电镀类设备验收规格修改后ok-519.xls

宜兴硅谷电子科技有限公司产品定位规划说明REV.003目标产品市场说明目标市场产品类别及特性技术能力规划制程设备规划方案制程工艺规划方案备注类别主要特性项目主流产品特殊产品项目第一阶段第二阶段1、计算机产品：超级计算机主板、server伺服器、存储伺服器,国内外主要厂商为INTEL/IBM/HP/DELL/SUM/浪潮等;2、数据传输产品：CoreRouters、Switchs、Edge/enterprise Routers、AccessRouters、DSLAM、CMTS;国内外主要厂商为CISCO/ALCATE/HUAWEI/NEC/LUCENT/3COM等;3、通讯产品：WDMTransport、CenterlOffice Swithcs、Multi-ServiceSwithcs、PBX、Basestation，国内外主要厂商为CISCO/EMC/HUAWEI/LUCENT/ALCATE/NORTEL/BROADCOM/烽火通讯/中兴电/诺西等4、高端工控、工业设备、办公设备、实验仪器，安防产品,主要厂商为SIEMENS/GE/三菱/日立/honeywell等；5、医疗产品：大型医疗设备用PCB，主要厂商为为GE/迈瑞等；6、半导体封装测试板产品，主要厂商为为爱德万/泰瑞达等；7.非普通消费性高端终端产品；电子阅读器、智能信息终端、GPS、MID、汽车音响；高端智能手机、摄像机、数码相机、高端便携式笔记本电脑等;背板BACKPNL出货尺寸SHIPPING SIZE16*1818*2122*431.层数能力设计820L能力设计2032L制程能力，最高40LA、采用热熔工艺作业，FOR 6-16L；B、选用4CCD自动对位热熔机，用于16L以上层次板需求；A、High Registration对准度工艺参数；B、Impedance阻抗控制系统；C、APQP先期产品品质规划系统设立；D、NPI新产品导入系统设立；E、QC/FMEA制程控制系统设立；排板尺寸PNL SIZE18*2121*2424*45层数LAYERS820L2040L最小孔径0.4MM0.3MM板厚THK.24MM48MM纵横比ASPECT RATIO818:11830:12.板厚纵横比板厚48MM纵横比1218:1A、RACK电镀特殊夹具、摇摆、震动设计，符合背板工艺要求，板厚最大6mm；B、PLASMA电浆等离子工艺设立，用于特殊材料活化及高aspectratio厚板除胶渣工艺；C、压合后各制程均要有一条水平线能满足背板需求；D、飞针机厚板测试能力以满足背板需求；A、sequential lamination压合工艺参数；B、PLASMA电浆等离子工艺设计；C、分段钻孔工艺；D、流程公版化，依照制程能力设计专用背板生产线及QC/FMEA作业控制系统；E、背板专人专机生产系统;BLIND VIA盲孔一阶二阶BV埋孔YESYES微盲孔纵横比0.8:11:1线宽线距LINE/WIDTH4/43/3板材FR4/无卤素/Hitg/Anti-CAFPI/ROGERS/NELCO/TACONIC etc.阻抗控制Impedance10%7%3.高频特殊基材应用各种高频特殊基材应用PI/ROGERS etc.A、PLASMA电浆等离子设备，用于特殊材料活化及高纵横比厚板除焦渣工艺；B、四端子微阻测试机；A、mixing lamination混压工艺参数设立；B、高频材料特殊制程条件设立，PI/ROGERS/NELCO/TACONICetc.C、制程特殊材料QC/FMEA制程控制系统；D、四端子微阻测试工艺；E、嵌入式电容电阻工艺参数设立；铜厚COPPER THK.1OZ30Z36OZ背钻BACK DRILLINGYESYES盲捞BLIND ROUTINGYESYESPRESS FIT压件孔精度2MIL2MIL4.排版尺寸24*45A、曝光、钻孔、成型、测试、印刷制程通用机台有效工作尺寸24*24inch以上；B、设立光成像制程大pnl size专用曝光机，有效曝光尺寸为24*45，包含内外层、S/M制程；C、设立大台面AOI机，有效工作尺寸24*45inch；D、设立大台面测试机，有效工作台面尺寸24*45inch；F、设立大台面网印机，有效工作台面尺寸24*45inch；A、流程公版化，依照制程能力设计专用超大尺寸生产线及QC/FMEA作业控制系统；B、大PNL SIZE专人专机生产系统；RIGESTRATION层间对准度 5MIL4MILTHIN CORE厚度8MIL4MIL表面处理流程化金/OSP化锡高阶系统板SYSTEM排板尺寸PNL SIZE16*2118*2121*2422*26层数LAYERS8-18L18-24L最小通孔孔径DHS0.25MM0.20MM板厚THK.12MM24MM5、背钻availableA、钻孔机Z轴线性马达控制，具背钻功能；A、back drilling背钻工艺参数设立；纵横比ASPECT RATIO812:11216:1阻抗控制Impedance10%7%6.