HDMI_1[1]4A_版本介绍及生产工艺.ppt

HDMI SPEC&HDMI Cable制程低压差分信号传输:LVDS（Low VoltageDifferential Signaling)笔记本和液晶显示器内部用于连接驱动模块和屏幕面板常用内部界面外部界面电视上常用RF（射频）、Composite（复合视频）、S-Video（S端子）、Component（色差端子）回顾当前显示领域的多种界面回顾当前显示领域的多种界面外部界面RF界面Composite界面S端子色差端子端子回顾当前显示领域的多种界面回顾当前显示领域的多种界面外部界面PC常用VGA、DVI、IEEE 1394回顾当前显示领域的多种界面回顾当前显示领域的多种界面 这些界面大多是随着时代进步而不断更新的产物，种类过于繁多，且规范各不统一。随着显示器件的分辨率不断提升，彩色深度不断提升，对于传输驱动信号的界面要求也不断提升，以上这些界面技术已经无法满足需求.HMDIHMDI的诞生的诞生HDMI，英文全称是High Definition Multimedia Interface，中文名称是高清晰多媒体界面的缩写。2002年4月，日立、松下、飞利浦、新力、汤姆逊、东芝和Silicon Image七家公司联合组成HDMI组织，随后发行HDMI标准:2002/12/09V1.02004/05/20V1.12005/08/22V1.22005/12/14V1.2a2006/06/22V1.32006/11/10 V1.3a2007/03/26 V1.3b2010/03/04 V1.4aHMDI Version HistoryHDMI 1.0HDMI 1.1HDMI 1.2HDMI 1.3HDMI 1.3aHDMI 1.3bHDMI 1.4/1.4aInitial SpecificationAdded support for DVD AudioAdded supportIncreases bandwidth to 10.2Gbps(340Mhz)修改Cable and Sink的HDMI C Type 接头主要是修改HDMI 测试规格(HDMI Testing specification),而 HDMI Specification依然是HDMI 1.3a。所以第一次出现当时的主要的HDMI Specification 跟测试规格(HDMI Testing specification)是不同版本的情况发生。HDMI Ethernet Channel Adds high-speed networking to an HDMI link,allowing users to take full advantage of their IP-enabled devices without a separate Ethernet cable.(more)for SACD AudioPermitted PC applications to use only RGB color spaceOffers support for 16-bit color,increased refresh rates(ex.120Hz),support for 1440p/WQXGA resolutionsSource termination recommendationHDMI Testing specification 1.3b 修改部分：Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround audio system,eliminating the need for a separate audio cable.(more)Supported low-voltage(AC-coupled sources)in PCsSupports xvYCC color space standard移除上升时间(rise time)和下降时间(fall time)的最高最低限制1.3b 2007/03/26 Modifications to TE overview and policy description(4.1),Addition of Agilent TDR to Recommended TE(4.2.1.11),Clarification of tentative cable emulators(4.2.1.17)3D Defines input/output protocols for major 3D video formats,paving the way for true 3D gaming and 3D home theater applications.(more)Adds mini connector改变CEC电容限制Jitter tolerance test changes(8-7),Added cable tests for TMDS_CLOCK channel(5-3),New VL triggering(7-2)4K Support Enables video resolutions far beyond 1080p,supporting next-generation displays that will rival the Digital Cinema systems used in many commercial movie theatres.