,密码也是123。
    支付方式: 支付宝    微信支付   
    验证码:   换一换

     
    账号:
    密码:
    验证码:   换一换
      忘记密码?
        
    友情提示
    2、PDF文件下载后,可能会被浏览器默认打开,此种情况可以点击浏览器菜单,保存网页到桌面,就可以正常下载了。
    3、本站不支持迅雷下载,请使用电脑自带的IE浏览器,或者360浏览器、谷歌浏览器下载即可。
    4、本站资源下载后的文档和图纸-无水印,预览文档经过压缩,下载后原文更清晰。
    5、试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。

    (完整版)_毕业设计外文翻译_61443715.docx

    (完整版)_毕业设计外文翻译_61443715 西安欧亚学院 本科毕业论文(设计)外文翻译译文 学生姓名:赵隆云 分院(系):信息工程学院 专业班级:电子信息工程1001班 指导教师:贾炜 要求 (无需打印) 1、外文翻译是毕业论文的主要内容之一,学生必须独立完成。 2、外文翻译译文内容应与学生的专业或毕业论文内容相关,不得少于6000印刷符号。 3、外文翻译译文用A4纸打印。文章标题用3号宋体加粗,段后1行;章节标题用4号宋体加粗;正文用小4号宋体;数字、字母用Times New Roman体。行距固定值20磅。页边距上、下、左、右均为2.5cm,左侧装订,装订线0.5cm。按中文翻译在上,外文原文在下的顺序装订。 4、年月日等的填写,用阿拉伯数字书写,要符合关于出版物上数字用法的试行规定,如“2022年2月28日”。 5、所有签名必须手写,不得打 Progress in Computers Prestige Lecture delivered to IEE, Cambridge, on 5 February 2022 Maurice Wilkes Computer Laboratory University of Cambridge The first stored program computers began to work around 1950. The one we built in Cambridge, the EDSAC was first used in the summer of 1949. These early experimental computers were built by people like myself with varying backgrounds. We all electronic engineering and were confident that that experience would stand us in good stead. This proved true, although we . The most important of these was that transients must be treated correctly; what would cause a the screen of a television set could lead to a serious error in a computer. As far as computing circuits were concerned, we found ourselves with an embarass de richess. For example, we could use vacuum tube diodes for gates as we did in the EDSAC or pentodes with control signals on both grids, a system widely used elsewhere. This sort of choice persisted and the term families of logic came into use. Those who the computer field will remember TTL, ECL and CMOS. Of these, CMOS those early years, the IEE was still dominated by power engineering and we order to get radio engineering along with the rapidly developing subject of electronics.dubbed in the IEE light current electrical engineering.properly recognised as an activity in its own right. I remember that we organising a conference because the power engineers ways of doing things were not our ways. A minor source of irritation was that all IEE published papers were expected to start with a lengthy statement of earlier practice, something difficult to do when there was no earlier practice Consolidation in the 1960s By the late 50s or early 1960s, the real earnest. The number of computers in the world the very early ones . To those years we can ascribe the first steps in to replace vacuum tubes. This change presented a formidable challenge to the engineers of the day. They . It can only be said that they measured up superbly well to the challenge and that the change could not it was found possible to put more than one transistor on the same bit of silicon, and this was the beginning of integrated circuits. As time went on, a sufficient level of integration was reached for one chip to accommodate enough transistors for a small number of gates or flip flops. This led to a range of chips known as the 7400 series. The gates and flip flops were independent of one another and each pins. They could be connected by off-chip wiring to make a computer or anything else. These chips made a new kind of computer possible. It was called a minicomputer. It was something less that a mainframe, but still very powerful, and much more affordable. Instead of , a business or a university was able to to spread and become more powerful. The world was very frustrating for industry not to be able to supply it on the scale required and at a reasonable cost. Minicomputers transformed the situation. The single-chip computer At each shrinkage the number of chips was reduced and there were fewer wires going from one chip to another. This led to an additional increment in overall speed, since the transmission of signals from one chip to another takes a long time. Eventually, shrinkage proceeded to the point at which the whole processor except for the caches could be put on one chip. This enabled a workstation to be built that out-performed the fastest minicomputer of the day, and the result was to kill the minicomputer stone dead. As we all know, this it. From the above time the chip was Cock of the Roost. Shrinkage went on until millions of transistors could be put on a single chip and the speed went up in proportion. Processor designers began to experiment with new architectural features designed to give extra speed. One very successful experiment concerned methods for predicting the way program