盲捞availableB、成型机具盲捞功能；A、blind routing盲捞工艺参数设立；BLIND VIA盲孔一阶二阶BV埋孔YESYES微盲孔纵横比0.8:11:17.埋孔8:1以上纵横比塞孔A、树脂油墨专用塞孔机；B、设陶瓷磨板去溢胶机；C、专用真空塞孔机；A、resin plugging树脂塞孔工艺参数设立；B、vacuum plugging真空塞孔工艺参数设计，FOR高纵横比埋孔塞孔；线宽线距LINE/WIDTH4/33/3板材FR4/无卤素/Hitg/Anti-CAFPI/ROGERS/NELCO/TACONIC etc铜厚COPPER THK.0.52OZ23OZ背钻BACK DRILLINGYESYES8.厚铜能力46OZA、设立手动裁铜箔机用于裁切厚铜箔；A,3-6OZ厚铜印刷、电镀、压合、蚀刻、S/M工艺参数设立；盲捞BLIND ROUTINGYESYESREGSITRATION层间对准度 4MIL3MILTHIN CORE厚度4MIL3MIL表面处理化金，镀金,喷锡 OSP,化锡高端终端产品TERMINAL排板尺寸PNL SIZE16*2118*2121*2424*269.线路等级4/4线路3/3线路2/2线路A、LDI和VCP垂直连续电镀线设立;A、FINELINE细线路设计制作工艺;层数LAYERS6-10L10-12L最小盲孔孔径4mil3mil10.盲孔阶数具填孔能力A，设立LDD直接laser设备；B、专用填孔电镀药水搭配VCP线；C、LDI直接laser影像转移设备；A、LDD工艺参数设立；B、COPPER FILLING填孔工艺参数设立；C、LDI直接影像转移工艺设立；板厚THK.0.41MM12MM纵横比ASPECT RATIO68:1812:1微盲孔纵横比0.8:11:1盲孔BLIND VIA12阶3阶OR ANY PLUSVIA ON PTHYESYES11.薄板制作能力最小thincore 3mil；最小thincore 2milA、压合前一套水平线薄板制程能力要求2mil thin core；A、各制程thin core薄板制作工艺；B、unbalance core及mixing core内层蚀刻机压合工艺参数；VIA ON VIAYESYESBV埋孔YESYES线宽线距LINE/WIDTH3/32/212、WARPAGE板弯翘能力0.50%0.30%A、warpage板弯翘整平机；B、热烘烤制程warpage设备能力要求；A、warpage板弯翘压合、热烘烤制程参数设立；B、warpage板弯翘材料选用原则及控制；板材FR4FR4阻抗控制Impedance10%7%铜厚COPPER THK.1/3OZ1OZ13.表面处理工艺化金/osp/有铅喷锡/无铅喷锡/水金/镀金/镀硬金化锡A、第一期设立化金/osp/有铅喷锡/无铅喷锡/水金/镀金/镀硬金线B、第二期视产品需求设化锡线C、第三期自动外观检查机设立；A、各finish treatment表面处理制作工艺及S/M工艺要求设立；REGISTRATION层间对准度 4MIL3MILThin core厚度3MIL2MIL表面处理化金，OSP,镀金喷锡,化锡核准：林世平审查：谢昌辉制作：蒋海明日期：2011/11/07宜宜兴兴硅硅谷谷电电子子年年产产54万万平平米米（月月产产4.5万万平平米米）(高高层层)项项目目生生产产结结构构序序号号生生产产结结构构指指标标单单位位全全部部产产能能第第一一期期第第二二期期第第三三期期备备注注1 月出货面积M2/月45000150001500015000第三期12层2 平均层数层9.333333388123 月生产天数天/月262626264 平均PNL面积M2/pnl0.21677380.21677380.21677380.2167738 按16*21计算5 投入产出比%65656565 同P16 内层日均产能面积数M2/天9763266326634438PNL数pnl/天450391228312283204727 外层日均产能面积数M2/天2929976976976PNL数pnl/天13512450445044504注：产量45000平米/月。埋、盲孔板占10%，HDI板占10%,纵横比大于12：1的背板占产能的5%。品种数为5000种/月。200种/天，每款订单平均面积10平米。