ALLEGRO中常见的DRC错误代码意思(19页).doc

-DRC错误代码代码相关对象说明单一字符代码LLine走线PPin元件脚VVia贯穿孔KKeep in/out允许区域/禁止区域CComponent元件层级EElectrical Constraint电气约束JT-Junction呈现T形的走线IIsland Form被Pin或Via围成的负片孤铜   错误代码前置码说明  WWire与走线相关的错误DDesign与整个电路板相关的错误MSoldemask与防焊层相关的错误   错误代码后置码说明  SShape/Stub与走线层的Shape或分支相关的错误NNot  Allowed与不允许的设置相关的错误WWidth与宽度相关的错误   双字符错误代码  BBBondpad to BondpadBondpad之间的错误BLBondpad to LineBondpad与Line之间的错误BSBondpad to ShapeBondpad与Shape 之间的错误CCPackage to PackagePackage之间的 Spacing 错误Symbol Soldermask to SymbolSoldermask零件防焊层之间的Spacing 错误DFDifferential Pair Length Tolerance差分对走线的长度误差过长Differential Pair Primary Max Separation差分对走线的主要距离太大Differential Pair Secondary Max Separation差分对走线的次要距离太大Differential Pair Secondary Max Length差分对走线的次要距离长度过长DIDesign Constraint Negative Plane Island负片孤铜的错误EDPropagation-Delay走线的长度错误Relative-Propagation-Delay走线的等长错误ELMax Exposed Length走线在外层（TOP&BOTTOM）的长度过长EPMax Net Parallelism Length-Distance Pair已超过Net之间的平行长度ESMax Stub Length走线的分支过长ETElectrical Topology走线连接方式的错误EVMax Via Count已超过走线使用的VIA的最大数目EXMax Crosstalk已超过Crosstalk值Max Peak Crosstalk已超过Peak Crosstalk值HHHold to Hold Spacing钻孔之间的距离太近HWDiagonal Wire to Hold Spacing斜线与钻孔之间的距离太近Hold to Orthogonal Wire Spacing钻孔与垂直/水平线之间的距离太近IMImpedance Constraint走线的阻抗值错误JNT Junction Not Allowed走线呈T形的错误KBRoute Keepin  to BondpadBondpad在Keepin之外Route keepout  to BondpadBondpad在keepout之内Via Keepout  to  BondpadBondpad在Via Keepout之内KCPackage to Place Keepin Spacing元件在Place Keepin之外Package to Place Keepout Spacing元件在Place Keepout之内KLLine to Route Keepin Spacing走线在Route Keepin之外Line to Route Keepout Spacing走线在Route Keepout之内KSShape to Route Keepin SpacingShape在Route Keepin之外Shape to Route Keepout SpacingShape在Route Keepout之内KVBBVia to Route Keepin SpacingBBVia在Route Keepin之外BBVia to Route Keepout SpacingBBVia在Route Keepout之内BBVia to Via Keepout SpacingBBVia在Via Keepout之内Test Via to Route Keepin SpacingTest Via在Route Keepin之外Test Via to Route Keepout SpacingTest Via在Route Keepout之内Test Via to Via Keepout SpacingTest Via在Via Keepout之内Through Via to Route Keepin SpacingThrough Via在Route Keepin之外Through Via to Route Keepout SpacingThrough Via在Route Keepout之内Through Via to Via Keepout SpacingThrough Via在Via Keepout之内LBMin Self Crossing Loopback Length无LLLine to Line Spacing走线之间太近LSLine to Shape Spacing走线与Shape 太近LWMin Line Width走线的宽度太细Min Neck Width走线变细的宽度太细MA Soldermask Alignment Error PadSoldermask Tolerance太小MCPin/Via Soldermask to Symbol SoldermaskPad与Symbol Soldermask之间的错误MMPin/Via Soldermask to Pin/Via SoldermaskPad  Soldermask之间的错误PBPin to BondpadPin与Bondpad之间的错误PLLine to SMD Pin Spacing走线与SMD元件脚太近Line to Test Pin Spacing走线与Test元件脚太近Line to Through Pin Spacing走线与Through元件脚太近PPSMD Pin to SMD Pin SpacingSMD元件脚与SMD元件脚太近SMD Pin to Test Pin SpacingSMD元件脚与Test元件脚太近Test Pin to Test Pin SpacingTest元件脚与Test元件脚太近Test Pin to Through Pin SpacingTest元件脚与Through元件脚太近Through Pin to SMD Pin SpacingThrough元件脚与SMD元件脚太近Through Pin to Through Pin SpacingThrough元件脚与Through元件脚太近PSShape to SMD Pin SpacingShape与SMD元件脚太近Shape to Test Pin SpacingShape与Test元件脚太近Through Pin to Shape SpacingThrough元件脚与Shape太近PVBBVia to SMD Pin SpacingBBVia与SMD元件脚太近BBVia to Test Pin SpacingBBVia与Test元件脚太近BBVia to Through Pin SpacingBBVia 与Through元件脚太近SMD Pin to Test Via SpacingSMD Pin与Test Via太近SMD Pin to Through Via SpacingSMD Pin与Through Via太近Test Pin to Test Via SpacingTest Pin与Test Via太近Test Pin to Through Via SpacingTest Pin与Through Via太近Test Via to Through Pin SpacingTest Via与Through Pin太近Through Pin to Through Via SpacingThrough Pin与Through Via太近RCPackage to Hard Room元件在其他的Room之内REMin Length Route End Segment at 135Degree无Min Length Route End Segment at 45/90Degree无 SB135Degree Turn to Adjacent Crossing Distance无90Degree Turn to Adjacent Crossing Distance无SLMin Length Wire Segment无Min Length Single Segment Wire无SNAllow on Etch Subclass允许在走线层上SOSegment Orientaion无BBBondpad to BondpadBondpad之间的错误SSShape to ShapeShape之间的错误TAMax Turn Angle无VBVia to BondpadVia 与Bondpad之间的错误VGMax BB Via Stagger Distance同一段线的BB Via之间的距离太长Min BB Via GapBB Via之间太近Min BB Via Stagger Distance同一段线的BB Via之间的距离太近Pad/Pad Direct ConnectPad 在另一个Pad 之上VLBB Via to Line SpacingBB Via与走线太近Line to Through Via Spacing走线与Through Via太近Line to Test Via Spacing走线与Test Via太近VSBB Via to Shape SpacingBB Via与Shape太近Shape to Test Via SpacingShape 与Test Via太近Shape to Through Via SpacingShape与Through Via太近VVBB Via to BB Via  SpacingBB Via之间太近BB Via to Test Via SpacingBB Via与Test Via太近BB Via to Through Via SpacingBB Via与Through Via太近Test Via to Test Via SpacingTest Via之间太近Test Via to Through Via SpacingTest Via与Through Via太近Through Via to Through Via SpacingThrough Via之间太近WAMin Bonding Wire LengthBonding Wire 长度太短WEMin End Segment Length无Min Length Wire End Segment at 135Degree无Min Length Wire End Segment at 45/90Degree无WIMax Bonding Wire LengthBonding Wire 长度太长WWDiagonal Wire to Diagonal Wire Spacing斜线之间太近Diagonal Wire to Orthogonal Wire Spacing斜线与垂直/水平线之间的距离太近Orthogonal Wire to Orthogonal Wire Spacing垂直/水平线之间的距离太近WXMax Number of Crossing无Min Distance between Crossing无XB135 Degree Turn to Adjacent Crossing Distance无90 Degree Turn to Adjacent Crossing Distance无XDExternally Determined Violation无XSCrossing to Adjacent Segment Distances无    第 20 页-