(more)Adds support for Dolby TrueHD and DTS-HD Master Audio standards澄清RGB 影像量化范围Editorial and clarifications on CEC Line Degradation(7-15,8-14),Added testing of additional source-supported Deep Color formats(7-34,)Additional HDMI VSDB EDID checks(8-3)Content Type Real-time signaling of content types between display and source devices,enabling a TV to optimize picture settings based on content type(more)增加CEC指令关于时间及声音控制Additional TTC usage(5-3,8-5,8-6,8-7),Incorporated Tek-recommended setup and calibration for TDR(8-8),Clarification on Sink Deep Color Recommended Test Method(8-25)Additional Color Spaces Adds support for additional color models used in digital photography and computer graphics.(more)同时Released认证的测试规格文件 Added long cable or cable emulator use for Repeater test(9-3),Added color-depths for each format in Source_Video_Formats(App.3),Removed test for filler bytes(8-3),Removed Tektronix part number of cable emulator EFF-HDMI-CE-01 HDMI Micro Connector A new,smaller connector for phones and other portable devices,supporting video resolutions up to 1080p.(more)Automotive Connection System New cables and connectors for automotive video systems,designed to meet the unique demands of the motoring environment while delivering true HD quality.(more)HMDI Version ComparisonHDMI version1.0-1.2a1.31.4Maximum clock rate(MHz)165340340 51Maximum TMDS throughput per channel(Gbit/s)1.653.43.4Maximum total TMDS throughput(Gbit/s)4.9510.210.2Maximum video throughput(Gbit/s)3.968.168.16Maximum audio throughput(Mbit/s)36.8636.8636.86Maximum color depth(bit/px)2448A48Maximum resolution over single link at 24-bit/pxB19201200p60 25601600p75 40962160p24Maximum resolution over single link at 30-bit/pxCN/A25601600p60 40962160p24Maximum resolution over single link at 36-bit/pxDN/A19201200p75 40962160p24Maximum resolution over single link at 48-bit/pxEN/A19201200p60 19201200p60HMDI Version ComparisonHDMI version11.11.21.31.3a1.4 511.2a1.3b1.3b11.3csRGBYesYesYesYesYesYesYCbCrYesYesYesYesYesYes8 channel LPCM,192 kHz,24 bit audio capabilityYesYesYesYesYesYesBlu-ray Disc and HD DVD video and audio at full resolutionFYesYesYesYesYesYesConsumer Electronic Control(CEC)GYesYesYesYesYesYesDVD-Audio supportNoYesYesYesYesYesSuper Audio CD(DSD)supportHNoNoYesYesYesYesDeep ColorNoNoNoYesYesYesxvYCCNoNoNoYesYesYesAuto lip-syncNoNoNoYesYesYesDolby TrueHD bitstream capableNoNoNoYesYesYesDTS-HD Master