5-20平方米/款之产品占80%以上，低于5平方米/款及超过20平方米/款之产品占10%-20%宜宜兴兴硅硅谷谷电电子子产产品品结结构构计计算算基基础础計算基础要項計算數量說明a產出面積（平方米）45,000A內層每日生產WPNL45039 a/b/c/l*dbWPNL 有效面積（平方米）0.216774B外層每日生產WPNL12283 a/b/c/lc投入产出比65.00%C次外层生产WPNL1228 B*ed內層平均使用張數3.666667D压合每日生產WPNL13512 B*(1+e)eHDI比例10.00%EHDI埋镀每日生产量1228 B*ef有铅喷锡比例10%G雷射每日生產WPNL1228 B*eg无铅喷锡比例5%H有铅喷锡每日生產WPNL1228 B*fh化金板比例60%I无铅喷锡每日生產WPNL614 B*giOSP板比例20%J化金每日生產WPNL7370 B*hjv-cut比率20.00%KOSP每日生產strip14740 B*i*kk平均排版数（strip）6.00Lv-cut每日生產strip14740 B*i*jl每月生产天数26.00M电测每日生產strip73700 B*im喷涂和印刷比例60.00%N喷涂每日生產WPNL7370 B*mn文字丝印和喷印比例90.00%N文字丝印每日生產WPNL11055 B*no镀金手指板比例5%O镀金每日生產WPNL614 B*op化锡板比例5%P化锡每日生產strip3685 B*p*jq整版镀金板比例10%Q整版镀金每日生產WPNL1228 B*qr镀硬金板比例2.50%R镀硬金每日生產WPNL307 B*r宜宜兴兴硅硅谷谷电电子子主主要要生生產產設設備備单单机机產產能能试试算算表表制程設備名稱生产速度M/MIN板子宽度INCHCycle time交接班停机点检保养时间MIN吃饭停机时间min单次换料号时间min换料号次数总换料号停机时间min其他停机时间min每天实际生产时间min稼動率單機/連線產能每月生产天数單機/連線月產能pnlpanel面积平米投入产出系数單機/連線月產能(出货面积/平米)班pnl日pnl内层开料机1631.00pnl/min30120570350094065.3%14,57029,14026757,6400.21680.6521,351手动开料机5.00pnl/min301205201000119082.6%2,9755,95026154,7000.21680.654,360磨板边3166.57pnl/min3012026012030114079.2%3,7477,49326194,8290.21680.655,490烤箱（双门）1610.00pnl/min3012002000120117081.3%5,85011,70026304,2000.21680.658,573前處理3166.57pnl/min6012002300126087.5%4,1418,28226215,3370.21680.656,068涂布线3166.57pnl/min601205231150114579.5%3,7637,52626195,6840.21680.655,514湿膜半自动曝光机161.50pnl/min301201522330096066.7%7201,4402637,4400.21680.651,055湿膜自动曝光机162.25pnl/min301201522330195966.6%1,0792,1582656,1020.21680.651,581内层DES3.5167.67pnl/min1201201035350085059.0%3,2596,51826169,4790.21680.654,776AOI162.00pnl/min301201032320097067.4%9701,9402650,4400.21680.651,421VRS162.00pnl/min301201032320097067.4%9701,9402650,4400.21680.651,421自动冲孔机166.00pnl/min301205221100118081.9%3,5407,08026184,0800.21680.655,187压合棕化线3166.57pnl/min12012006000120083.3%3,9447,88826205,0830.21680.655,779减铜线3166.57pnl/min12012010202000100069.4%3,2876,57326170,9030.21680.6524,081pp冲孔机1624.00pnl/min601203702100105072.9%12,60025,20026655,2000.21680.6592,320pp裁切机7.51632.87pnl/min60603501500117081.3%19,22738,45326999,7810.21680.65140,872pp分条机1699.00pnl/min60603501500117081.3%57,915115,830273,127,4100.21681.651,118,602热熔铆合机161.00pnl/min301202601200117081.3%5851,1702630,4200.21680.654,286层压机（二热一冷）161.18pnl/min300000180123085.4%7261,4512637,7360.21680.655,317回流线+磨钢板3.8512.82pnl/min300000180123085.4%1,7373,4742690,3260.21680.6512,727叠板线3.8512.82pnl/min300000180123085.4%1,7373,4742690,3260.21680.6512,727X-RAY打靶机162.20pnl/min3012053718560104572.6%1,1502,2992659,7740.21680.658,422铣边（四头铣床）164.00pnl/min30120855440085059.0%1,7003,4002688,4000.21680.6512,456磨边线51610.96pnl/min301205100500079054.9%4,3278,65526225,0220.21680.6531,706钻孔6轴钻孔机（TWO