计算机英文术语完全介绍.pdf

（计算机）英文术语完全介绍二、英文术语完全介绍在每组术语中，我按照英文字母的排列顺序来分类。1、C PU 3DNow!（3D no waiting,无须等待的 3D 处理）AAM（AMD Analyst Meeting,AMD 分析家会议）ABP（Advanced Branch Prediction,高级分支预测）AC G（Aggressive C lock Gating,主动时钟选择）AIS（Alternate Instruction Set,交替指令集）ALAT（advanced load table,高级载入表）ALU（ArithmeticLogic Unit,算术逻辑单元）Aluminum（铝）AGU（AddressGeneration Units,地址产成单元）APC （Advanced PowerC ontrol,高级能源控制）APIC （Advanced rogrammableInterrupt C ontroller,高级可编程中断控制器）APS（Alternate Phase Shifting,交替相位跳转）ASB（Advanced System Buffering,高级系统缓冲）ATC（Advanced Transfer C ache,高级转移缓存）ATD（AssemblyTechnology Development,装配技术发展）BBUL（BumplessBuild-Up Layer,内建非凹凸层）BGA（Ball Grid Array,球状网阵排列）BHT（branch prediction table,分支预测表）Bops（Billion Operations Per Second,10 亿操作/秒）BPU（Branch Processing Unit,分支处理单元）BP（Brach Pediction,分支预测）BSP（Boot Strap Processor,启动捆绑处理器）BTAC （Branch Target AddressC alculator,分支目标寻址计算器）C BGA（C eramic BallGrid Array,陶瓷球状网阵排列）C DIP（C eramicDual-In-Line,陶瓷双重直线）C enter Processing UnitUtilization,中央处理器占用率 C FM（cubic feet perminute,立方英尺/秒）C MT（course-grainedmultithreading,过程消除多线程）C MOS（C omplementaryMetal Oxide Semiconductor,互补金属氧化物半导体）C MOV（conditional move instruction,条件移动指令）C ISC（C omplex Instruction Set C omputing,复杂指令集计算机）C LK（C lock C ycle,时钟周期）C MP（on-chipmultiprocessor,片内多重处理）C MS（C ode MorphingSoftware,代码变形软件）co-C PU（cooperative C PU,协处理器）C OB（C ache on board,板上集成缓存，做在C PU卡上的二级缓存，通常是内核的一半速度）C OD（C ache onDie,芯片内核集成缓存）C opper（铜）C PGA（C eramic PinGrid Array,陶瓷针型栅格阵列）C PI（cycles perinstruction,周期/指令）C PLD（C omplex ProgrammableLogic Device,禊雄可程式化暹申苣元件）C PU（C enterProcessing Unit,中央处理器）C RT（C ooperativeRedundant Threads,协同多余线程）C SP（C hip ScalePackage,芯片比例封装）C XT（C hooper eXTend,增强形K6-2 内核，即 K6-3）Data Forwarding（数据前送）dB（decibel,分贝）DC LK（Dot C lock,点时钟）DC T（DRAMC ontroller,DRAM 控制器）DDT（Dynamic DeferredTransaction,动态延期处理）Decode（指令解码）DIB（DualIndependent Bus,双重独立总线）DMT（DynamicMultithreading Architecture,动态多线程结构）DP（DualProcessor,双处理器）DSM（Dedicated Stack Manager,专门堆栈管理）DSMT（Dynamic SimultaneousMultithreading,动态同步多线程）DST（DepletedSubstrate Transistor,衰竭型底层晶体管）DTV（DualThreshold Voltage,双重极限电压）DUV（DeepUltra-Violet,纵深紫外光）EBGA（Enhanced Ball GridArray,增强形球状网阵排列）EBL（electron beamlithography,电子束平版印刷）EC （Embedded C ontroller,嵌入式控制器）EDEC （Early Decode,早期解码）EmbeddedC hips（嵌入式）EPA（edge pin array,边缘针脚阵列）EPF（Embedded Processor Forum,嵌入式处理器论坛）EPL（electron projection lithography,电子发射平版印刷）EPM（Enhanced Power Management,增强形能源管理）EPIC（explicitly parallel instruction code,并行指令代码）EUV（Extreme Ultra