2022年新世纪LED芯片xmil规格书定义 .pdf

Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 1 of 14CONTROLLED DOCUMENT APPROVAL SHEETProduct Type: Blue InGaN/ GaN LED B1016ACG0 ChipsPart No: B1016ACG0 Doc ID : MK-QA-036 Rev: F Date : July 05, 2011 Created By: Approved By:Oscar Chan Jason Lin 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 1 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 2 of 14Revision History Rev. Date Charged Approval Revision Summary A 2010/07/27 Jason Lin First issue. B 2010/08/16 Oscar Chan Jason Lin Addition reliability test data C 2010/08/31 Oscar Chan Jason Lin Revise Packing specification D 2011/04/23 Oscar Chan Jason Lin Revise Chip diagram E 2011/04/29 Oscar Chan Jason Lin Revise Iv range F 2011/07/05 Oscar Chan Jason Lin Revise Chip diagram 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 2 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 3 of 141.Scope ：This specification applies to Blue InGaN/GaN LED chips,B1016ACG0, of Genesis Photonics Inc. And includes the inspection of electro-optical characteristics 2.Materials：2.1 P-contact：ITO 2.2 P-pad：Au 2.3 N-pad：Au 3.Size ：3.1 Chip size：254X407m ( 10 m ) 3.2 P-pad： 75 m ( 10 m ) 3.3 N-pad： 80 m ( 10 m ) 3.4 Chip thickness：120m ( 10 m ) 3.5 Chip diagram Top view Cross section 4.Electro-optical characteristics and specification：4.1 Test condition：Parameter Symbol Condition Unit Dominant wavelength Wd If = 20 mA nm Luminous intensity Iv If = 20 mA mW Forward voltage Vf If = 20 mA V Reverse current Ir Vr = -7 V A 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 3 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 4 of 144.2 Characteristics: Maximum Ratings at Ta=25 Symbol Conditions Ratings DC Forward Current IFTj=12520 mA Junction Temperature Tj125 Reverse Voltage VrTa=25 -5V Reverse Current IrVr=-7V2A Assembly Process Temp. 325 (5sec) Notes ：Maximum ratings were measured in an integrating sphere using Ag plated TO46 headers without an encapsulate, and may differ with different package types. 4.3 Model No：Part No : A B C D E F G H I Bin : 1 2 3 4 5 6 7 8 9 Exp ：Part No: B1016ACG0 Bin : V32 S45C-20 4.3.1 Code A B C D E F G H I ：Product code: A B C D E F G H I Product code 4.3.2 Code 1 2 3 ：Vf range（V） ：1 2 3 V31 3.13.2 V32 3.23.3 V33 3.33.4 V34 3.43.5 4.3.3 Code 4 ：Electrical spec： 4 P Vf 3.5V , Ir2 A 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 4 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 5 of 144.3.4 Code 5 6 7 ：Wd range（nm ） ：5 6 7 45A 450.0452.5 46A 460.0462.5 47A 470.0472.5 45B 452.5455.0 46B 462.5465.0 47B 472.5475.0 45C 455.0457.5 46C 465.0467.5 47C 475.0477.5 45D 457.5460.0 46D 467.5470.0 47D 477.5480.0 4.3.5 Code 8 9 ：Iv range (mW)：8 9 18 18.520.5 21 24.526.0 24 29.531.5 19 20.522.5 22 26.027.5 25 31.533.5 20 22.524.5 23 27.529.5 26 33.535.5 Lot No ：L/N ：A B C D E F G H I J K L M Exp ： L/N ：42421-19019-001 5.Bin description：Below is a table which defines the specific part numbers or “bins ” which are within the B1016ACG0 kit. Each tape will contain chips from only one bin, and a customer order for kit B1016ACG0 will be fulfilled with a shipment of production devices which may contain any combination of tapes consisting of any or all bins in the table. Wd Grade Iv Grade 44C -19 -20 -21 -22 44D -19 -20 -21 -22 45A -19 -20 -21 -22 45B -19 -20 -21 -22 45C -19 -20 -21 -22 -23 45D -19 -20 -21 -22 -23 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 5 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 6 of 146.Packing specification：6.1LED chips are placed on the blue adhesive tape with the bonding pads facing up (i.e. sapphire is adhered to the tape) and covered with a glossy paper (See Figure 6-1) 6.2Chip array must be placed within the center of the blue adhesive tape and the bar code label is located on the back of the blue tape at the left lower corner (See Figure. 6-2). 