PIN）160.12pnl/min300151015030123085.4%74148263,8380.21680.65541hole check160.20pnl/min601205201000116080.6%116232266,0320.21680.65850X-ray160.00pnl/min01440100.0%-26-0.21680.65-激光钻孔机（双轴）160.16pnl/min3012020510060113078.5%90181264,7010.21680.65662第 4 页，共 73 页电镀沉铜前磨板3166.57pnl/min601205301500111077.1%3,6487,29626189,7020.21680.6526,730水平deamear/PTH1.8163.94pnl/min6012000060120083.3%2,3664,73326123,0500.21680.6517,338等离子清洗机160.40pnl/min6012000060120083.3%2404802612,4800.21680.651,758垂直连续电镀（VCP）-FOR 盲埋孔及通孔工艺0.75161.64pnl/min00151015060123085.4%1,0112,0212652,5530.21680.657,405垂直连续电镀（VCP）-FOR 填孔工艺0.5161.10pnl/min00201020060118081.9%6461,2932633,6110.21680.654,736垂直desmear/pth165.00pnl/min00000120132091.7%3,3006,60026171,6000.21680.6524,179tenting厚铜电镀PNLPLATING163.50pnl/min00000120132091.7%2,3104,62026120,1200.21680.6516,925pattern 电镀线163.00pnl/min00000240120083.3%1,8003,6002693,6000.21680.6513,189电镀后处理清洗线(含砂带研磨)2163.00pnl/min00000241119983.3%1,7993,5972797,1190.21680.6513,684水洗烘干机4168.76pnl/min600000120126087.5%5,52111,04328309,2020.21680.6543,568特殊前处理（陶瓷）（8轴）2164.38pnl/min601202020400086059.7%1,8843,7692697,9840.21680.6513,806外层D/F前處理2.5165.48pnl/min601201525375088561.5%2,4244,84826126,0410.21680.6517,760自动壓膜機2.5165.48pnl/min601201525375088561.5%2,4244,84826126,0410.21680.6517,760手动壓膜機2.5165.48pnl/min601201525375088561.5%2,4244,84826126,0410.21680.6517,760D/F半自动曝光机161.50pnl/min601202017340092063.9%6901,3802635,8800.21680.655,056LDI160.80pnl/min6012010131300113078.5%4529042623,5040.21680.653,312外层DES3166.57pnl/min1201202023460074051.4%2,4324,86426126,4680.21680.6517,820外层SES1.2162.63pnl/min12012020153006084058.3%1,1042,2092759,6320.21681.6521,329外层显影1.2162.63pnl/min12012020153006084058.3%1,1042,2092759,6320.21681.6521,329AOI161.30pnl/min3012010202000109075.7%7091,4172636,8420.21680.655,191VRS161.30pnl/min3012010202000109075.7%7091,4172636,8420.21680.655,191防焊树脂塞孔161.00pnl/min3012020102