Violet,紫外光）EUV（extremeultraviolet lithography,极端紫外平版印刷）FADD（Floationg Point Addition,浮点加）FBGA（Fine-PitchBall Grid Array,精细倾斜球状网阵排列）FBGA（flipchipBGA,轻型芯片 BGA）FC-BGA（Flip-C hip Ball Grid Array,反转芯片球形栅格阵列）FC-LGA（Flip-C hip Land GridArray,反转接点栅格阵列）FC-PGA（Flip-C hip Pin GridArray,反转芯片针脚栅格阵列）FDIV（Floationg PointDivide,浮点除）FEMMS：Fast Entry/Exit MultimediaState,快速进入/退出多媒体状态FFT（fast Fouriertransform,快速热欧姆转换）FGM（Fine-GrainedMultithreading,高级多线程）FID（FID：Frequencyidentify,频率鉴别号码）FIFOC First Input First Output,先入先出队列）FISC （Fast Instruction Set C omputer,快速指令集计算机）flip-chip（芯片反转）FLOPs（Floating Point Operations Per Second,浮点操作/秒）FMT（fine-grained multithreading,纯消除多线程）FMUL（Floationg Point Multiplication,浮点乘）FPRs（floating-point registers,浮点寄存器）FPU（FloatPoint Unit,浮点运算单元）FSUB（Floationg PointSubtraction,浮点减）GFD（Gold finger Device,金手指超频设备）GHC （Global History C ounter,通用历史计数器）GTL（Gunning Transceiver Logic,射电收发逻辑电路）GVPP（Generic Visual Perception Processor,常规视觉处理器）HL-PBGA:表面黏著，高耐热、轻薄型塑胶球状网阵封装 HTT（Hyper-Threading Technology,超级线程技术）Hz（hertz,赫兹，频率单位）IA（IntelArchitecture,英特尔架构）IAA（Intel ApplicationAccelerator,英特尔应用程序加速器）IC U（InstructionC ontrol Unit,指令控制单元）ID（identify,鉴别号码）IDF（Intel Developer Forum,英特尔开发者论坛）IEU（Integer Execution Units,整数执行单元）IHS（Integrated Heat Spreader,完整热量扩展）ILP（Instruction Level Parallelism,指令级平行运算）IMM:Intel Mobile Module,英特尔移动模块 InstructionsC ache,指令缓存 Instruction C oloring（指令分类）IOPs（Integer Operations Per Second,整数操作/秒）IPC（Instructions Per C lock C ycle,指令/时钟周期）ISA（instruction set architecture,指令集架构）ISD（inbuilt speed-throttling device,内藏速度控制设备）ITC （Instruction Trace C ache,指令追踪缓存）ITRS（International Technology Roadmap forSemiconductors,国际半导体技术发展蓝图）KNI（KatmaiNew Instructions,Katmai 新指令集，即 SSE）Latency（潜伏期）LDT（Lightning Data Transport,闪电数据传输总线）LFU（Legacy Function Unit,传统功能单元）LGA（landgrid array,接点栅格阵列）LN2（Liquid Nitrogen,液氮）Local Interconnect（局域互连）MAC（multiply-accumulate,累积乘法）mBGA（Micro Ball GridArray,微型球状网阵排列）nm（namometer,十亿分之一米/毫微米）MC A（machine check architecture,机器检查体系）MC U（Micro-C ontroller Unit,微控制器单元）MC T（Memory C ontroller,内存控制器）MESI（Modified,Exclusive,Shared,Invalid：修改、排除、共享、废弃）MF（MicroOps Fusion,微指令合并）mm（micron metric,微米）MMX（MultiMedia Extensions,多媒体扩展指令集）MMU（Multimedia Unit,多媒体单元）MMU（MemoryManagement Unit,内存管理单元）MN（model numbers,型号数字）MFLOPS（Million Floationg Point/Second,每秒百万个浮点操作）MHz（megahertz,兆赫）mil（PC B或晶片怖局的艮度军位，1 mil二千分之一英寸）MIPS（Million Instruction Per Second,百万条指令/秒）MOESI（Modified,Owned,Exclusive,Shared or Invalid,修改、自有、排除、共享或无效）MOF（Micro Ops Fusion,微操作熔合）Mops（Million