PCB专业术语名词解释A506771.pptx
Title1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board(pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board第一篇：第一篇：常用术语常用术语 10.单面印制板：single-sidedprintedboard(ssb)11.双面印制板：double-sidedprintedboard(dsb)12.多层印制线路板：mulitlayerprintedwiringboard13.刚性印制板：rigidprintedboard14.刚性单面印制板：rigidsingle-sidedprintedboard15.刚性双面印制板：rigiddouble-sidedprintedboard17.刚性多层印制板：rigidmultilayerprintedboard18.MI:ManufactureInstruction(制作指示制作指示)19.ECN:EngineeringChangeNotice(工程更改通知工程更改通知)20.MOR：MarketingOrderReleaseOC:OrderConfirmation(定单定单)21.IPC-TheInstituteforInterconnectingandpackagingElectronicCircuits(美国电子电路互连与封装协会美国电子电路互连与封装协会)22.UL:UnderwritesLaboratories(美国保险商实验所)23.ISO-InternationalStandardsOrganization国际标准化组织24.OnholdandRelease:暂停和释放25.SPEC:specification客户规格书26.WIP:Workinprocess正在生产线上生产的产品27.Gerberfile:软件包28.MasterA/W:客户原装菲林29.Netlist:客户提供的表明开短路的文件30.HMLV:HighMixedLowVolume,多批少量31.TCN：TemporaryChangenotice临时更改通知临时更改通知32.ENIG:ElectrolessNickel/ImmersionGold(IPC-4552)33.OSP:OrganicSurfaceprotection34.IT:ImmersionTin35.IS:ImmersionSilver36.HAL:Hotairleveling第二篇：第二篇：有关材料有关材料1.Copper-cladLaminate:覆铜箔基材2.Prepreg:聚酯胶片3.FR-4(FlameRetardant-4):一种用玻璃布和环氧樹脂制造有阻燃性能的材料4.Soldermask:阻焊剂5.Peelablesoldermask:蓝胶7.Dryfilm:干膜6.CarbonInk:碳油8.RCC:ResinCoatedCopper(不含玻璃布)9.基材：base material10.层压板：laminate11.覆金属箔基材：metal-clad bade material12、覆铜箔层压板：copper-clad laminate(ccl)13、单面覆铜箔层压板：single-sided copper-clad laminate14、双面覆铜箔层压板：double-sided copper-clad laminate15、复合层压板：composite laminate16、薄层压板：thin laminate17、金属芯覆铜箔层压板：metal core copper-clad laminate18、金属基覆铜层压板：metal base copper-clad laminate第三篇：第三篇：有关工序有关工序PTH1.PTH:(Platedthroughhole)电镀孔A.Viahole:通路孔。?作用：作用：B.IChole:插件孔。?作用：作用：仅作为导通用（不作插件或焊接），如测试点和一般导通孔。用于插件或焊接，也可导通内外层。2.NPTH：?作用：作用：一般是作为装配零件的定位孔或工具孔。NPTH?(Non-platedthroughhole)非电镀孔3.SMT/SMD?SurfaceMountingTechnology:表面贴覆技术?SMTPad:SMT指在线路板表面帖覆焊接元件的Pad，包括QFP(Quadflatpad)，2-Roll等。这些也是SMTpad4.BGA/CSP:BGA-BallGridArrayCSP-ChipScalepackage?要求：要求：一般BGA区域VIA孔要求塞孔?说明：说明：它们都是一种封装技术。在PCB上都表现为一VIA孔联了一个焊接PAD。BGA/CSPBGAPadLineViaHole5.Fiducialmark:?作用：作用：装配时作为对位的标记?说明：说明：它是非焊接用的焊盘，通常为圆形或方形，有金属窗和绿油窗。Fiducialmark6.Dummypattern(thiefpattern)：?作用：作用：使整块板的线路分布更均匀，从而提高图电质量和减少板的曲度和扭度。?要求：要求：通常以不影响线路为标准，一般为又有三种：圆形/方形-命名为“Dummy”网状-命名为“网状Dummy”铜皮-命名为“铜皮”Dummy7.无孔测试无孔测试Pad：TextPad/BreakingTab?此类Pad仅供装配完后作为测试点，不装配零件。不包括SMTPAD,BGAPAD,Fiducialmarkpad.8.BreakingTab：?印制板上无电气性能，在制作过程中用于加工具孔、定位孔或Dummy等的部分。与线路板主体部分相连处有折断孔或V-Cut。BreakingTabV-Cut9.Thermal：?作用：作用：它使在焊接时因截面过分散热而产生虚焊的可能性减少。?(heatshield）热隔离盘（大面积导电图形上，元件周围被蚀刻掉的部分）Thermal/Clearance10.Clearance：?无铜空间（通常指铜皮上为孔开的无铜区域）11.S/MBridge：?作用：作用：防止焊接时Pad间被焊锡短路。阻焊桥（装配Pad间的阻焊条）S/MbridgeS/MBridgeSoldermaskintheseareasS/Mbridge12.Goldfinger：金手指?说明：说明：电镀金耐磨。一般金指的S/MOPENING均为整体开窗。13.Keyslot：键槽?作用：作用：使印制板（金手指）只能插入与之配合的连接器中，防止插入其他连接器中的槽口。?要求：要求：一般公差要求较紧。14.Beveling：金指斜边Goldfinger/Keyslot/Beveling15.VIP：?要求：要求：一般为S面塞孔，C面作为SMTPAD。16.VOP：?(ViaInPad)Via孔位于SMTPad上。?说明：说明：(ViaOnPad)Via孔先被树脂塞满，其表面（一面或两面）经过打磨、沉铜、板电镀等工序后，要求作为装配Pad。VIP/VOPS面塞孔SMTPadViahole树脂塞孔SMTPadBlind/Buriedhole17.Blind/Buriedhole：盲/埋孔?盲孔：从一个表面开始，在内层结束，未贯穿整板的孔。?埋孔：不经过两外表面，只在某些内层中贯穿的孔。盲孔盲孔埋孔埋孔19.LDI?HighDensityInterconnection:高密度互联-特点：直接用激光在干膜上曝光，不必用菲林，能保证完成线宽更细。18.HDI?LaserDirectImage-镭射直接曝光-特点：一般线宽/线间小于3mil/3mil导通孔小于8mil,microvia一般要求用激光钻孔。20.Heatsink:SidefaceBottomSideTop SidePCBPallet大铜块大铜块PrepregPCB+Prepreg+PalletAspectratio21.AspectRatio：纵横比（板厚孔径比）-影响电镀和喷锡?说明：说明：一般采用板厚最大值与最小孔径之比。dHDAspectRatio=d/H22.AGP:显卡主显示芯片AGP23.Motherboard:内存插孔PCI插槽CPU插座AGP插槽主(机)板Motherboard24.Memorybank:Memorybank内存条内存芯片组内存芯片组第四篇：第四篇：检查与测试检查与测试欧盟RoHS&WEEE指令对无铅PCB要求无铅PCB必须满足欧盟 RoHS（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC指令 和电子信息产品生产污染防治管理办法的规定，从2006年7月开始禁用六种物质（铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。If this specification conflicts with any otherdocumentsthefollowingorderofprecedenceshallapply:a)Purchaseorderb)Printedwiringboarddrawingsanddrillandtrimdocumentationc)Thisspecificationd)Documentsreferredtointhisspeciation.Supplier shall use applicable fabrication panelcoupon as defined in IPC-2221.Micro-sectionscoupon,andsoldersamplesshallbeprovidedwitheachshipmentforvalidationrequirement.1.Maximum3repairoperationsareallowedoneachboardandthenumberofrepairedPCBScannotexceedthe10percentoftheentirelotpopulation.2.Unlessotherwisespecifiedontheengineeringdrawing,platedthroughviaholeswithanominalsizeof0.020inchorlessmaybepartiallyorcompletelypluggedwithsolder.3.Asapreventiveprecaution.beforethelayingdownofthesolder,thePCBSwillhavetobewashedtoremovetheresidualsduetotheproductionprocess,theclearingdegreeofthePCBSbeforethecoatinghastobethefollowingoneMAX1ug/squarecm.1.Soldermask(SMOBC)-ApplyLPIsoldermasksperIPC-SM-840typeB.class3.colorgreenandminimumsoldermasks thickness over the edges shall be 0.001”.LPI soldermaskandsoldershallmeettheUL94v-orequirements.ThereshallbenosoldermasksovertheSMTpads,thereshallbenoexposed traces on outside layers and solder mask openingshouldbe0.002”sidelargerthanpad.2.PCB“Stack-Up”constructionrequirementsaretobedeterminedbythePCBvendorunlessspecified.Leitchwillsupply the overall nominal PCB thickness,and all otherassociatedfunctionalrequirements.ACertificateofCompliance is required for all PCBs,where Leitch hasspecified specific functional requirements.(e.g.Impedancespecifications,etc.)谢谢观看/欢迎下载BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES.BY FAITH I BY FAITH
