真空镀膜技术ppt课件.ppt

塑膠外觀金屬化製程簡介1SprayingSubstrateMaterial2ElectroplatingSubstrateMaterialAnodeCathode3EvaporationMaterialSubstrateHeaterVacuum chamberCloud4SputteringMaterialSubstratePlasma1EvaporationMaterialSubstrateHeaterVacuum chamberCloud2SputteringMaterialSubstratePlasmaMaterialSubstrateHeaterVacuum chamberCloudMaterialSubstratePlasma物質的第四態物質的第四態Vacuum pumpTakes place in a vacuumchamberElectrical charge is formed between the substrate and cathodeGas is injected in chamberIons hit the target andknock off atomsTarget atoms land (condense) on substrate to form a thin filmTarget Material(Cathode)SubstrateEnergyIons move in plasmaGasPlasmaGas ionizes - forms a plasmaSputteringchamberBufferchamberUnloadingchamberPlasmatreatmentLoadingchamberrobotInrobotOutSputteringChamberBufferChamberUnloadingChamberBufferChamberLoadingChamberOutPVD蒸鍍法真空蒸鍍濺射蒸鍍離子蒸鍍粒子生成機構熱能動能熱能膜生成速率可提高快可提高粒子原子、離子原子、離子原子、離子蒸鍍均勻性複雜形狀佳良好良好，但膜厚分佈不均平面佳優佳蒸鍍金屬可可可蒸鍍合金可可可蒸鍍耐熱化合物可可可粒子能量很低0.10.5eV可提高1100eV可提高1100Ev惰性氣體離子衝擊通常不可以可，或依形狀不可可表面與層間的混合通常無可可加熱（外加熱）可通常無可，或無蒸鍍速率10-9m/sec1.6712500.1716.70.50833性質沈積速率大尺寸厚度控制精確成份控制可沈積材料之選用整體製造成本方法蒸鍍(Evaporation)慢可佳多佳濺鍍(Sputter)佳佳佳多佳A thin“ coating ofa substance onto a substrateHard coatedMetalSubstratePrimerPVD MetalPrimerSubstratePrintingLaser EtchingHard coatedPrintingSubstrateMetalLaser EtchingPrinting