Operations Per Second,百万次操作/秒）MP（Multi-Processing,多重处理器架构）MPF（Micro processor Forum,微处理器论坛）MPU（Microprocessor Unit,微处理器）MPS（MultiProcessorSpecification,多重处理器规范）MSRs（Model-SpecificRegisters,特别模块寄存器）MSV（MultiprocessorSpecification Version,多处理器规范版本）NAOC（no-account OverC lock,无效超频）NI（Non Intel,非英特尔）NOP（no operation,非操作指令）NRE（Non-Recurring Engineering charge,非重性工程费用）OBGA（Organic Ball Grid ArraL 有机球状网阵排列）OC PL（Off C enter Parting Line,远离中心部分线队列）OLGA（Organic Land Grid Array,有机平面网阵包装）OoO（Outof Order,乱序执行）OPC （Optical Proximity C orrection,光学临近修正）OPGA（Organic Pin Grid Array,有机塑料针型栅格阵列）OPN（Ordering Part Number,分类零件号码）PAT（Performance Acceleration Technology,性能加速技术）PBGA（Plastic Pin Ball Grid Array,塑胶球状网阵排列）PDIP（Plastic Dual-In-Line,塑料双重直线）PDP（Parallel Data Processing,并行数据处理）PGA（Pin-Grid Array,引脚网格阵列），耗电大 PLC C （PlasticLeaded C hip C arriers,塑料行间芯片运载）Post-RISC （加速 RISC,或后 RISC）PR（Performance Rate,性能比率）PIB（Processor In a Box,盒装处理器）PM（Pseudo-Multithreading,假多线程）PPGA（Plastic PinGrid Array,塑胶针状网阵封装）PQFP（Plastic Quad FlatPackage,塑料方块平面封装）PSN（Processor Serialnumbers,处理器序列号）QFP（Quad Flat Package,方块平面封装）QSPS（Quick Start Power State,快速启动能源状态）RAS（Return Address Stack,返回地址堆栈）RAW（Read after Write,写后读）REE（Rapid ExecutionEngine,快速执行引擎）Register C ontention（抢占寄存器）Register Pressure（寄存器不足）Register Renaming（寄存器重命名）Remark（芯片频率重标识）Resourcecontention（资源冲突）Retirement（指令引退）RISC（Reduced Instruction Set C omputing,精简指令集计算机）ROB（Re-Order Buffer,重排序缓冲区）RSE（registerstack engine,寄存器堆栈引擎）RTL（Register TransferLevel,暂存器斡换眉。硬it描述 言的一槿描述眉次）SC 242（242-contact slot connector,242 脚金手指插槽连接器）SE（Special Embedded,特别嵌入式）SEC （SingleEdge C onnector,单边连接器）SEC C （Single Edge C ontactC artridge,单边接触卡盒）SEPP（Single Edge ProcessorPackage,单边处理器封装）Shallow-trench isolation（浅槽隔离）SIMD（Single Instruction Multiple Data,单指令多数据流）SiO2F（Fluorided Silicon Oxide,二氧氟化硅）SMI（System Management Interrupt,系统管理中断）SMM（System Management Mode,系统管理模式）SMP（Symmetric Multi-Processing,对称式多重处理架构）SMT（Simultaneous multithreading,同步多线程）SOI（Silicon-on-insulator,绝缘体硅片）SOIC （PlasticSmall Outline,塑料小型）SONC （System on a chip,系统集成芯片）SPGA（Staggered Pin Grid Array 交错式针状网阵封装）SPEC （System Performance EvaluationC orporation,系统性能评估测试）SQRT（Square RootC alculations,平方根计算）SRQ（System Request Queue,系统请求队列）SSE（Streaming SIMD Extensions,单一指令多数据流扩展）SFF（Small form Factor,更小外形格局）SS（Special Sizing,特殊缩放）SSP（Slipstreamprocessing,滑流处理）SST（Special Sizing Techniques,特殊筛分技术）SSOP（Shrink Plastic Small Outline,缩短塑料小型）STC （Space Time C omputing,空余时间计算）Superscalar（超标量体系结构）TAP（Test