6.3Label specification：MIN AVG MAX STD Vf (V) - actual spec actual Iv (mW) spec actual spec actual Wp (nm) spec actual spec actual Blue tapeChipBonding padGlossy paperFig 6-1 Chip on tape Fig 6-2 Location of label 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 6 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 7 of 146.4Packaging dimensions (See table 6-1) Item Dimension Blue adhesive tape 200 mm 200 mm (10mm) Backing glossy paper 200 mm 210 mm (10mm) Label location on blue tape Lower left corner; 10 2 mm 6.5Packaging for shipment 6.5.1The sheet (blue adhesion tape & glossy paper) must be packed in an anti-electrostatic bag and paper box for shipment(See Fig 6-3) 6.5.2The ESD attention label is stamped on bag 6.5.3Each box and each sheet should be labeled with information describing its content. Bag Shipping Address Packing List ESD label名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 7 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 8 of 14Criteria of Defective Chip 1.Inspection Equipment and Method Inspecting Chip by Microscope Magnification: 30X 2.Figure of Example Item Defective item Criteria of Defect Chip Example 1 Active Area Broken Rejected 2 Active Area Dirty (1) Dirty Area 10% of Active Area 3 Active Layer Breakage and Scratched 1.Breakage andscratch must not cross active layer 2.Breakage and Scratch 10% of Active Layer 4 Active Layer Dirty (2) Dirty Area 10% of Active Layer 5 Pad Dirty Dirty Area 10% of Pad Area 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 8 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 9 of 14Item Defective item Criteria of Defect Chip Example 6 Pad Lost 1.Lost Area 10% of Pad Area 2.Lost Length 1/5 of Pad Diameter 7 Pad Scratched 1.Scratched Area 20% of Pad Area 2. Scratched Length 1/3of Pad Diameter 3. Exposed Sub-tract 8 Remnant Metal 1.Remnant Area 10% of Active Area 2.Remnant metal 3 Spots and Spot Length 20 m 3.Remnant metal over active area 9 Defective Scribe 1.Double Chips 2.Scribed on active area or N-pad 3.Racked or Chipped Area 10% of the Original Area 4.Un-scribed Area 110% of the Original Area 10 Defective Alignment 1.Displacement of Adjacent Chips 20% of Chip Size 2.Chip Inclination 10 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 9 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 10 of 14Item Defective item Criteria of Defect Chip Example 11 Defective Probing Scar Scar Area 10% of Pad Area 12 Wrong Label Rejected - 13 Inverse Protective Paper Rejected - 14 The Amount of Chips Amount per Blue Tape 1,000 pcs - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 10 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 11 of 14Typical Characteristic 1.Sample Mode 1.1The sample mode is based on GPI standard sampling plan. 2.Characteristic Test 2.1Test condition 2.1.1 Package form: chip on chuck 2.1.2 Operating temperature: room temperature 2.2Contain items 2.2.1 Forward voltage vs. Forward current (I-V curve) 2.2.2 Emission intensity vs. Forward current (L-I curve) 2.2.3 Dominant Wavelength shift vs. Forward current (Wd shift) 2.2.4 Relative intensity vs. Wavelength (Spectrum) 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 11 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 12 of 14Product ESD Test 1. Test Product: B1016ACG0 Chip 2. Test Division: QA Division (Test Date: 2010/07/29) 3.Tester: ETS HED-W500M ESD Tester 4.Test Condition: Ir=10 uA Vr=5.0 V ESD-Pulse=1 ESD-Mode=HBM Test Voltage : 0-8000V 5.Test Data: BIN: B1016ACG0 L/N: 00210615006-001 Test Chip: 681 pcs Test Voltage(V) Fail NO.(pcs) Total Yield (%) -100 31 31 98.8% -500 15 46 98.3% -1000 5 51 98.1% -2000 5 56 97.9% -4000 17 73 97.3% -6000 21 94 96.5% -8000 85 179 93.3% 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 12 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 13 of 14Reliability test 1. Temperature : 2532. OPERATE CURRENT: 20 & 40 mA 3. Burn in Mode: CHIP ON PCB 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 13 页，共 14 页 - - - - - - - - - Genesis Photonics Inc. Blue InGaN/GaN LED Chip B1016ACG0 Product SpecificationB000705F No. 5 Dali 3rd RD., T ainan Science-Based Industrial Park, 741, Taiwan R.O.C. Tel: + 886 6 505 3500 Fax: + 886 6 505 3800 Page 14 of 14LED chip view angle measurement 1.Package from 1.1Chip on TO-46 without cap 2.Measurement condition 2.1Measurement distance: 100 mm 2.2Operating angle from: -90o to 90o3.Result 3.1 Relative intensity vs. Off axis angle( View angle) 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 14 页，共 14 页 - - - - - - - - -