Audio bitstream capableNoNoNoYesYesYesUpdated list of CEC commandsINoNoNoNoYesYes3D Over HDMINoNoNoNoNoYesEthernet ChannelNoNoNoNoNoYesAudio Return ChannelNoNoNoNoNoYes4k 2k Resolution SupportNoNoNoNoNoYesHMDI 1.4HMDI 1.4新特性新特性HDMI Ethernet Channel Adds high-speed networking to an HDMI link,allowing users to take full advantage of their IP-enabled devices without a separate Ethernet cable.Audio Return Channel Allows an HDMI-connected TV with a built-in tuner to send audio data upstream to a surround audio system,eliminating the need for a separate audio cable.HMDI 1.4新特性新特性4K Support Enables video resolutions far beyond 1080p,supporting next-generation displays that will rival the Digital Cinema systems used in many commercial movie theatres.3D Defines input/output protocols for major 3D video formats,paving the way for true 3D gaming and 3D home theater applications.Content Type Real-time signaling of content types between display and source devices,enabling a TV to optimize picture settings based on content type Additional Color Spaces Adds support for additional color models used in digital photography and computer graphics.HMDI 1.4新特性新特性Automotive Connection System New cables and connectors for automotive video systems,designed to meet the unique demands of the motoring environment while delivering true HD quality.HDMI Micro Connector A new,smaller connector for phones and other portable devices,supporting video resolutions up to 1080pHMDI HMDI Connector&Cable OverviewConnector&Cable OverviewType A:19 Pin /14*4.5*6.8mmType B:29 Pin /21.3*4.55*6.8mmType C(Micro HDMI Conn.):19 Pin /10.5*2.5*5mmHMDI Type A Pin AssignmentsHMDI Contact sequenceHMDI Mechanical PerformanceItemTest ConditionRefre Std.振动振幅:1.52mm P-P or 147 m/S2 15G时间:50200050 HZ in 20 minutes.时间:12 times in each X,Y,Z axes(total 36Times)ANSI/EIA-364-28 Condition III冲击脉波宽度11 msec波形半弦波,490m/S2 50G 3 strokes in each X,Y,Z axes.ANSI/EIA-364-27 Condition A耐久性After tests:Type A:10,000 cycles at 100 50 cycles/HType C:10,000 cycles at 100 50 cycles/H接触阻抗:比原始阻抗变化30M ohms Max，铁壳比原始阻抗变化30M ohms MaxN/A插拔力插拔速度:25mm/minutes拔出力Type A:9.8N1.0kgf Min,39.2N1.0kgf MaxType C:7 N min,25N max插入力44.1N4.5kgf MaxANSI/EIA-364-13Calbe Flex100 Cycle in each of 2 Planes Dimension X=3.7 x Cable Diameter.ANSI/EIA-364-41C,Condition IHMDI Electrical PerformanceItemTest ConditionRefre Std.