000109075.7%5451,0902628,3400.21680.653,993防焊前处理2164.38pnl/min6012000060120083.3%2,6295,25926136,7220.21680.6519,265S/M塞孔机161.20pnl/min301202015300099068.8%5941,1882630,8880.21680.654,352S/M丝印机161.10pnl/min301202020400089061.8%4909792625,4540.21680.653,587宜宜兴兴硅硅谷谷电电子子主主要要生生產產設設備備单单机机產產能能试试算算表表制程設備名稱生产速度M/MIN板子宽度INCHCycle time交接班停机点检保养时间MIN吃饭停机时间min单次换料号时间min换料号次数总换料号停机时间min其他停机时间min每天实际生产时间min稼動率單機/連線產能每月生产天数單機/連線月產能pnlpanel面积平米投入产出系数單機/連線月產能(出货面积/平米)班pnl日pnl第 5 页，共 73 页S/M预烘烘箱(隧道式式）164.00pnl/min0000060138095.8%2,7605,52026143,5200.21680.6520,222S/M预烘烘箱(双门式）160.00pnl/min01440100.0%-26-0.21680.65-S/M喷涂+预烘线166.00pnl/min1201205402000100069.4%3,0006,00026156,0000.21680.6521,981S/M曝光机（半自动）160.68pnl/min3012010101000119082.6%4058092621,0390.21680.652,964手动曝光机161.00pnl/min30120518900120083.3%6001,2002631,2000.21680.654,396S/M显影线2164.38pnl/min6012000060120083.3%2,6295,25926136,7220.21680.6519,265字符丝印机161.00pnl/min3012015121800111077.1%5551,1102628,8600.21680.654,066字符打印机160.40pnl/min301205201000119082.6%2384762612,3760.21680.651,744CM/SM固化烘箱（隧道式）166.00pnl/min0000060138095.8%4,1408,28026215,2800.21680.6530,334CM/SM后烤烘箱(直立式）161.00pnl/min0000060138095.8%6901,3802635,8800.21680.655,056加工前处理+喷锡+后处理（有铅）162.00pnl/min120120510500115079.9%1,1502,3002659,8000.21680.658,426前处理+喷锡+后处理（无铅）162.00pnl/min120120510500115079.9%1,1502,3002659,8000.21680.658,426OSP1.51618.00strip/min601205301500111077.1%9,99019,98026519,4800.02760.9513,640沉金前处理3166.57pnl/min601200000126087.5%4,1418,28226215,3370.21680.6530,342沉金163.30pnl/min12012065300117081.3%1,9313,86126100,3860.21680.6514,145沉金后处理3166.57pnl/min301200000129089.6%4,2408,47926220,4650.21680.6531,064镀金线0.8161.75pnl/min6012010202000106073.6%9291,8582648,3090.21680.656,807硬金线160.30pnl/min60120320600120083.3%180360269,3600.21680.651,319水金线161.20pnl/min12012000060114079.2%6841,3682736,9360.21681.6513,211化锡线0.6167.00strip/min12012052010060104072.2%3,6407,28026189,2800.02760.954,9714轴成型机160.20pnl/min3002061200129089.6%129258266,7080.21680.65945V-CUT机（strip）166.00strip/min3012010101000119082.6%3,5707,14026185,6400.02760.854,361斜边机166.00strip/min3012010101000119082.6%3,5707,14026185,6400.02760.854,361成品清洗31636.00strip/min60600000132091.7%23,76047,520261,235,5200.02760.8529,026成品压烤机1616.00strip/min0000060138095.8%11,04022,08026574,0800.02760.8513,487防焊宜宜兴兴硅硅谷谷电电子子主主要要生生產產設設備備单单机机產產能能试试算算表表制程設備名稱生产速度M/MIN板子宽度INCHCycle