工艺整合工程师岗位职责3篇.docx

工艺整合工程师岗位职责3篇【第1篇】半导体工艺整合工程师岗位职责 岗位职责:1.射频半导体工艺持续改进:性能提升、良率提升;2.半导体工艺相关的失效分析及解决方案验证。任职要求:1.深厚的半导体材料、器件、工艺背景知识。2.有cmossoi工艺或gaasinpgan工艺的开发工作经验,熟悉半导体生产各道工艺的流程和运作机理。3.深刻理解fethbtphemt等器件的工作机理,具有失效分析、器件性能改进和良率提升的能力。4.了解半导体工厂的运行流程,具有较强的向外沟通和组织能力。 【第2篇】工艺整合工程师岗位职责任职要求 工艺整合工程师岗位职责 职责描述: 1. 负责40/28nm cmos逻辑、mram器件性能分析和优化; 2. 负责40/28nm cmos逻辑，mram器件的可靠性问题分析，包括对失效模型的分析，并给出解决方案; 3. 与代工厂协同工作，设计40/28nm cmos、mram有关的testkey，并对器件进行失效分析; 任职要求: 1.微电子及相关专业硕士以上学历; 2.五年以上半导体器件开发经验，精通cmos器件性能与可靠性优化和测试;(有存储芯片研发经验者优先) 3.熟练掌握半导体芯片开发流程和方法; 4.有sram或嵌入式nvm经验及与代工厂合作经验者优先; 5.具有良好的工作协调能力，沟通能力和团队精神。良好的文档编辑与处理能力。 工艺整合工程师岗位 【第3篇】工艺整合工程师岗位职责 工艺整合工程师 job description: new technology development and new products ramp-up in fab. mass production yield maintenance and continuous improvement. interfaces with business units, atd, process modules, quality, manufacturing, a/t sites for problem solving, cost reduction, productivity and process robustness. basic qualifications: -2019 bachelor degree or above; microelectronics/electronics/material/chemistry/physics or equivalent; -candidates with semiconductor wafer fabrication experience are preferred; -good ownership and accountability; -good team player; -fluent in english-written and verbal. job description: new technology development and new products ramp-up in fab. mass production yield maintenance and continuous improvement. interfaces with business units, atd, process modules, quality, manufacturing, a/t sites for problem solving, cost reduction, productivity and process robustness. basic qualifications: -2019 bachelor degree or above; microelectronics/electronics/material/chemistry/physics or equivalent; -candidates with semiconductor wafer fabrication experience are preferred; -good ownership and accountability; -good team player; -fluent in english-written and verbal.3