QFN封装工艺课件.ppt
QFNPACKAGING封裝技術簡介QUAD FLAT NO-LEAD PACKAGEQUAD FLAT NO-LEAD PACKAGE1 I IC C封裝趨勢封裝趨勢 QFN&BGAQFN&BGA封裝封裝外觀外觀尺寸尺寸 QFN&BGAQFN&BGA封裝流程封裝流程 I IC C封裝材料封裝材料 三種三種封裝封裝代表性工藝介紹代表性工藝介紹 QFNQFN封裝封裝的的可靠度可靠度 結論結論目目 錄錄2根據摩爾第一定律，芯片的集成度每根據摩爾第一定律，芯片的集成度每1818個月個月提高一倍，而價格下降提高一倍，而價格下降 5050，產品的，產品的生命周期僅生命周期僅2.532.53年年這就決定了集成電路行業需要大量的資金這就決定了集成電路行業需要大量的資金和研發投入，半導體封裝產業已經邁入所謂成熟期。和研發投入，半導體封裝產業已經邁入所謂成熟期。根據天下雜誌根據天下雜誌20022002的的100100大企業調查，企業平均獲利水準約在大企業調查，企業平均獲利水準約在1.3%1.3%，創下十七年來的最低，正式宣告微利化時代的來臨。一般在開始規模，創下十七年來的最低，正式宣告微利化時代的來臨。一般在開始規模約在約在5050部銲線機，其投資額部銲線機，其投資額約在十億左右約在十億左右(含廠房與設施含廠房與設施)。產品從雙。產品從雙排腳到平面四面腳排腳到平面四面腳/膠帶線膠帶線/球陣列球陣列/影像感應影像感應/薄膜晶體，因大部份同質薄膜晶體，因大部份同質性均高，造成價格互相之間的排擠效應。性均高，造成價格互相之間的排擠效應。而數個集團如安可、日月光、矽品，亦夾其大公司、資本雄厚的優勢，試圖合併其他較小的公司，以利其價格之主宰。同時大公司亦佔有量大的優勢，故與廠商的議價能力相當高，如日月光可依據價格自由選擇廠商或更換廠商。而與購買者議價能力，則受幾家大廠的殺價狀況所影響，致使購買者的轉換成本加大。而未來低腳數球陣列產品亦漸漸被QFN產品所取代。QFN封裝趨勢封裝趨勢3摩爾定律摩爾定律摩爾定律是指：IC上可容納的電晶體數目，約每隔18個月便會增加一倍，性能也將提升一倍。摩爾定律是由英特爾(Intel)名譽董事長摩爾經過長期觀察發現得之。摩爾定律是指一個尺寸相同的晶片上，所容納的電晶體數量，因製程技術的提升，每十八個月會加倍，但售價相同；晶片的容量是以電晶體（Transistor）的數量多寡來計算，電晶體愈多則晶片執行運算的速度愈快，當然，所需要的生產技術愈高明。若在相同面積的晶圓下生產同樣規格的IC，隨著製程技術的進步，每隔一年半，IC產出量就可增加一倍，換算為成本，即每隔一年半成本可降低五成，平均每年成本可降低三成多。就摩爾定律延伸，IC技術每隔一年半推進一個世代。摩爾定律是簡單評估半導體技術進展的經驗法則，其重要的意義在於長期而，IC製程技術是以一直線的方式向前推展，使得IC產品能持續降低成本，提升性能，增加功能。台積電董事長張忠謀先生曾表示，摩爾定律在過去30年相當有效，未來1015年應依然適用。4TrendofTrendof AssemblyAssembly封裝趨勢封裝趨勢圖圖CSP&QFNCSP&QFN56產品演進圖片TSOPQFNQFNBGABGATSOPQFNQFNBGABGA7QQF FNN封裝封裝外觀外觀尺寸尺寸8DieDieSubstrate(BT laminate)Substrate(BT laminate)Solder ballSolder ballA AB BC CD DE EminiBGACrosssectionminiBGACrosssection小型小型BGABGA截面圖截面圖F FminiBGAminiBGA(BallGridArrayBallGridArray球閘陣列封裝球閘陣列封裝)9CuringCuring(for epoxy)(for epoxy)Die BondDie BondDie SawDie SawWire BondWire BondDie CoatingDie Coating(Optional)(Optional)O/STestO/STest(Optional)(Optional)FormingFormingDe-tapingDe-taping(Optional)(Optional)GrindingGrinding(Optional)(Optional)TapingTaping(Optional)(Optional)WaferWaferMountMountUV curingUV curing(Optional)(Optional)CuringCuring(for ink)(for ink)Back MarkingBack Marking(Optional)(Optional)MoldingMoldingTrimmingTrimmingPLATEPLATEPost MoldPost MoldCuringCuringLeadframe TypeLeadframe Type Standard