time交接班停机点检保养时间MIN吃饭停机时间min单次换料号时间min换料号次数总换料号停机时间min其他停机时间min每天实际生产时间min稼動率單機/連線產能每月生产天数單機/連線月產能pnlpanel面积平米投入产出系数單機/連線月產能(出货面积/平米)班pnl日pnl第 6 页，共 73 页测试电测试机（夹具）163.00strip/min301201571050118582.3%1,7783,5552692,4300.02760.852,171飞针测试机160.30strip/min3012057350125587.2%188377269,7890.02760.85230终检验孔机2.51630.00strip/min01440100.0%21,60043,200261,123,2000.02760.9529,492外观检查机5.00strip/min30120520100119082.6%2,9755,95026154,7000.02760.954,062板弯板翘检查机41648.00strip/min01440100.0%34,56069,120261,797,1200.02760.9547,186包装热塑包装机1680.00strip/min601200000126087.5%50,400100,800262,620,8000.02761.0072,435真空包装机1640.00strip/min601200000126087.5%25,20050,400261,310,4000.02761.0036,218rework板翘反直机16strip/min601200000126087.5%-26-0.02760.95-精密热风无尘烤箱16strip/min0000001440100.0%-26-0.02760.95-工程部光绘机160.39pnl/min600138095.8%268537260.21680.65-冲片机160.39pnl/min600138095.8%268537260.21680.65-菲林检查机160.33pnl/min301200129089.6%2134262611,0680.21680.651,560棕片曝光机160.00pnl/min01440100.0%-26-0.21680.65-棕片显影机160.00pnl/min01440100.0%-26-0.21680.65-制工具拉网台160.00pnl/min01440100.0%-26-0.21680.65-上浆机160.00pnl/min01440100.0%-26-0.21680.65-晒网机160.00pnl/min01440100.0%-26-0.21680.65-烘网160.00pnl/min01440100.0%-26-0.21680.65-治具钻孔机160.00pnl/min01440100.0%-26-0.21680.65-备注：cycle time 水平线可按以上公式计算，其他设备按实际进行核算;每月生产料号5000个 每日200个，按设备需求数量分摊每台设备生产料号数投入产出系数为0.65，成型后的产能可按strip计算，良率按85%，终检后良率按95%计算;上表为16*21尺寸宜宜兴兴硅硅谷谷电电子子主主要要生生產產設設備備单单机机產產能能试试算算表表制程設備名稱生产速度M/MIN板子宽度INCHCycle time交接班停机点检保养时间MIN吃饭停机时间min单次换料号时间min换料号次数总换料号停机时间min其他停机时间min每天实际生产时间min稼動率單機/連線產能每月生产天数單機/連線月產能pnlpanel面积平米投入产出系数單機/連線月產能(出货面积/平米)班pnl日pnl第 7 页，共 73 页宜宜兴兴硅硅谷谷电电子子科科技技有有限限公公司司月月产产4500045000平平米米主主要要设设备备需需求求表表序号制程設備45000平米日需求(PNL/Day)分阶段日需求(PNL/Day)單機日產能(PNL/day)機台需求需求機台方案說明第一期第二期第三期需求數量总设定數量第一期第二期第三期1内层开料机315278600860014332291201.0810102内层手动开料机1351236863686614259502.2733003内层磨板边机900824572457409574931.201100HLC内层thin core为薄板磨边效果不佳，按20%产量需磨板边。