接触阴抗Mated connectorsContact:Dry circuit,20 mV max,10m AShell:Open circuit,5 V max,100m AANSI/EIA-364-06B介电强度Unmated connectors,aplly 500V AC/Mated 300V AC(RMS)between adjacent terminal and ground.(no Breakdown)ANSI/EIA-364-20C,method A绝缘阻抗Unmated connectors,aplly 500V DC/Mated 150V DC between adjacent terminal and ground.ANSI/EIA-364-21C接触电流定额55oC,Maximum ambient85 oC,Maximum temperature change0.5 A MinANSI/EIA-364-70A应用电流定额40 V AC(RMS.)Continuous max,on any signal pin with respect to the shield.(No Breakdown)NA静电释放Test unmated each connectors form 1KV to 8 KV in 1 kV steps using 8mm ball probe.IEC-801-2TMDS信号时域阻抗Rise tiem 200 psec(10%-90%)ANSI/EIA-364-108TMDS信号时域、串扰Rise tiem 200 psec(10%-90%)ANSI/EIA-364-90HMDI Environmental CharacteristicsItemTest ConditionRefre Std.温度冲击10 cycles of:a).-55 oC for 30 minutes.b).+85 oC for 30 minutes.ANSI/EIA-364-32C温湿度mated connectors together:+25 +85 oC,相对湿度:80 95%,持继:4 Cycles(96 H)ANSI/EIA-364-31B端子老化Expose to+105 2 oC for 250 Hours,ANSI/EIA-364-17B,Condition B,Method AHMDI Cable Assy TMDS ParametersType A ReceptacleType A ReceptacleThe shell shall have springs for locking.Additional springs may be used for EMI reduction.The spring property for locking shall be activated by the locking hole of the plug shell.Type A PulgThe dimension of*13.9mm(+0.04/-0.05)(on main diction)should be measured at the point*7mm(on view D).The taper(on view D)shall be one degree max.Cable Adapter type A to type APinAssignmentCable Adapter type A to type BPinPinAssignmentAssignmentCable Adapter type A to type CPinPinAssignmentAssignmentHMDI 1.4制程简介制程简介1裁线裁线治工具裁线刀工作说明将线裁成长度为15154mm。注意事项1.裁线尺寸应在公差范围内.2.应检查线材有无来料不良情况如:刮伤线径、外被凸起、外被异色、表面斑点等.工作说明将线材绕成圈状,两端各留400mm REF,将线圈套入PE袋内,袋口处以魔带束紧,以利后段作业.HMDI 1.4HMDI 1.4制程简介制程简介2 2绕线绕线注意事项1.应检查线材有无来料不良等情形如:刮伤线经、外被凸起、外被异色、外被扭曲等.2.扎魔带时,不可扎太紧,以免使线材变形.握线材距去皮机约50mm处,线端顶住顶杆,脚踩开关,将两端外被去皮231mm.1.线材去皮时线端务必确实顶住顶杆,且与刀片保持垂直,不可歪斜.2.去皮处端面须平正,不可凹凸不平,且去皮尺寸须在规格范围内.3.去皮时不可伤及外被与芯线.4.注意安全(单人单机操作).HMDI 1.4HMDI 1.4制程简介制程简介3 3两端外被去皮两端外被去皮28工作说明两端编织360度均匀后翻于外被上,将铝箔齐外被去皮处撕净.注意事项1.编织须360度均匀后翻于外被上.2.挑铝箔时,不可伤及色线及外被.3.铝箔须齐外被切口处撕净.HMDI 1.4HMDI 1.4制程简介制程简介4 4两端编织整理两端编织整理29工作说明两端PP带捻成一股后翻于外被上,在外被去皮处贴W5*L60mm*2PCS的铜箔于编织及PP带上.注意事项1.铜箔须贴紧,不可松脱.2.PP带及编织不可散乱.HMDI 1.4HMDI 1.4制程简介制程简介5 5两端贴铝箔两端贴铝箔工作说明将两端铝箔麦拉齐外被去皮处留4.04.5mm刺破摇断.注意事项1.刺铝箔麦拉时,不可刺伤对线的绝缘皮.2.摇断铝箔麦拉时动作幅度不要超出30度,以免伤及发泡PE.3.去好铝箔麦拉后,不可有掐伤、折伤及割伤发泡PE.4.