CADCAM培训教材(ppt66)(1).ppt
Edition:CKH/2002_1023 课堂守则课堂守则请将手机、请将手机、BP机等通讯工具调到震动状态。机等通讯工具调到震动状态。请勿在上课期间,随意进出,以免影响其他同事。请勿在上课期间,随意进出,以免影响其他同事。请勿交头接耳、大声喧哗。请勿交头接耳、大声喧哗。如有特殊事情,在征得培训导师的同意的情况下,如有特殊事情,在征得培训导师的同意的情况下,方可离场。方可离场。以上守则,各位学员共同遵守以上守则,各位学员共同遵守以上守则,各位学员共同遵守以上守则,各位学员共同遵守。以往以灯桌、笔刀、贴图及照相机做为制前工具,现在己被计算机、工作软件及激光绘图机所取代。过去,以手工排版,或者还需要Micro-Modifier来修正尺寸等费时耗工的作业,今天只要在CAM(Computer Aided Manufacturing)工作人员取得客户的设计资料,可能几小时内,就可以依设计规则或DFM(Design For Manufacturing)自动排版并变化不同的生产条件。同时可以output 如钻孔、成型、测试夹具等资料。这就是CAD/CAM的过程。首先来了解一下本公司PE部对客户资料是如何处理的。制前准备制前准备Table of ContentsPart I:PCB CAD/CAM Introduction(40 minutes)Customer Data CAD文件格式文件格式CAD/CAM 名词的定义与解说名词的定义与解说Laser Plotter&Developer&ArtworkDFM NetlistDRCPart II:CAD/CAM Process(20 minutes)Tooling Fabrication FlowchartInputPCB&Panel EditingDrill EditingOL&IL Editing Part I:PCB CAD/CAM Introduction客户必须提供的资料:电子厂或装配工厂,委托PCB SHOP生产空板(Bare Board)时,必须提供下列资料以供制作。见表料号资料表-供制前设计使用.客户资料客户资料项目内容格式1.资料P/N包含此P/N的版别、更改历史、日期以及发行资讯。和Drawing一起或另有一Text档。2.工程图A.P/N工程图:包括一些特殊要求,如原物料需求,特性阻抗控制、防焊油墨、文字种类、颜色、尺寸公差、层次等。HPGL及Post ScriptB.钻孔图此图通常标示孔位,孔径及孔符HPGL及Post ScriptC.成品外围图包含每一小片的位置、尺寸、折断边、工具孔相关规格、特殊符号以及特定制作流程和容差。HPGL及Post ScriptD.压板结构图包含各导体层,绝缘层厚度,阻抗厚度等。HPGL及Post Script3.菲林资料(Artwork DataA.线路层B.防焊层C.文字层Gerber(RS-274)4.Aperture List定义:各种pad的形状,一些特别的如thermal pads并须特别定义constructionText file文字档Customer Data客户资料客户资料项目内容格式5.钻孔资料定义:A.孔位置B.孔径及孔符C.孔类型(PTH&NPH)D.埋孔及盲孔层Excellon Format6.钻孔工具档定义:A.孔径B.电镀状态C.盲埋孔D.档名Text file文字档7.Netlist 资料定义线路的运通IPC-356 or其它从CAD输出之各种格式8.制作规范1.指明依据之国际规格,如IPC,MIL2.客户自己PCB进料规范3.特殊产品必须meet的规范如PCMCIAText file文字档客户资料客户资料上表资料是必备项目,有时客户会提供一片样品,一份零件图,一份保证书(保证制程中使用之原物料、耗料等不含某些有毒物质)等。这些额外资料,厂商须自行判断其重要性,以免误了商机。Customer DataArtwork FilmDrillDrawingNetlistCAM FormatGerber RS274DExcellon IHPGL 1IPC-D-356ODB+Gerber RS274XExcellon IIHPGL 2IPC-D-356AImageBarco DPFTrudrilAutoCAD DXFMentor NetlistPADS 2000SM 1000ATISM 3000Hitachi CAD/CAM 文件格式文件格式相关相关CAD/CAM名词的定义与解说名词的定义与解说 A Gerber file这是一个从PCBCAD软件输出的资料文件做为光绘图语言。1960年代一家名叫GerberScientific(现在叫GerberSystem)专业做绘图机的美国公司所发展出的格式,尔后40年,行销于世界多个国家。几乎所有CAD系统的发展,也都依此格式作其OutputData,直接输入绘图机就可绘出Drawing或Film,因此GerberFormat成了电子业界的公认标准。CAD/CAM名词的定义与解说名词的定义与解说B.RS-274DGerberFormat的正式名称,正确称呼是EIASTANDARDRS-274D(ElectronicIndustriesAssociation)主要两大组成:1.FunctionCode:如Gcodes,Dcodes,Mcodes等。2.Coordinatedata:定义图像(imaging)RS-274D&RS-274XC.RS-274X 是RS-274D的延伸版本,除RS-274D之Code 以外,包括RS-274X Parameters,或称整个extended Gerber format 它以两个字母为组合,定义了Aperture及XYCoordinate.D.ODB+ODB+是 Orbotech/Frontline 发展出来的一套CADCAMformat,可以很容易由PCB CAD/CAM产生,然后依此系统,PCB SHOP 再产生ArtworkFilmNC Drill Program,Netlist,并可直接输入Laser Plotter绘制底片.ODB+Aperture 镜头孔径镜头孔径Gerber资料资料代表意义代表意义X002Y002D02*移至(0.2,0.2)快门开关D11*选择选择Aperture2D03*闪现所选择ApertureD10*选择选择Aperture1X002Y0084D01*移至(0.2,0.84)快门开关D11*选择选择Aperture2D03*闪现所选择ApertureD10*选择选择Aperture1X0104Y0084D01*移至(1.04,0.48)快门开关D11*选择选择Aperture2D03*闪现所选择ApertureD12*选择选择Aperture3X0104Y0048D02*移至(1.04,0.48)快门开关D03*闪现所选择ApertureX0064Y0048D02*移至(0.64,0.48)快门开关D03*闪现所选择ApertureAperture TableDcodeShapeSizeD10Round5D11SMD50 x 100D12Donut100-70Gerber+ApertureGerber+Aperture将将PCB文件转换为文件转换为GERBER文件和钻孔数据后文件和钻孔数据后交交PCB厂制板的原因厂制板的原因大多数工程师都习惯于将PCB文件设计好件转换为GERBER文件和钻孔数据后交PCB厂,为何不直接把文件设计好后直接送PCB厂加工呢?因为电子工程师和PCB工程师对PCB的理解不一样,由PCB工厂转换出来的GERBER文件可能不是您所要的,如您在设计时将元件的参数都定义在PCB文件中,您又不想让这些参数显示在PCB成品上,您未作说明,PCB厂依葫芦画瓢将这些参数都留在了PCB成品上。这只是一个例子。若您自己将PCB文件转换成GERBER文件就可避免此类事件发生。GERBER文件是一种国际标准的光绘格式文件,它包含RS-274-D和RS-274-X两种格式,其中RS-274-D称为基本GERBER格式,并要同时附带D码文件才能完整描述一张图形;RS-274-X称为扩展GERBER格式,它本身包含有D码信息。常用的CAD软件都能生成此二种格式文件。底片与程序:底片Artwork在CAM系统编辑排版完成后,配合D-Code档案,而由镭射绘图机(LaserPlotter)绘出底片。所须绘制的底片有内外层之线路,外层之防焊,以及文字底片。由于线路密度愈来愈高,公差要求越来越严谨,因此底片尺寸控制,是目前很多PCB厂的一大课题。下表是传统底片与玻璃底片的比较表。玻璃底片使用比例已有提高趋势。而底片制造商亦积极研究替代材料,以使尺寸之安定性更好。例如干式做法的铋金属底片.Artwork传统工作底片玻璃底片尺寸安定性最易受温度和相对湿度影响几乎不受相对湿度影响,且温度效应为传统底片的一半。耐用性基材易起趋纹且封位孔易受磨损易破碎,但不易起趋纹操作/储存/运送较轻且具柔软性容易运送及储存较重,需小心防碎,要注意储存运送空间,并注意其重量。使用于一般的曝光 适用于所有曝光设备需调整设备或特殊设备。绘图机适于一般自动化处理机 碟式或特殊平板处理机。价格便宜贵Artwork显影定影水洗烘干菲林冲片机菲林冲片机一般在保存以及使用传统底片应注意事项如下:1).环境的温度(223C)与相对湿度(55 5%)的控制 2).全新底片取出使用的前置适应时间(min.24 hrs)3).取用、传递以及保存方式4).置放或操作区域的清洁度底片环境控制Future Trend:LDILaser Direct ImagingDRCDesign Rule Check(DRC):设计规则设计规则检查检查主要检查客户设计是否符合设计者所制定的规则,同时也需确认所制定的规则是否符合印制板生产工艺的需求,一般检查有如下几个方面:线与线,线与元件焊盘,线与贯通孔,元件焊盘与贯通孔,贯通孔与贯通孔之间的距离是否合理,是否满足生产要求。电源线和地线的宽度是否合适,电源与地线之间是否紧耦合(低的波阻抗)?在PCB中是否还有能让地线加宽的地方。加在PCB中的图形(如图标、注标)是否会造成信号短路。在PCB上是否加有工艺线?阻焊是否符合生产工艺的要求,阻焊尺寸是否合适,字符标志是否压在器件焊盘上,以免影响电装质量。多层板中的电源地层的外框边缘是否缩小,如电源地层的铜箔露出板外容易造成短路。Manufacturing AnalysisDFMDesignformanufacturing(加工设计/为制造着想的设计)Pcblay-out工程师大半不太了解,PCB制作流程以及各制程需要注意的事项,所以在Lay-out线路时,仅考虑电性、逻辑、尺寸等,而甚少顾及其它。PCB制前设计工程师因此必须从生产力,优良率等考量而修正一些线路特性,如圆形接线PAD修正成泪滴状,见图2.5,为的是制程中PAD一孔对位不准时,尚能维持最小的垫环宽度 DFMDFMMinimumPadSize=a+2b+cWhere:a=Maximumfinishedholediameterb=Minimumannularringrequirementsc=AstandardfabricationallowanceIPC-2221-9.1.1)Maximized Land KeyHolingFilletingCornerEntryNotPreferablePreferable(IPC-2221-9-1)Level AGeneral Design Complexity Preferred0.4 mm16 milLevel BModerate Design Complexity Standard0.25 mm10 milLevel CHigh Design Complexity Reduced0.2 mm8 milMinimum Standard