4内层磨板清洗机900824572457409574931.2011005内层烤箱（双门）45039122851228520474117003.8541126内层化学前處理机4503912285122852047482825.4472237内层涂布机4503912285122852047471326.3272238内层湿膜半自动曝光机360319828982816379144025.02236611每班每台机器更换平均15个料号或不同层次依照产品结构变化9内层手动内外层大台面曝光机180249149181912001.502110 大尺寸板子使用10内层湿膜自动曝光机900824572457409521584.17622211内层内层显影蚀刻去膜机4503912285122852047465186.91722312内层检验AOI45039122851228520474194023.22246711 每班每台机器更换20个料号或不同层次13内层检验VRS45039122851228520474194023.22246711 1:1配置14内层自动冲孔机4503912285122852047470806.367223压合采用thermal bonding工艺，multiline冲孔数量为6孔15压合棕化线4626812620126202103278885.876222 考虑LDP棕化产能及二压棕化需求16压合减铜线122840940940965730.19110017压合pp冲孔机49132134011340122334252001.95211018压合pp裁切机73698201022010233501384531.92211019压合pp分条机736982010220102335011158300.641100第 8 页，共 73 页20压合热熔铆合机12283409440944094117010.501244421压合层压机（二热一冷）1351245044504450414519.3193331、每开口平均10层2排版,热压时间平均160min计算，满锅率85%；2、宜兴厂规划月产45000平米，月品种需求量5000个，日需求200个品种，平均每个品种10平米，50PNL；3、以平均三个品种混压一锅，每锅压板量需求为150PNL，压机开口数量以4-6 OPEN为宜；先以6OPEN 设置4、考虑未来压合材料的复杂性，需在3号厂房一楼设立特殊基材压合区及压合扩充区，以满足月产5万平米的产能需求；22压合回流线+磨钢板878329282928292834742.533111 以钢板数量为计算基准，23压合叠板线878329282928292834742.53311124压合X-RAY打靶机1351245044504450422995.886222 考虑HDI 需要一次7孔打靶作业25压合铜箔裁切机/1010 依特殊产品需要26压合手动叠板线/1010 做产能缓冲27压合四轴成型机1351245044504450434003.97421128压合磨边线1351245044504450486551.56211029压合磨边清洗线1351245044504450486551.56211030钻孔6轴钻孔机（TWO PIN）1351245044504450414891.30762432201、8台采用单一PC独立控制轴2、HDI外层cycle time时间短，单独考虑3台机作业3、治具钻孔机台考虑2台双轴钻孔机放置在3号厂房夹具区域；4、现有场地可放76台钻孔机（差异需求16台），最大日产出11248PNL，以钻孔作为核心瓶颈制程考虑月产出预估为41206.8平米；5、宜兴厂产品规划以背板、系统板、HDI为主，孔数多、板子厚，STK降低及CYCLE TIME拉长会影响到钻孔的产出，考虑在3号厂房一楼作为钻孔制程的扩充区；或在第三期采取外包方式满足产能31钻孔hole check2408080802321.031010 做检查用32钻孔X-ray/2110 做检查用宜宜兴兴硅硅谷谷电电子子科科技技有有限限公公司司月月产产4500045000平平米米主主要要设设备备需需求求表表序号制程設備45000平米日需求(PNL/Day)分阶段日需求(PNL/Day)單機日產能(PNL/day)機台需求需求機台方案說明第一期第二期第三期需求數量总设定數量第一期第二期第三期第 9 页，共 73 页33钻孔激光钻孔机（双轴）12284094094091816.797133 系统板HDI平均每片板子8000颗盲孔，34电镀沉铜前磨板机1351245044504450472961.85211035电镀水平沉铜机270290190190147330.57101036电镀水平除胶渣机270290190190147330.57101037电镀等离子清洗机12284094094094802.5631111、FOR 高密度盲孔HDI板及12:1以上高纵横比背板；2、特殊材料除焦渣工艺需求；38电镀垂直连续电镀（VCP）-FOR 填孔工艺245781981981920211.221010考虑HDI比例及二阶比例,一条用于盲孔电镀，一条