铝箔麦拉去留尺寸须正确.4.0-4.5HMDI 1.4HMDI 1.4制程简介制程简介6 6去铝箔麦拉去铝箔麦拉工作说明将两端铝箔麦拉拔掉,并将对线之地线分别捻紧.注意事项1.地线不可散乱,须捻紧.2.捻地线时,注意不可弄散铝箔麦拉.HMDI 1.4HMDI 1.4制程简介制程简介7 7捻地线捻地线工作说明将两端各对线之地线套0.6*L15mm*8PCS的套管,再于两端铝箔麦拉切口处对半套1.5*L6mm*8PCS的套管.注意事项1.不可漏套及套错套管.HMDI 1.4HMDI 1.4制程简介制程简介8 8套套管套套管工作说明将两端各对线之地线套管及铝箔麦拉切口处的套管烘紧.注意事项1.不可烘伤绝缘皮,且烘套管后发泡PE不可变形.2.将两端向下套管只须不脱落即可,不可烘的过紧.3.手指不可离热烘机口过近,以免烫伤.HMDI 1.4HMDI 1.4制程简介制程简介9 9烘套管烘套管工作说明依DWG-2线位依序将各对线、对线之地线及色线整齐排列至扁平电缆治具上定位.治工具扁平电缆治具注意事项1.扁平电缆后外被去皮处至扁平电缆治具前端的尺寸为11mm Max.2.扁平电缆时,不可用指甲掐伤及压伤绝缘皮,且发泡PE不可变形.3.扁平电缆后,线材外被与治具手柄部分须平行.4.扁平电缆时不可有绞线现象.1#19#HMDI 1.4HMDI 1.4制程简介制程简介10 10PIN10 10PIN扁平电缆扁平电缆工作说明先将各对线、对线之地线及色线至治具前端裁留4.55.5mm,再各色线及对线去皮2.12.5mm.治工具芯线去皮机/镊子注意事项1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.注意安全(单人单机操作).2.12.5mm4.55.5mmHMDI 1.4HMDI 1.4制程简介制程简介1111芯线去皮芯线去皮工作说明将10PIN各色线、对线及地线沾适量的锡.治工具温控锡炉/镊子/挑针注意事项1.沾锡时色线、对线及地线须与炉面垂直.2.沾锡时不可烫伤套管及绝缘皮.3.沾锡后发泡PE及绝缘皮不可有后缩及变形现象.4.沾锡时间为:0.5-1.0s.5.沾锡前先将温度达到32030,待锡完全溶解后,将操作温作调为28010.HMDI 1.4HMDI 1.4制程简介制程简介12 10PIN12 10PIN沾锡沾锡37工作说明将10PIN端子置于铆压治具上定位,再将各对线、对线之地线及色线与端子铆合.治工具端子机/镊子注意事项1.欲打端子之色线置入端子机下刀模滑块承座上,线端务必保持平齐,且置入深度及打包位置需正确.2.手指不可离刀模太近.3.Ppk1.67或Cpk1.33,当CPK1.33时停线,并知会工务调机.HMDI 1.4HMDI 1.4制程简介制程简介1313铆铆10PIN10PIN端子端子38工作说明依DWG-1线位依序将各对线、对线之地线及色线整齐排列至扁平电缆治具上定位.治工具扁平电缆治具注意事项1.扁平电缆后外被去皮处至扁平电缆治具前端的尺寸为11mm Max.2.扁平电缆时,不可用指甲掐伤及压伤绝缘皮,且发泡PE不可变形.3.扁平电缆后,线材外被与治具手柄部分须平行.4.扁平电缆时不可有绞线现象.2#18#18#2#HMDI 1.4HMDI 1.4制程简介制程简介14 9PIN14 9PIN扁平电缆扁平电缆39工作说明先将各对线、对线之地线及色线至治具前端裁留4.55.5mm,再各色线及对线去皮2.12.5mm.治工具芯线去皮机/镊子注意事项1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.注意安全(单人单机操作).2.12.5mm4.55.5mmHMDI 1.4HMDI 1.4制程简介制程简介15 9PIN15 9PIN芯线去皮芯线去皮40工作说明将9PIN各色线、对线及地线沾适量的锡.治工具温控锡炉/镊子/挑针注意事项1.各色线及对线的去皮尺寸须正确.2.色线及对线去皮时不可去断芯线,且不可夹伤发泡PE及色线.3.各色线及对线去皮后芯线不可散乱.4.注意安全(单人单机操作).HMDI 1.4HMDI 1.4制程简介制程简介16 9PIN16 9PIN沾锡沾锡41工作说明将9PIN端子置于铆压治具上定位,再将各对线、对线之地线及色线与端子铆合.治工具端子机/镊子注意事项1.欲打端子之色线置入端子机下刀模滑块承座上,线端务必保持平齐,且置入深度及打包位置需正确.2.手指不可离刀模太近.3.Ppk1.67或Cpk1.33,当CPK1.33时停线,并知会工务调机.HMDI 1.4HMDI 1.4制程简介制程简介1717铆铆9PIN9PIN端子端子42工作说明先将HOUSING插入母端插座内,再先于10PIN端子两凸点面装一铁片,再一起与9PIN的有凹点面合在一起并捏到位,然后将组合好的端子插入装好母端插座的HOUSING内并拔出母座,然后将两侧铁片压平.治工具HDMI母端插座/挑针注意事项1.端铁片前须检查PIN针是否在同一直在线.2.不可漏装铁片.3.端子须完全插到位.4.插端子时,不可使端子变形.HMDI 1.4HMDI 1.4制程简介制程简介1818插端子插端子43工作说明用放大镜检查各端子是否不良治工具放大镜/烙铁注意事项1.挑出不良品,并标示不良情形,置于红箱内,待修理.2.将不良情形详细记录于不良记录日报表中.3.不良情形回应于前序工站.4.产线须轻拿轻放.5.烙铁温度为:38030.6.每一个小时更换一次海绵,清理一次锡渣.7.焊35点须擦拭一下烙铁头.8.点检烙铁温度后,将烙铁温度记录于烙铁温度管控表中.9.