Fabrication AllowanceNotPreferablePreferableLand(Pad)RequirementsIn order to meet annular ring requirement particularlywhilebreakoutisnotdesirable,thepadsizerequirementshallbedeterminedbythefollowingequation:Exampleoflandsizecalculation:Given:4layer,1ozbaseCu,LevelBFinishedholesize=133milMax.finishedholesize=16milMin.annularring=2milFabricationallowance=10milMinimumlandsize=16+2(2)+10=30mil1Forcopperweightgreaterthan1oz/sq.ft,add2milminimumtocforeachadditionaloz/sq.ft.ofcopperused.2.Formorethan8layersadd2mil(IPC-2221-9.1.1)DFMNPTH Wall To Copper RequirementPTH Wall To Copper RequirementInordertoimproveyield,PTHwalltocopperspacingforinnerlayershouldbekeptatminimum13mil.This13milisthealignmentallowanceforpressing,drillingandfilmregistration.NPTH wall to copper spacing should be designedpreferablyatminimum10mil.Thisallowanceisparticularnecessarytoensuredryfilmhasenoughbondingareatoadhere on the pcb.The purpose of covering NPTH holewithdryfilmistoavoidtheholetobeplated.Inner Layer Opening RequirementDuetoprocessallowance,innerlayerclearanceonpowerorgroundlayershouldbedesignedpreferablywithatleast10milclearance.DrilledHoleOpeningClearanceCu(Minimum10mil)Hole To Hole Spaces RequirementConductor Widths&Spaces RequirementConductor widths and spaces shall be maximizedwheneverfeasible.Inordertomaintaintheconductorwidths and spaces specified on the master drawing,conductorwidthsandspacesontheproductionmastershouldbecompensatedforetchingprocessallowance.Cu WeightMin.LW/LSInner LayerHoz 1oz3mil/3mil 3mil/3milOuter LayerHoz1oz2oz4mil/4mil5mil/5mil6mil/6milRedArea:CompensateforetchingallowanceInordertoimproveyieldinDesmearprocess,drilledholeedgetodrilledholeedgespacesshallbedesignedwithatleast11mildistanceinbetween.11milPlease see below table for Viasystems drilled hole sizecalculation:DrilledSizeCalculationforPTHDrilledHoleHole SizeDrilled Size +A D -BHALGold Plating/EntekImmersion GoldD+(A-B)/2+6 milD+(A-B)/2+4 mil DrilledSizeCalculationforNPTHHole SizeDrilled Size +A D -BD+(A+B)/2,Choose the nearest bigger drill bit stepForD=X.YZmmIFDrillBitSize3Z0X.Y07Z3X.Y510Z7X.(Y+1)0DrillBitSizeSelectionPlease see below table for Viasystems minimumconductor widths and spaces requirements on customerdesign.DFMDFM Sample FileDFM Sample File Genesis DFM但是制前工程师的修正,有时却会影响客户产品的特性甚或性能,所以不得不谨慎。PCB厂必须有一套针对厂内制程上的特性而编辑的规范除了改善产品优良率以及提升生产力外,也可做为和PCB线路Lay-out人员的沟通语言,见图.DFMAOI程序设计由CAD/CAM直接产生CADreference文件。AOI系统可直接讀取文件.比以往使用金板製作程式更準確。