branches would go. It was a surprise to me and other forms of prediction followed Equally surprising is what it found possible to put on a single chip computer by way of advanced features. For example, features that developed for the IBM Model 91.the giant computer at the top of the System 360 range.are now to be found on microcomputers Murphys Law remained in a state of suspension. No longer did it make sense to build experimental computers out of chips with a small scale of integration, such as that provided by the 7400 series. People who wanted to do but to design chips and seek for ways to get them made. For a time, this was possible, if not easy Unfortunately, there a dramatic increase in the cost of making chips, mainly because of the increased cost of making masks for lithography, a photographic process used in the manufacture of chips. It consequence, again become very difficult to finance the making of research chips, and this is a currently cause for some concern. The Semiconductor Road Map The extensive research and development work underlying the above advances made possible by a remarkable cooperative effort on the part of the international semiconductor industry. At one time US monopoly laws would probably such an effort. However about 1980 significant and far reaching changes took place in the laws. The concept of pre-competitive research was introduced. Companies can now collaborate at the pre-competitive stage and later go on to develop products of their own in the regular competitive manner. The agent by which the pre-competitive research in the semi-conductor industry is managed is known as the Semiconductor Industry Association (SIA). This active as a US organisation since 1992 and it became international in 1998. Membership is open to any organisation that can contribute to the research effort. Every two years SIA produces a new version of a document known as the International Technological Roadmap for Semiconductors (ITRS), with an update in the intermediate years. The first volume bearing the title Roadmap was issued in 1994 but two reports, written in 1992 and distributed in 1993, are regarded as the true beginning of the series. Successive roadmaps aim at providing the best available industrial consensus on the way that the industry should move forward. They set out in great detail.over a 15 year . the targets that must be achieved if the number of components on a chip is to be doubled every eighteen months.that is, if Moores law is to be maintained.-and if the cost per chip is to fall. In the case of some items, the way ahead is clear. In others, manufacturing problems are foreseen and solutions to them are known, although not yet fully worked out; these areas are coloured yellow in the tables. Areas for which problems are foreseen, but for which no manufacturable solutions are known, are coloured red. Red areas are referred to as Red Brick Walls. The targets set out in the Roadmaps and competition combined in an admirable manner. It is to be noted that the major strategic decisions affecting the progress of the industry taken at the pre-competitive level in relative openness, rather than behind closed doors. These include the progression to larger wafers. By 1995, I to wonder exactly what would when the inevitable point was reached at which it became impossible to make transistors any smaller. My enquiries led me to visit ARPA Washington DC, where I was given a copy of the recently produced Roadmap for 1994. This made it plain that serious problems would arise when a feature size of 100 nm was reached, an event projected to in 2022, with 70 nm following in 2022. The year for which the coming of 100 nm (or rather 90 nm) was projected was in later Roadmaps moved forward to 2022 and in the event the industry got there a little sooner. I presented the above information from the 1994 Roadmap, along with such other information that I could obtain, in a lecture to the IEE in London, entitled The CMOS end-point and related topics in Computing and delivered on 8 February 1996. The idea that I then fact the physical limitations that are now beginning to make themselves felt do not arise through shortage of electrons, but because the insulating layers on the chip that leakage due to quantum mechanical tunnelling those that arise from fundamental physics, especially problems with lithography. In an update to the 2022 Roadmap published in 2022, it was stated that the continuation of progress at present rate will be at risk as we approach 2022 when the roadmap projects that progress will stall without research break-throughs in