2022年D封装及其最新研究进展 .pdf
名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 1 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 2 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 3 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 4 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 5 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 6 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 7 页，共 10 页 - - - - - - - - - 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 8 页，共 10 页 - - - - - - - - - 3D 封装及其最新研究进展作者：邓丹， 吴丰顺， 周龙早， 刘辉， 安兵， 吴懿平， Deng Dan ， Wu Fengshun ， ZhouLongzao， Liu Hui ， An Bing ， Wu Yiping作者单位：邓丹,Deng Dan(华中科技大学,武汉光电国家实验室,武汉,430074)， 吴丰顺,安兵,吴懿平,Wu Fengshun,An Bing,Wu Yiping( 华中科技大学,武汉光电国家实验室,武汉,430074;华中科技大学,材料成形及模具国家重点实验室 ,武汉,430074)， 周龙早,刘辉,ZhouLongzao,Liu Hui( 华中科技大学,材料成形及模具国家重点实验室 ,武汉,430074)刊名：微纳电子技术英文刊名：MICRONANOELECTRONIC TECHNOLOGY年，卷(期)：2010,47(7)参考文献(33条)1. 章文;丁荣峥;吴刚一种半导体芯片的减薄方法 20082. BEICA R;SHARBONO C;RITZDORF TThrough silicon via copper electrodeposition for 3D integration 20083. BEICA R;SIBLERUD P;SHARBONO CAdvanced metallization for 3D integration 20084. Inter-University Micro-Electronic Center;Research InstitutionScientific report of IMEC 20095. PROVOOST J;BEYNE E穿透硅通孔:兼顾技术与成本的考虑 2009(z2)6. SINGER PTSV: 准备好量产了吗 期刊论文-集成电路应用 2008(05)7. Yole Dveloppement;Research Institution3DIC-TSV 2009reports 20098. STATS ChipPAC,Inc Packaging services of STATS Chip PAC 20099. JOHNSON S C 倒装芯片封装极具竞争力 2009(z2)10.BOGATIN E折叠封装 200911.中国电子学会生产技术学分会丛书编委会微电子封装技术 200312.HEALY M B;LIM S K A study of stacking limit and scaling in 3D ICs:an interconnect perspective200913.CHEN M W;CHEN E;LAI J YThermal investigation for multiple chips 3D packages 200814.BAUER C E;NEUHAUS H J Advanced opportunity cost analysis of 3D packaging technologies 200815.JEUNG W K;LIM C H;YI S Low temperature multi layer stack wafer bonding technology development200916.KUMAR A;DINGWEI X;SEKHAR V NWafer level embedding technology for 3D wafer level embedded package 200917.BOETTCHER L;NEUMAN A;OSTMANN AIntegration of active and passive components using chip in polymertechnology 200518.KESER B;AMRINE C;DUONG TThe redistributed chip package;a breakthrough for advanced packaging200719.BOETTCHER L;MANESSIS D;OSTMANN AEmbedding of chips for system in package realization-technologyand applications 200820.ZHAO L;YANG L;SUN X Research of methodologics to enlarge the isolation in 3D interconnection 200921.LEE Y J;HEALY M;LIM S K Routing optimization of multi-modal interconnects in 3D ICs 200922.SEKAR D;KING C;DANG B A 3D-IC technology with integrated microchannel cooling 200823.BEARDA T;TRAVALY Y;WOSTYN KPostdicing particle control for 3D stacked IC integration flows 2009名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 9 页，共 10 页 - - - - - - - - - 24.BEARDA T;MERTENS P W;HOLSTEYNS FThe effect of backside particles on substrate topography外文期刊 2005(10)25.廖凯 堆叠/3D封装的关键技术之一- 硅片减薄 2007(05)26.VEMPATI S R;SU N;KHONG C H Development of 3-D silicon die stacked package using flip chiptechnology with micro bump interconnects 200927.Yu A;KUMAR A;HO S W Development of fine pitch solder microbumps for 3D chip stacking 200828.TAKAHASHI K;UMEMOTO M;TANAKA NUltra-high-density interconnection technology of three-dimensionalpackaging 外文期刊 2003(08)29.TOMITA Y;MORIFUJI T;ANDO T Advanced packaging technologies on 3D stacked LSI utilizing the microinterconnections and the layered micro thin encapsulation 200130.TOPPER M;FISCHER T;ZANG MLow cost wafer-level 3-D integration without TSV 200931.KEIGLER A;LIU Z;CHIU J 优化的TSV 填充工艺降低成本 2009(z2)32.LASSING S;CORP L R穿透硅通孔刻蚀的制造综合考虑 2008(03)33.陆军 3D 封装 2005(04)本文链接： http:/ - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 10 页，共 10 页 - - - - - - - - -