AOIA Net is a set of contiguous points connected by a conductive path.All the points in a net are electrically connected through traces and plated drills on the printed circuit board.What is a net?A Netlist is a list of nets stored in a data file which define the conductivity inter-connection scheme of a bare circuit board.What is a Netlist?A netlist is a list of nets stored in data file which define theconductivity interconnection scheme of a bare circuit board.Comparisonofcustomernetlistwiththegraphicaldataisimperativetoensure design integrity is being maintained during editing stages.Netlistprovidedbycustomershouldbebareboardnetlist.Accepted Formats:IPC-D-356IPC-D-356AMentorNetlist InformationCIPC-D-356BareBoardElectricalTestInformationCBasedontheIPC-D-356documentCAssumptions:1)Allpointsareassumedtobeendpoints.CColumn32willthenalwaysbeblank.317+42VAL1-5C317GNDAL1-5E317NCABSIGN1A-10A317N/CSIGN1A-5B317CKHSIGN1A-7B367MountingHoleTool-1.999D0280PA00X-015850Y+029075X0480Y0480R000S0D0280PA00X-015850Y+030650X0480Y0480R000S0D0280PA00X-024413Y+027500X0480Y0480R000S0D0280PA00X-028350Y+028287X0480Y0480R000S0D0280PA00X-026776Y+028287X0480Y0480R000S0D1250UA00X+000000Y+000000X1250Y1250R000S3Sample IPC-D-356 Test FileTheformatinsuppliedIPC-D-356andIPC-D-356AshouldcomplieswiththedescriptionoftheIPC-D-356specification.Sample IPC-D-356A Test FileP JOB P023003A.ipcP UNITS CUSTP TITLE P023003A.ipcP NUM 23003P REV 300P VER IPC-D-356AP IMAGE PRIMARYC367 -D1970UA00X-001590Y+055374X1970Y0000 S0367 -D1970UA00X-001583Y+001438X1970Y0000 S0327NET1 -M A01X-002235Y+037065X0150Y0000 S1327NET1 -M A01X-002235Y+037235X0150Y0000 S1317NET1 -M A01X-002150Y+037150X0250Y0000 S1017NET1 -MD0160PA00X-002150Y+037150327NET1 -M A02X-002150Y+037150X0135Y0000 S0317NET1 -M A02X-002150Y+037150X0250Y0000 S2017NET1 -MD0160PA00X-002150Y+037150327NET2 -M A02X+040700Y+035450X0135Y0000 S0317NET2 -M A02X+040700Y+035450X0250Y0000 S2017NET2 -MD0160PA00X+040700Y+035450327NET2 -A01X+040735Y+031350X0380Y0310 S0327NET2 -M A01X+040818Y+035425X0150Y0000 S1327NET2 -M A01X+040820Y+035450X0150Y0000 S1078 X28671 X28748Y5845 X29898 X30245Y5498 Y5198 X30498Y4945 X31053 X31305Y5198078 Y6597 X31503Y6795 X36998 X37245Y6548 Y4398 X37395Y4248 Y2753 X37048Y2405078 X36503 X35805Y3103 Y3703 X35553Y3955 X33998 X33698Y3655 X32447 X31698Y2905078 X29248 X28748Y2405 X26253 X26055Y2603 Y5317 X26918 X27083Y5483 Y5718078 X26918Y5883 X26175 Y6018 X27153Y6995 X28298999IPC-D-356 与与 IPC-D-356A 的分别的分别Aswith356,356Acarriesinformationrequiredforelectricaltest:Location,size,andaccessibilityofpadsandholesontheboard.Netlistinformation,showingwhatpadsandholesshouldbeonthesamenet.Headerinformationgivingthenameandrevisionoftheboard,andsoforth.IPC-D-356Aaddsconsiderableinformation:Locationandwidthofconductors.Listofnetswhichareadjacenttoeachother.(Thisshowswhereshortsarelikely.)Actualtestprobelocations,asopposedtojustthelocationofthepad.Thesize,shape,andlocationofthesoldermaskopenings,independentofthepad.Supportforblindandburiedvias.Longernetnames(upto57characters)areallowed.Supportforburiedresistance.Avarietyofnon-testfeatures,suchasfailmarks.Theboardoutline.Supportforhighvoltagetests.Supportforimpedancetests.Supportforsteppedimages.IPC-D-356Aalsochangesthehandlingofsomeinformationfrom356:In356A,therearestringentrequirementsfortheorderofdatainthefile.IPC-D-356doesnothavetheserequirements.IPC-D-356supportsanoptionalvariablerecordformat.Supportforthisformathasbeendroppedin356A.IPC-D-356usesfixed-columnrecords.Trailingspacesmustbeincludedinthefile.IPC-D-356Aallowstrailingspacestobeleftoutoftherecord.IPC-D-356wasunclearonhowrecordsshouldbeterminated,resultinginavarietyofapproachesbyfilewriters.IPC-D-356AmandatesthatrecordsbeterminatedbyaCR/LFpair.Theresultisthat356Afilesaremuchmorepowerfulthan356files,butareeasiertoreadthan356files.IPC-D-356Afilesareinmanyrespectseasiertowritethan356files,althoughthesortingrequirementsof356Amayaddcomplexitytoawriter.Onbalance,however,356Afilesarealsoeasiertowritethan356files.#date:Monday June 2,1997;18:46:15#Board Information#BOARD SYSTEST_BOARD OFFSET x:0.0 y:0.0 ORIENTATION 0B_UNITS Inches#Attribute Information#B_ATTR MILLING_ORIGIN MILLING 0 0.0 0-0.4-4.0B_ATTR DRILL_ORIGIN 0.0 0.0B_ATTR BOARD_DEFINITION_IDENTIFIER 0 0.#Nets Information#NET/+8VTO10VCOMP C1 PN-150uFCAP 150uFCAP cl23_d5-0.2-2.0 1 0C_PIN C1-1-0.2-2.0 0 1 0 term_1/N$577C_PIN C1-2 0.6-2.0 0 1 0 term_1 GROUND.#Hole Information#HOLE PTH-0.2-3.8 0.093HOLE PTH-0.2-1.2 0.093HOLE PTH 3.9-1.2 0.093#Pad Information#PAD VIA VIA_1 Thru 0.03P_SHAPE VIA_1 PHYSICAL_1 CIRCLE 0.05P_SHAPE VIA_1 PHYSICAL_2 CIRCLE 0.05.GenesisManual,0403.1199,pg42,43Sample Mentor File指ETest电测Netlist档.由CAD/CAM产生ET系统可接受的资料,而电测Netlist档则用来制作电测治具Fixture。