mos t technical areas “. This was the most specific statement about the Red Brick Wall, that . It is satisfactory to report that, so far, timely solutions found to all the problems encountered. The Roadmap is a remarkable document and, for all its frankness about the problems looming above, it radiates immense confidence. Prevailing opinion reflects that confidence and there is a general expectation that, by one means or another, shrinkage will continue, perhaps down to 45 nm or even less. However, costs will rise steeply and at an increasing rate. It is cost that will ultimately be seen as the reason for calling a industrial consensus is reached that the escalating costs can no longer be met will depend on the general economic climate as well as on the financial strength of the semiconductor industry itself. Insulating layers in the most advanced chips are now approaching a thickness equal to that of 5 atoms. Beyond finding better insulating materials, and that cannot take us very far, there is nothing we can do about this. We may also expect to face problems with on-chip wiring as wire cross sections get smaller. These will concern and atom migration. The above problems are very fundamental. If we cannot make wires and insulators, we cannot make a computer, whatever improvements there may be in the CMOS process or improvements in semiconductor materials. It is no good months. I said above that there is a general expectation that shrinkage would continue by one means or another to 45 nm or even less. What I mind was that at some point further scaling of CMOS as we know it will become impracticable, and the industry will need to look beyond it. Since 2022 the Roadmap entitled emerging research devices on non-conventional forms of CMOS and the like. Vigorous and opportunist exploitation of these possibilities will undoubtedly take us a useful way further along the road, but the Roadmap rightly distinguishes such progress from the traditional scaling of conventional CMOS that we used to. Advances in Memory Technology Unconventional CMOS could revolutionalize memory technology. Up to now, we DRAMs for main memory. Unfortunately, these are only increasing in speed marginally as shrinkage continues, whereas processor chips and their associated cache memory continue to double in speed every two years. The result is a growing gap in speed between the processor and the main memory. This is the memory gap and is a current source of anxiety. A breakthrough in memory technology, possibly using some form of unconventional CMOS, could lead to a major advance in overall performance on problems with large memory requirements, that is, problems which fail to fit into the cache. Perhaps this, rather than attaining marginally -conventional CMOS. Shortage of Electrons Although shortage of electrons obvious limitation, in the long term it may become so. Perhaps this is where the exploitation of non-conventional CMOS will lead us. However, some interesting work done.notably by Haroon Amed and the Cavendish Laboratory.on the direct development of structures in which a single electron more or less makes the difference between a zero and a one. However very little progress made towards practical devices that could lead to the construction of a computer. Even with exceptionally good luck, many tens of years must inevitably elapse before a working computer based on single electron effects can be contemplated. 微机发展简史 IEEE的论文剑桥大学,202225 莫里斯威尔克斯 计算机实验室 剑桥大学 第一台存储程序的计算开始出现于1950前后,它就是1949年夏天在剑桥大学,我们创造的延迟存储自动电子计算机(EDSAC)。 最初实验用的计算机是由象我一样有着广博知识的人构造的。我们在电子工程方面都有着丰富的经验,并且我们深信这些经验对我们大有裨益。后来,被证明是正确的,尽管我们也要学习很多新东西。最重要的是瞬态一定要小心应付,虽然它只会在电视机的荧幕上一起一个无害的闪光,但是在计算机上这将导致一系列的错误。 在电路的设计过程中,我们经常陷入两难的境地。举例来说,我可以使用真空二级管做为门电路,就象在EDSAC中一样,或者在两个栅格之间用带控制信号的五级管,这被广泛用于其他系统设计,这类的选择一直在持续着直到逻辑门电路开始应用。在计算机领域工作的人都应该记得TTL,ECL和CMOS,到目前为止,CMOS已经占据了主导地位。 在最初的几年,IEE(电子工程师协会)仍然由动力工程占据主导地位。为了让IEE 认识到无线工程和快速发展的电子工程并行发展是它自己的一项权利,我们不得不面对一些障碍。由于动力工程师们做事的方式与我们不同,我们也遇到了许多困难。让人有些愤怒的是,所有的IEE出版的论文都被期望以冗长的早期研究的陈述开头,无非是些在早期阶段由于没有太多经验而遇到的困难之类的陈述。 60年代的巩固阶段 60年代初,个人英雄时代结束了,计算机真正引起了重视。世界

    注意事项

    本文((完整版)_毕业设计外文翻译_61443715.docx)为本站会员(h****)主动上传,淘文阁 - 分享文档赚钱的网站仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知淘文阁 - 分享文档赚钱的网站(点击联系客服),我们立即给予删除!

    温馨提示:如果因为网速或其他原因下载失败请重新下载,重复下载不扣分。




    关于淘文阁 - 版权申诉 - 用户使用规则 - 积分规则 - 联系我们

    本站为文档C TO C交易模式,本站只提供存储空间、用户上传的文档直接被用户下载,本站只是中间服务平台,本站所有文档下载所得的收益归上传人(含作者)所有。本站仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。若文档所含内容侵犯了您的版权或隐私,请立即通知淘文阁网,我们立即给予删除!客服QQ:136780468 微信:18945177775 电话:18904686070

    工信部备案号:黑ICP备15003705号 © 2020-2023 www.taowenge.com 淘文阁 

    收起
    展开