杜邦产品介绍(3).pptx
Introduction to Flexible Circuit MaterialsPresented by:Jonathan C.LimPart II:(40 minutes)簡報大綱簡報大綱軟性電路板基材之介紹基材的主要CompositionDielectric Substrates(絕緣體)Adhesive(膠質)Conductor(導體)m簡報大綱簡報大綱(continue)杜邦產品壓克力膠系列(Modified WA Acrylic)之基材環亞樹脂膠系列(Modified Epoxy)之基材杜邦 料號解說PyraluxTelcamm軟性電路板之主要基材軟性電路板之主要基材Copper Clad Laminates(銅箔基材)Single-Sided C.C.L.(單面銅箔基材)AdhesiveConductorDielectric SubstratemDouble-Sided C.C.L.(雙面銅箔基材)ConductorDielectric SubstrateAdhesive軟性電路板之主要基材軟性電路板之主要基材mAdhesive-Less C.C.L.(無膠銅箔基材)Dielectric SubstrateConductor軟性電路板之主要基材軟性電路板之主要基材mCoverlay(覆蓋膜)軟性電路板之主要基材軟性電路板之主要基材mDielectric SubstrateAdhesive離型紙離型紙AdhesiveKaptonStiffner(補強材)軟性電路板之主要基材軟性電路板之主要基材Dielectric SubstrateAdhesivemBondplyDielectric SubstrateAdhesiveAdhesive軟性電路板之主要基材軟性電路板之主要基材mMylarAdhesiveKaptonAdhesiveSheet AdhesivePhotoImageable Coverlay(PIC)Dry FilmFine-Line ApplicationCameraAutomotiveOthers軟性電路板之主要基材軟性電路板之主要基材mDielectric SubstratesDefinitionA base film on which the printed conductors are laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.m必備之特性Mechanical StrengthFlexibilityDimensional StabilityDielectric PropertiesThermal PropertiesChemical ResistanceMoisture AbsorptionCostDielectric SubstratesmSubstrates 之種類PolyimidePolyesterFluorocarbonAramid PaperCompositeDielectric SubstratesmPolyimide:Popularized by DuPont under“Kapton”Also known as PI First choice of film in most FPCInfusible and flame retardantHigh Tg(約 260C-280C)Good dimensional stabilitySubstratesmSubstratesPolyester:Popularized by DuPont under“Mylar”Also known as PETLowest cost dielectric materialMostly used in low-cost consumer applicationGood mechanical propertiesBad thermal propertiesmSubstratesAramid Paper:Sold under DuPont trade name“Nomex”Used in specialized applicationGood thermal insulation materialmProperty Polyester Polyimide Fluorocarbon Aramid Paper CompositeTensile Strength Excellent Excellent Fair Good BestFlexibility Excellent Excellent Excellent Good Fair/GoodDim.Stability Fair/Good Good Fair Good Fair/GoodDielectric Str.Good Good Very Good Very Good GoodSolderibility Poor Excellent Fair Excellent ExcellentC.O.T.(C)105 200-230 150-180 220 105-180Thermal Exp.Low Low High Moderate LowChem.Resist.Good Good Excellent Very Good FairMoisture Absorp.Very Low High Very Low Very High LowCost Low High High Moderate ModerateTrade Name Mylar Kapton Teflon/Tedlar NomexDielectric SubstratesmAdhesiveDefinitionMaterial that bonds layers togetherThermosettingThermoplasticmAdhesive必備之特性Adhesion StrengthFlexibilityChemical ResistanceThermal ResistanceMoisture AbsorptionElectrical PropertiesCostmAdhesiveAdhesive之種類PolyesterAcrylicEpoxyPolyimideButyral PhenolicmAdhesivePolyester:Used where the dielectric is also polyesterUsed where no soldering is neededTypical application:Instant camera film interconnectsInstrument cluster connection in automobilesmAdhesiveAcrylic:Used in demanding temperature requirement applicationMost popular acrylic system is Pyralux by DuPontExcellent adhesionmAdhesiveEpoxy:Widely used