焊锡人员须有技术合格证才可上岗.HMDI 1.4HMDI 1.4制程简介制程简介1919检查端子检查端子44工作说明沿两端CONN塑料边缘贴W11*L80mm*2PCS的黄色透明无卤胶带,以包覆锡点及色线.注意事项1.贴胶带前须将各对线及色线理顺后再贴胶带.2.不可漏贴胶带,且胶带须完全包覆锡点及色线,并贴紧.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修理.4.产线须轻拿轻放.HMDI 1.4HMDI 1.4制程简介制程简介2020贴胶带贴胶带45工作说明组装上下铁壳并使之密合,并置于铆压治具内铆压.治工具铆压机/尖嘴钳注意事项1.铆压时位置须正确,不可歪斜;不可伤及外被,铁壳不能变形.2.IPQC应严把此关,以防铆压的高宽度尺寸超出公差范围,导致线径脱落或头部在受力过大的情况下会出现芯线有断裂现象.3.注意安全(单人单机操作).4.铆压高宽度为:W=7.900.10mm;H=6.900.10mm.HMDI 1.4HMDI 1.4制程简介制程简介2121装铆铁壳装铆铁壳46工作说明测试是否有错位、短路、断路及电阻大等情形,直流电阻:2.0 Max.,绝缘阻抗:10M/300V DC.注意事项1.测试机参数需设定正确(详见测试参数设定表).2.做电气测试前先由IPQC拿一条NG品和一条OK品检测测试机是否OK.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修理.4.将不良情形详细记录于不良记录日报表中.5.不良情形及时回应于前序工站HMDI 1.4HMDI 1.4制程简介制程简介22 T122 T1测试测试47工作说明两端PP带齐铁壳边沿剪净,编织齐铁壳末端剪留34mm,再将编织前翻于铁壳上360度加锡焊接.注意事项1.PP带须齐铁壳边沿剪净,且两端编织剪留尺寸须正确,且剪编织时不可伤及外被.2.烙铁温度为:40050.3.每小时更换一次海棉,清理一次锡渣.4.焊12PCS需擦拭一下烙铁头.5.点检烙铁温度后,将烙铁温度记录于烙铁温度管控表中.34mmHMDI 1.4HMDI 1.4制程简介制程简介2323剪焊编织剪焊编织48工作说明将两端铁壳上的锡油及锡渣清洗干净.注意事项1.铁壳上之锡油及锡渣擦拭干净.HMDI 1.4HMDI 1.4制程简介制程简介2424擦拭铁壳擦拭铁壳49工作说明两端内模成型治工具成型机注意事项1.架好模具,设定好成型参数2.内模成型后,不可有刮压铁壳、冲胶、不饱模等不良情形.3.成型时,成型条件要设定确实.4.注意安全(单人单机操作).HMDI 1.4HMDI 1.4制程简介制程简介2525内模成型内模成型50工作说明测试是否有短路、断路、电阻大等情形.直流电阻:2.0 Max.,绝缘阻抗:10M/300V DC.治工具CIRRIS 1000H+注意事项1.测试机参数需设定正确.2.做电气测试前先由IPQC拿一条NG品和一条OK品检测测试机是否OK.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修理.4.将不良情形详细记录于不良记录日报表中.5.不良情形实时回应于前序工站.HMDI 1.4HMDI 1.4制程简介制程简介26 T226 T2测试测试51工作说明两端外模成型治工具成型机注意事项1.架好模具,设定好成型参数.2.外模成型后,不可有刮压铁壳、流纹、缩水、不饱模、沾异色等不良情形.3.成型时,成型条件要设定确实.4.注意安全(单人单机操作).HMDI 1.4HMDI 1.4制程简介制程简介2727外模成型外模成型52工作说明将两端外模进料点及铁壳处的毛边修剪干净,并检查两端外观.注意事项1.修毛边时,不可刮伤铁壳及线径.2.挑出不良品,并用不良卷标指示不良位置,置于红桶内,待修理.3.外观判定依照品管提供之标准作业.HMDI 1.4HMDI 1.4制程简介制程简介2828修毛边修毛边53工作说明测试是否有短路、断路、电阻大及瞬间接触不良等情形.直流电阻:2.0 Max.,绝缘阻抗:10M/300V DC.治工具CIRRIS 1000H+注意事项1.测试机参数需设定正确.2.做电气测试前先由IPQC拿一条NG品和一条OK品检测测试机是否OK.3.挑出不良品,并挂牌标示不良情形,置于红箱内,待修理.4.将不良情形详细记录于不良记录日报表中.5.不良情形实时回应于前序工站HMDI 1.4HMDI 1.4制程简介制程简介29 T329 T3测试测试54工作说明量测成品总长,并将线径上的污脏擦拭干净.注意事项1.量测的尺寸须在公差范围内.2.挑出不良品,并用不良卷标指示不良位置,置于红箱内,待修理.治工具量线治具/白布HMDI 1.4HMDI 1.4制程简介制程简介3030量线量线55工作说明将成品绕成圈状,线圈以一魔带束紧.注意事项1.魔带须束紧,不可松脱.2.绕线圈数共4圈,绕线尺寸详见下图.3.绕线时不可扭曲线材.HMDI 1.4HMDI 1.4制程简介制程简介3131扎魔带扎魔带56工作说明终检注意看外观、修毛边及擦拭污脏.注意事项1.挑出不良品,并挂牌标示不良情形,置于红箱内,待修理.2.外观判定依照品管提供之标准作业.HMDI 1.4HMDI 1.4制程简介制程简介3232终检终检57工作说明将成品按包装规范包装好.注意事项1.装箱数量应正确,成品须摆放整齐.2.封胶带时应严格按照纸箱封贴步骤将纸箱封好.HMDI 1.4HMDI 1.4制程简介制程简介3333装箱装箱58Thanks for your attention给别人以惊喜，给自己新天地