2835 03W 3芯暖白串联规格书(26-30LM).doc
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2835 03W 3芯暖白串联规格书(26-30LM).doc
广州市新弘茂光源科技有限公司 廣東省廣州市荔灣區芳村東沙荷景路9號（東朗工業園）2棟201 電話:+86-20-81402798 81414708 傳真:81402027 E-mail:xhmxhm-SMD LED PRODUCT SPCIFICATIONDESCRIPTION2835 Single chipWhite smd led(0.3W)CUSTOMERDATEREVv1.0PREPAREDCHECKAPPROVEDLumenMaxCustomerRevision NoteDateRevisionPageVision2013/08/18Initiate Document211V1.0 1. Features Samll Size(2.8*3.5*0.8mm) Industry Standard Footprint High Efficiency Pb-Free Soldering methods: IR reflow soldering Chip Dice: InGaN3.502. Dimensions0.803.3022.101211.902.100.250.602.002.602.80Cathode mark Unit:mmTolerance:±0.1mm3. Reconnended Soldering Pattern(Units:mm)2.502.500.604.002.104. Typical Electrical & Optical Characteristics(Ta=25°)ItemsSymbolConditionDeviceMin.Typ.Max.UnitForward voltageVFIF=30mA9-10.5VReverse CurrentIRVR=15V-10AColor temperature TCIF=30mA290030503200KLuminous Flux¢VIF=30mA262830LMView Angle2 1/2IF=30mA-120- Notes:1.Luminous Intensity: +/-10%2. Forward Voltage: +/-0.1V.5.Absolute Maxinum Ratings at (Ta=25°)ParameterRating UnitsPower dissipation360mWDC Forward Current30mAPeak Forward Current1100mAReverse Voltage5VOperating Temperature-40°C To +85°CStorage Temperature-40°C To +85°CNote:1. 1/10 Duty Cycle, 0.1ms Pulse Width.9. Reflow profile Temperature-profile (Surface of circuit board)1. Reflow soldering should not be done more than two times2. When soldering ,do not put stress on the LEDs during heating10. Packaging Specificatio Feeding Direction Dimensions of Reel (Unit: mm) Reel 3000 PCSA8.0mmB178.0mmC60.0mmD13.0mm Dimensions of Tape (Unit: mm)11. Packaging specifications