adhesive systemGenerally lower cost than acrylicAble to stand wave solderingGood in high temperature for long period of time(400 to 450 F)mAdhesivePolyimide:Used in adhesiveless ccl and coverlayUsed where dimension stability is criticalUsed in high temperature applicationHigh moisture absorptionmAdhesivePolyesterAcrylic EpoxyPolyimideButyral PhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoisture FairGoodExcellentExcellentExcellentLowFairVery GoodGoodGoodExcellentVery GoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGoodModerateFairFairVery HighPoorFairFairHighModeratePoormConductors/FoilMajor types of conductorsMetalsMetal alloysconductive inksCopper(the most commonly used conductor in FPC)Electrolytically deposited copper(ED)Rolled Annealed copper(RA)mConductors/Foil必備之特性Current-carrying capacityFlexibilityService temperatureChemical resistanceMechanical strengthCostmConductors/FoilElectrical PropertiesThermal PropertiesMechanical PropertiesRelative CostAluminumCopperGoldNickelSilverExcellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVery GoodVery GoodBestm軟板基材製造過程軟板基材製造過程Copper RollKapton RollCopper Clad LaminateHeater 1Heater 2Liquid AdhesiveAgingmIntroduction to DuPont ProductsmPart III:(15 minutes)DuPont Product FamilyPyraluxPyralux FRPyralux LFPyralux APPyralux PCTeclamTeclam FNCTeclam DNCPyralux FR-series(Acrylic Based)Copper-Clad LaminatesPanel Form Packaging.(24”x 36”)UL Approved.(File#E124294)Very Good Flexure EnduranceEx.FR9111,FR9110,FR8510,FR8515CoverlayRoll Form Packaging.(24”x 250)UL Approved.(File#E124294)Excellent Dimensional StabilityEx.FR0110,FR0210mPyralux FR continue.Sheet AdhesiveRoll Form Packaging.(24”x 250)UL ApprovedEx.FR0100,FR0200Bond PlyRoll Form Packaging.(24”x 250)UL ApprovedEx.FR0111,FR0212mPyralux LF-series(Acrylic Based)Military SpecificationsExcellent Flexure EnduranceVery Good for High-Density CircuitrySame Product Offerings as FR-seriesPC-series(Acrylic,urethane,&imide-based)Dry FilmPhotoimageable CoverlayCameras&Automotive ApplicationsmPyralux P/NsFR 9 111CuPICu7 -Special construction8 -1/2oz.C.C.L.9 -1oz or more C.C.L.5 -1/2 oz.Cu1 -1 oz.Cu2 -2 oz.Cu1 -1 mil PI2 -2 mil PI3 -3 mil PIFRLFAPCopper-Clad LaminatesmPyralux P/NsFR 0 111Adh.PIAdh.FRLFAP7 -Special construction0 -Coverlay or Sheet Adhesive1 -1 mil adhesive2 -2 mil adhesive3 -3 mil adhesive1 -1 mil PI2 -2 mil PI3 -3 mil PICoverlay&Sheet AdhesivemTeclam FNC-seriesCopper-Clad LaminatesUL ApprovedGood Flexure EnduranceRoll Form Packaging(250/500mm x 100M)Ex.FNCRA110,FNC110CoverlayUL ApprovedRoll Form PackagingEx.FNCC510,FNCC510-20mDNC-seriesUL ApprovedLeast RepellencyGood Peeling StrengthExcellent Heat&Humidity ResistanceExcellent TransparencySame Product Offering as FNCTeclam mTeclam CoverlayFNCC510-20FNCDNCC -Coverlay5 -Coverlay1 -1 mil PI2 -2 mil PINo Meaning15 -15m Adhesive20 -20m Adhesive35 -35m AdhesivemTeclam Copper-Clad LaminatesFNCRA910FNCDNCRA -RA Cu.-ED Cu.1 -1 mil PI2 -2 mil PI7 -1/2 mil PI1 -1 oz.Cu.2 -2 oz.Cu.9 -1/2 oz.Cu.mQ&AmPart IV:
