BGA和CSP检查（ppt 16）42604.pptx
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BGA和CSP检查（ppt 16）42604.pptx
BGA and CSP InspectionIntroducingSolvisionsFalconProFalconProFalconFalconOur Mission:Provide Innovative Solutions in Vision-based technology to Help our Clients Strengthen their Competitive Edge.Needs for BGA Production LineQualityCostYieldLead Time3 steps solution in Vision Inspection:BGA FalconPro1-FMI Technology2-Automatic Handling3-In-Process Inspection CapabilityFMI Technology CSP 3D mappingPGA,3-D CoplanarityPGA,Missing Pin,3DFMI TechnologyUnique Patent Pending TechnologyReal 3-D mapping of the entire FOVHigh Level Deep data accuracyAdaptable to new Process environmentBGA,CGA,CSP,Wafer bumps:Extendable to sub-micron FMI Technology for More BenefitsReal 3-D mapping and combined 2D measurements of the entire Field of View -Substrate warpage,peel off,-True 3-D Ball shape for BGA and CSP package-Grid-to-fiducial,chip out,oxidizationsAll ball inspection,x-y detection and warpage measurements.Automatic HandlingMulti-Function(Vision and Handling Transfer Tool)Single Handling StationNo need for manual handlingNo need to Separate Handling and Stand-Alone VisionIn-Process inspection Capability100%Quality ControlReal Time Inspection for Process ControlAllow immediate action to Process DriftReduce Waste&ReworksYield ImprovementReduce Lead Time Advantages演讲完毕，谢谢观看！