Cycle Time:3.5 days Standard Cycle Time:3.5 daysQFNQFN封裝流程封裝流程Packing&Packing&DeliveryDelivery10Wafer GrindingWafer GrindingWafer MountWafer MountDie SawDie SawDie BondDie Bond1 1st Plasma Cleanst Plasma CleanWire BondWire BondMoldingMolding2 2nd Plasma Cleannd Plasma CleanPost Mold CurePost Mold CureMarkingMarkingBall MountBall MountPackage SawPackage SawFinal Visual InspectionFinal Visual InspectionPackingPackingPackage MountPackage MountPick&Place Pick&Place miniBGAminiBGA Standard Cycle Time:5 days Standard Cycle Time:5 daysminiBGAminiBGA封裝流程封裝流程11Molding compoundMolding compoundGold wireGold wireEpoxy(Silver paste)Epoxy(Silver paste)GoldGoldSnSnEpoxy compoundEpoxy compoundLeadframeLeadframeCopper/AlloyCopper/AlloyI IC C封裝材料封裝材料SubstrateSubstrateSolder ballsSolder ballsBT ResinBT ResinSolder AlloySolder Alloy12ChipChipSubstrateSubstrateChipChipSubstrateSubstrateChipChipSubstrateSubstrateUnderfillUnderfillEncapsulantEncapsulant(a)System without underfill(a)System without underfill(b)System underfill(b)System underfill(c)System encapsulated(c)System encapsulatedSolder flip chip interconnect systemsSolder flip chip interconnect systems晶片晶片錫球錫球PCBPCB載板載板13Silicon ChipSilicon ChipFilled Epoxy EncapsulantFilled Epoxy EncapsulantFR-4 CarrierFR-4 CarrierSolder flip chip interconnect systemsSolder flip chip interconnect systems14 ConventionalConventional LeadframeTypeLeadframeType(PDIP,SOP,TSOP,QFP)(PDIP,SOP,TSOP,QFP)傳統傳統封裝（導綫架型）封裝（導綫架型）AdvancedAdvanced SubstrateTypeSubstrateType(BGA)(BGA)高級高級-基片型封裝基片型封裝MoldingcompoundMoldingcompound膠體膠體LeadframeLeadframe導綫架導綫架GoldwireGoldwire金綫金綫DieDie晶片晶片Epoxy(Silverpaste)Epoxy(Silverpaste)環氧樹脂（銀膠）環氧樹脂（銀膠）DieattachpadDieattachpad貼貼DieDie墊墊MoldingcompoundMoldingcompound模壓膠體模壓膠體Epoxy(SilverEpoxy(Silverpaste)paste)銀膠銀膠DieDie晶片晶片GoldwireGoldwire金綫金綫SolderballSolderball錫球錫球BTresinBTresin樹脂基片樹脂基片ThroughholeThroughhole貫穿孔貫穿孔DieDie晶片晶片GoldwireGoldwire金綫金綫LOCtapeLOCLOCtapeLOC膠帶膠帶LeadframewithDown-setLeadframewithDown-set導綫架下置導綫架下置LOC(Lead-on-chip)LOC(Lead-on-chip)導綫架上置導綫架上置PackageTypesandApplicationsPackageTypesandApplications封裝類型及應用封裝類型及應用15Stacked wiringStacked wiringMulti-layerMulti-layer1 1stst bond bond WireBondingExamplesWireBondingExamples焊綫焊綫視圖視圖16LeadbondingonchipLeadbondingonchip引腳引腳焊在焊在晶片上晶片上SolderbondsonchipSolderbondsonchip錫球植在晶片錫球植在晶片上上ConnectionExamplesConnectionExamples接綫舉例接綫舉例17Epoxy compoundEpoxy compound 流動模擬圖流動模擬圖流動模擬圖流動模擬圖 1 118Epoxy compoundEpoxy compound 流動模擬圖流動模擬圖流動模擬圖流動模擬圖 2 219Epoxy compoundEpoxy compound 流動模擬圖流動模擬圖流動模擬圖流動模擬圖 3 3202023/2/2可编辑修改21Epoxy compoundEpoxy compound 流動模擬圖流動模擬圖流動模擬圖流動模擬圖 4 422Wafer back-side grindingWafer back-side grindingDie sawingDie sawingEpoxy pasteEpoxy pasteDie attachDie attachWire bondingWire bondingMoldingMolding傳統傳統 ICPACKAGEICPACKAGE工藝一工藝一23Back-side Marking(Laser/ink)Back-side Marking(Laser/ink)ABCWorldLeadingWaferFABTrimmingTrimmingSolder platingSolder platingFormingForming傳統傳統 ICPACKAGEICPACKAGE工藝二工藝二24MarkingMarkingABCWorld Leading Wafer FABABCWorld Leading Wafer FABABCWorld Leading Wafer FABABCWorld Leading Wafer FABFlux PrintingFlux PrintingVacuumVacuumBall AttachBall AttachReflowReflowBGAPACKAGEBGAPACKAGE工藝一工藝一25SingulationSingulationSaw SingulationSaw SingulationRouterRouterABC27 DecABC27 DecABC27 DecABC27 DecPunchPunchBGAPACKAGEBGAPACKAGE工藝二工藝二26Back-side Marking(Laser/ink)Back-side Marking(Laser/ink)QFNPACKAGEQFNPACKAGE工藝工藝ABCWorld Leading Wafer FABSolder platingSolder platingFormingForming27MountingMethodswiththePCBMountingMethodswiththePCB與與PCBPCB的銜接方式的銜接方式1.1.Pin-through-holePin-through-hole(SIP,DIP)(SIP,DIP)2.2.SurfaceMountTechnologySurfaceMountTechnology(TSOP,(TSOP,插件方式插件方式 QFP,BGA)QFP,BGA)貼片方式貼片方式LeadDistributionsLeadDistributions引腳分佈引腳分佈1.1.SingleSingle(SIP)(SIP)2.2.DualDual(TSOP)(TSOP)3.3.QuadQuad(QFP)(QFP)4.4.BGABGA單列單列雙列雙列四列四列矩陣矩陣PackageLeadPCBMountingMethodswiththePCBMountingMethodswiththePCB與與PCBPCB的銜接方式的銜接方式QFNQFN28QFNQFN封裝封裝品質的品質的可靠度可靠度ASM JEDEC MO-220 QFN PackageASM JEDEC MO-220 QFN PackageJEDEC是电子工业联盟的半导体工程标准化组织29QFNQFN封裝封裝品質的品質的可靠度可靠度30QFNQFN封裝封裝品質的品質的可靠度可靠度31QFNQFN封裝封裝品質的品質的可靠度可靠度32結結論論為什麼一定要發展QFN呢?33省材料成本省材料成本(傳統工藝可達成傳統工藝可達成)34省材料成本省材料成本(傳統工藝可達成傳統工藝可達成)35QFN(QFN(省料省料)36節省廠房投資與機器設備節省廠房投資與機器設備37晶圓級的晶圓級的晶圓級的晶圓級的QFNQFN38END392023/2/2可编辑修改40