AccessPort,测试存取端口）TBGA（Tie Ball Grid Array,带状球形光栅阵列）TC P:Tape C arrier Package（薄膜封装），发热小TDP（Thermal Design Power,热量设计功率）Throughput（吞吐量）TLB（Translate Look side Buffers,转换旁视缓冲器）TLP（Thread-Level Parallelism,线程级并行）TMP（Threaded Multi-Path,线程多通道）TPI（True Performance Initiative/index,真实性能为先/指标）TQFP（Thin Plastic Quad Flat Pack,薄型方面平面封装）Tre（Row C ycle Time,列循环时间）TrD（TransistorDensity,晶体管密度）TSOP（Thin Small Outline Plastic,薄型小型塑料）USWC （Uncacheabled Speculative WriteC ombination,无缓冲随机联合写操作）VALU（VectorArithmetic Logic Unit,向量算术逻辑单元）VFSD（VertexFrequency Stream Divider,顶点频率流分隔）VID（VID：Voltage identify,电压鉴别号码）VLIW（Very LongInstruction Word,超长指令字）VPU（Vector PermutateUnit,向量排列单元）VPU（vector processing units,向量处理单元，即处理MMX、SSE等 SIMD指令的地方）VSA（Virtual System Architecture,虚拟系统架构）VTF（VIATechnical Forum,威盛技术论坛）XBar（C rossbar,交叉口闩仲载逻辑单元）XP（Experience,体验）XP（Extraperformance,额外性能）XP（eXtreme Performance,极速性能）散热器TFT（Tiny Fin Technology,微型鳍片技术）2、主板 3GI0（Third Generation Input/Output,第三代输入输出技术）AC R（Advanced C ommunications Riser,高级通讯升级卡）ADIMM（advanced Dual In-line MemoryModules,高级双重内嵌式内存模块）AGTL+（AssistedGunning Transceiver Logic,援助发射接收逻辑电路）AHC I（Advanced Host C ontroller Interface,高级主机控制器接口）AIMM（AGP Inline Memory Module,AGP 板上内存升级模块）AMR（Audio/Modem Riser；音效/调制解调器主机板附加直立插卡）AHA（Accelerated Hub Architecture,加速中心架构）AOI（Automatic Optical Inspection,自动光学检验）APU（Audio Processing Unit,音频处理单元）ARF（Asynchronous Receive FIFO,异步接收先入先出）ASF（Alert Standards Forum,警告标准讨论）ASK IR（Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线）AT（Advanced Technology,先进技术）ATX（ATExtend,扩展型 AT）BIOS（Basic Input/Output System,基本输入/输出系统）C NR（C ommunication and NetworkingRiser,通讯和网络升级卡）C SA（C ommunication StreamingArchitecture,通讯流架构）C SE（C onfiguration SpaceEnable,可分配空间）C OAST（C ache-on-a-stick,条状缓存）DASP（Dynamic Adaptive Speculative Pre-Processor,动态适应预测预处理器）DB:Device Bay,设备插架DMI（Desktop Management Interface,桌面管理接口）DOT（Dynamic Overclocking Technonlogy,动态超频技术）DPP（direct print Protocol,直接打印协议 DRC G（DirectRambus clock generator,直接 RAMBUS 时钟发生器）DVMT（Dynamic Video Memory Technology,动态视频内存技术）E（Economy,经济，或 Entry-level,入门级）EB（ExpansionBus,扩展总线）EFI（Extensible Firmware Interface,扩展固件接口）EHC I（Enhanced Host C ontrollerInterface,加强型主机端控制接口）EISA（EnhancedIndustry Standard Architecture,增强形工业标准架构）EMI（Electromagnetic Interference,电磁干扰）ESC D（Extended System C onfiguration Data,可扩展系统配置数据）ESR（Equivalent Series Resistance,等价系列电阻）FBC （Frame Buffer C ache,帧缓冲缓存）FireWire（火线，即 IEEE139 4 标准）FlexATX（Flexibility ATX,可扩展性 ATX）FSB（Front Side Bus,前端总线）FWH（Firmware Hub,固件中心）GBC Garibaldi 架构，Garibaldi基于ATX架构，但是也能够使用WTX构架的机箱）GMC H（Graphics&Memory C ontroller Hub,图形和内存控制中心）GPA（Graphics Performance Accelerator,图形性能加速卡）GPIs（General Purpose Inputs,普通操作输入）GTL+（Gunning Transceiver Logic,发射接收逻辑电路）HDIT（High Bandwidth Differential InterconnectTechnology,高带宽微分互连技术）HSLB（High Speed LinkBus,高速链路总线）HT（HyperTransport,超级传输）12c（Inter-IC）I2C （Inter-Integrated C ircuit,内置集成电路）IA（Instantly Available,即时可用）IBASES（IntelBaseline AGP System Evaluation Suite,英特尔基线 AGP系统评估套件）IC （integrate circuit,集成电路）IC H（Input/Output C ontroller Hub,输入/输出控制中心）IC H-S（IC H-Hance Rapids,IC H 高速型）IC P（IntegratedC ommunications Processor,整合型通讯处理器）IHA（IntelHub Architecture,英特尔 Hub 架构）I MB（Inter ModuleBus,隐藏模块总线）INTIN（Interrupt Inputs,中断输入）IPMAT（Intel Power Management Analysis Tool,英特尔能源管理分析工具）IR（infrared ray,红外线）IrDA（infrared ray,红外线通信接口，可进行局域网存取和文件共享）ISA（Industry Standard Architecture,工业标准架构）ISA（instruction set architecture,工业设置架构）K8HTB（K8 HyperTransport Bridge,K8 闪电传输桥）LSI（Large Scale Integration,大规模集成电路）LPC （LowPin C ount,少针脚型接口）MAC （Media Access C ontroller,媒体存储控制器）MBA（manage boot agent,管理启动代理）MC （Memory C ontroller,内存控制器）MC A（MicroC hannel Architecture,微通道架构）MC H（MemoryC ontroller Hub,内存控制中心）MDC （Mobile DaughterC ard,移动式子卡）Mil（Media Independent Interface,媒体独立接口）MIO（Media I/O,媒体输入/输出单元）MOSFET（metallic oxide semiconductor fieldeffecttransistor,金属氧化物半导体场效应晶体管）MRH-R（Memory Repeater Hub,内存数据处理中心）MRH-S（SDRAM Repeater Hub,SDRAM 数据处理中心）MRIMM（Media-RIMM,媒体 RIMM 扩展槽）MSI（Message SignaledInterrupt,信息信号中断）MSPC E（Multiple Streams withPipelining and C oncurrent Execution,多重数据流的流水线式传输与并发执行）MT二MegaTransfers（兆传输率）MTH（Memory Transfer Hub,内存转换中心）MuTIOL（Multi-Threaded I/O link,多线程 I/O 链路）NC Q（NativeC ommand Qu,本地命令序列）NGIO（Next GenerationInput/Output,新一代输入/输出标准）NPPA（nForcePlatform Processor Architecture,nForce 平台处理架构）OHC I（Open Host C ontroller Interface,开放式主控制器接口）ORB（operation request block,操作请求块）ORS（Over Reflow Soldering,再流回焊接，SMT元件的焊接方式）P6 4H（6 4-bit PC I C ontroller Hub,6 4 位 PC I 控制中心）PC B（printed circuit board,印刷电路板）PC BA（Printed C ircuit Board Assembly,印刷电路板装配）PC I（Peripheral C omponent Interconnect,互连外围设备）PC I SIG（Peripheral C omponent Interconnect SpecialInterest Group,互连外围设备专业组）PDD（PerformanceDriven Design,性能驱动设计）PHY（Port Physical Layer,端口物理层）POST（Power On Self Test,加电自测试）PS/2（Personal System 2,第二代个人系统）PTH（Plated-Through-Hole technology,镀通孔技术）REC ReadEnable,可读取）QP（Quad-Pumped,四倍泵）RBB（RapidBIOS Boot,快速 BIOS 启动）RNG（Random number Generator,随机数字发生器）RTC （Real Time C lock,实时时钟）KBC（KeyBroad C ontrol,键盘控制器）SAP（Sideband AddressPort,边带寻址端口）SBA（Side Band Addressing,边带寻址）SBC （single board computer,单板计算机）SBP-2（serial bus protocol 2,第二代串行总线协协）SC I（Serial C ommunications Interface,串行通讯接口）SC K（C MOS clock,C MOS 时钟）SDU（segment data unit,分段数据单元）SFF（Small form Factor,小尺寸架构）SFS（Stepless Frequency Selection,步进频率选项）SMA（Share Memory Architecture,共享内存结构）SMT（Surface Mounted Technology,表面黏贴式封装）SPI（Serial Peripheral Interface,串行外围设备接口）SSLL（Single Stream with Low Latency,低延迟的单独数据流传输）STD（Suspend To Disk,磁盘唤醒）STR（SuspendTo RAM,内存唤醒）SVR（Switching Voltage Regulator,交换式电压调节）THT（Through Hole Technology,插入式封装技术）UC HI（Universal Host C ontroller Interface,通用宿主控制器接口）UPA（Universal PlatformArchitecture,统一平台架构）UPDG（Universal PlatformDesign Guide,统一平台设计导刊）USART（UniversalSynchronous Asynchronous Receiver Transmitter,通用同步非同步接收传送器）USB（Universal Serial Bus,通用串行总线）USDM（Unified System Diagnostic Manager,统一系统监测管理器）VID（Voltage IdentificationDefinition,电压识别认证）VLB（Video ElectronicsStandards Association Local Bus,视频电子标准协会局域总线）VLSI（Very Large Scale Integration,超大规模集成电路）VMAP（VIA Modular Architecture Platforms,VIA模块架构平台）VSB（V Standby,待命电压）VXBC VirtualExtended Bus,虚拟扩展总线）VRM（Voltage RegulatorModule,电压调整模块）WC T（Wireless C onnectTechnology,无线连接技术）WE（Write Enalbe,可写入）WS（Wave Soldering,波峰焊接，THT元件的焊接方式）XT（Extended Technology,扩充技术）ZIF（Zero InsertionForce,零插力插座）芯片组 AC PI（Advanced C onfigurationand Power Interface,先进设置和电源管理）AGP（Accelerated Graphics Port,图形加速接口）BMS（BlueMagic Slot,蓝色魔法槽）I/O（Input/Output,输入/输出）MIOC:Memory and I/O Bridge C ontroller,内存和I/O 桥控制器 NBC:North Bridge C hip（北桥芯片）PIIX:PC I ISA/IDE Accelerator（加速器）PSE36:Page SizeExtension 36 bit,36 位页面尺寸扩展模式PXB:PC IExpander Bridge,PC I 增强桥 RC G:RAS/C AS Generator,RAS/C AS 发生器 SBC:South Bridge C hip（南桥芯片）SMB（System Management Bus,全系统管理总线）SPD（SerialPresence Detect,连续存在检测装置）SSB:Super SouthBridge,超级南桥芯片TDP:Triton DataPath（数据路径）TSC:Triton System C ontroller（系统控制器）QPA:QuadPort Acceleration（四接口加速）主板技术 Gigabyte AC OPS:Automatic C PU OverHeat Prevention System（C PU 过热预防系统）SIV:System Information Viewer（系统信息观察）磐英 ESDJ（Easy Setting Dual Jumper,简化 C PU 双重跳线法）浩鑫 UPT（USB、PANEL LINK、TV-OUT 四重接口）华硕 C.0.P（C PU overheating protection,处理器过热保护）3、显示设备AD（Analog to Digitalg,模拟到数字转换）ADC （Apple Display C onnector,苹果专用显示器接口）AGC （Anti Glare C oatings,防眩光涂层）AMR（ATiMulti-Rendering technology,ATi 多重渲染技术）ASIC（Application Specific Integrated C ircuit,特殊应用积体电路）ASC （Auto-Sizing and C entering,自动调效屏幕尺寸和中心位置）ASC （Anti Static C oatings,防静电涂层）ASD（Auto Stereoscopic Display,自动立体显示）AG（