Electrical TestPart II:CAD/CAM ProcessDrillDataInnerLayerRoutS/MC/MOuterLayerETInputDRC(CAMChecking)Tooling Fabrication FlowchartNoCustomerFabricationPackage1stInput(Engineer)2ndInput(Supervisor)CompareTwoInputResults(D-code,Layers&Report)ResultAnalysisDiscrepancyOccursNoDiscrepancyInputErrorNotifyMIGroupCustomerDataErrorIfCustomerNetlistExist?GenerateCADNetlistConvertCADNetlistToReferenceNetlistForFilmFabricationReferenceCompareCustomerNetlistwithGeneratedCADNetlistNoDiscrepancyDiscrepancyOccursResultAnalysisCustomerNetlistErrorConvertGeneratedCADNetlistToReferenceNetlistForFilmFabricationReferenceNotifyMIGroupToRequestNetlistFromCustomerYesNoRedoInputInputErrorInput FlowchartInput多层板时,若客户资料中无表示Thermal 的字符时,需高度注意,部分客户的Thermal Aperture与Circle,Round同名,只是在文件头中Power一项设置为True,则此时需把这种Circle Input为Thermal。若两种情况都无,则需查清是否内层中孔与GND直接相连。客户给出Spuare或Rectangle一项中,将会分X、Y。X表示水平,Y则表示坚直方向。Input时需以此为依据,若客户无标明及相关说明则检查图像中是否有SMD全部重叠在一条直线上,若有则表示X、Y颠倒,需更正。客户设计中如有0mil Aperture时,需确定这些Aperture代表内容,如为相关蚀字或白字,则需加到56 mil,供MI参考,并提示出来。Input注意事项注意事项CAM CheckingP2LL2PT2CL2L/P*SLOT长大于等于宽两倍时,总长加2mil;长小于宽两倍时加3mil并加补偿。*为避免尾孔钻出板外,切记尾孔最大孔孔壁距UNIT板边70mil。*做完钻带必须优化。*检查Template须逐一检查MI所有关于孔的标数、Size,并用红胶片一个单元去拍其它单元检查是否少孔或多孔。DrillPCBEDITING1、EDITING通过CAD/CAMWORKSTATION加菲林制作补偿数据(参考MEI-025和MI)2、取消标记-角位标记取消所有沿外围上的标记-NON-PTH取消所有NPTH上的标记3、加标记-内部需要加DATECODE,LOGOULMARK,参照MI的要求-客户需要在MI指定位置加特殊标记,参照客户的SPECPCB EditingPanel EditingPNL板边注意事项板边注意事项1.外层Breakaway上加Dummy Pad应避开加钻孔、绿油窗、V-坑线3050mil。2.有镀金手指板板边注意镀金引线一定要与PNL板边相连。但把PCB打开时,镀金引线不能与PNL板边Cu皮重叠。3.多层板内层板边需加上自动日期块及拉长比例块。外层板边还需加上客户名称。板边型号要与MI Tooling编号一致。4.特别注意板边Cu皮要距Unit 50mil min。5.外层板边电镀面积要以切板后尺寸来计算。6.加板边字符时应注意打开尾孔以免字入尾孔造成菲林碎。7.对于V坑管位孔、重钻管位孔要加挡油,挡光Pad比孔每边大 1015mil。绿油入孔会造成V坑偏位。8.加完板边要重新检查一次有无负的线和Pad在PNL中。EDIT 内层注意问题内层注意问题1.分清Lay up结构不可颠倒。检查Power GND短路情况。2.PCB内Cu皮距板边要削至1520mil啤锣,且距V坑Rout边20mil Clearance。3.Breakaway上加铜皮注意掏空NPTH孔。4.外层有Fiducial时,对应处内层Dummy Cu皮应避开不加。5.当客户对Dummy区域有要求时,一定要按尺寸加Dummy。6.如MI上有在Breakaway上锣出半个锣刀位时,注意避开个锣刀位处加Dummy。7.内层分隔线小于4mil时,需加粗至4mil以上,并提示MI组。8.检查有无孔距内层分隔线很近且容易造成孔钻断分割线造成短路情况。9.检查有无Spacing太小而造成局部地区断路情况。10.Intel主机板内层,注意客户Clearance Follow原装,不可改动。此外削内层板边Cu 皮应注意外层阻抗线必须在内层Cu皮范围内。11.内层独立线应依据其底铜。方法如下:H/HOZ底CU正常线粗加大+0.8mil1/1OZ底CU正常线粗加大+1.0mil2/2OZ底CU正常线粗加大+1.5milInner LayerEDIT外层注意事项外层注意事项1.按MI要求加大最小线线粗,其它所有线均须考虑Etch Factor在Spacing允许情况下,同最小线粗加同样的补偿。2.取消NPTH孔对应Pad,不可遗漏,除MI特别指示外。3.外层Breakaway上加Dummy Pad应避开加钻孔、绿油窗、V-坑线3050mil。4.PCB内有镀金手指时,一定要加假手指,PCB金手指两端各一个,并为其加开绿油窗。注意镀金引线要避开加钻孔、Slot或二钻孔,并且要与板边相连接。5.小于4mil间隙(非功能性)需填实。在Valor机内可用Sliver,Pinhole两种功能填实。6.加粗客户菲林上蚀字时,要依据底铜度及客户本身字粗来调整,但同时应考虑字与字之间的Spacing。加粗规则如下:底铜厚 客设计线粗(mil)加粗数量(mil)HOZ48129120.511OZ4823912122OZ4824912127.若底铜2OZ,KALEXlogo线粗需按以上要求修正。8.加粗SMD pad,如能保证SMD间距7mil以上均加大1.52mil,考虑绿油狗棍。Outer LayerS/M&C/M对于客设计线路Pad与绿油窗等大时,客意图应为不允许渗油上Pad,对于客设计绿油窗小于线路Pad又大于孔径时,客意图应为可渗油上Pad,不允许入孔或允许最大6mil Ring状态。如客无绿油窗应理解作盖油孔或允许塞孔。为避免渗油上Pad,一般谷大绿油窗每边12mil。但切记GND绿油窗不可谷大。IC位SMD绿油窗如要求做出4mil最小狗