电子元器件封装图示大全.doc

《电子元器件封装图示大全.doc》由会员分享，可在线阅读，更多相关《电子元器件封装图示大全.doc（43页珍藏版）》请在淘文阁 - 分享文档赚钱的网站上搜索。

1、. .电子元器件封装图示大全 LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageQFPQuad Flat PackageTQFP 100LRIMMRIMMFor Direct RambusSBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline Package

2、SLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Ath

3、lon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP 16LSSOPSocket 603FosterLAMINATE TCSP 20LChip Scale PackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72

4、TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32LChip Scale PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid Array VL Bus VESA Local BusXT Bus8bitZIPZig-Zag Inline PackageGull Wing Leads HSOP28ISAIndustry Standard ArchitectureITO220ITO3p

5、J-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit 5VPeripheral ponent InterconnectPCI 64bit 3.3VPeripheral ponent InterconnectPCMCIAPDIPPGAPlastic Pin Grid ArrayPLCCPQFPPS/2PS/2mouse port pinoutPSDIPDIMM 168DIMM DDRDIMM168Dual

6、 In-line Memory ModuleDIMM168DIMM168PinoutDIMM184For DDR SDRAM Dual In-line Memory ModuleDIPDual Inline PackageDIP-tabDual Inline Package with Metal HeatsinkEIAEIAJEDEC formulated EIA StandardsEISAExtended ISA FBGAFDIPFTO220Flat PackAC97AC97v2.2 specification 详细规格AGP 3.3VAccelerated Graphics PortSpe

7、cification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14C-Bend Lead CERQUADCeramic Quad Flat PackCLCCRmunication and Networking Riser Specification Revision 1.2CPGACeramic Pin Grid ArrayCeramic CaseLAMI

8、NATE CSP 112LChip Scale Package窗体顶端窗体底端BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic BallGrid ArraySBGA 192LTSBGA 680LCLCCR munication and Networking RiserCPGA Ceramic Pin Grid ArrayDIP Dual Inline Package DIP-tab Dual Inline Package with Metal HeatsinkFBGAFDIPFTO-220Flat PackHSOP-28ITO-220IT

9、O-3PJLCCLCCLDCCLGALQFPPCDIPPGA Plastic Pin Grid Array PLCCPQFPPSDIPLQFP 100LMETAL QUAD 100LPQFP 100LQFP Quad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603 FosterLAMINATE TCSP 20L Chip Scale PackageTO252TO263/TO268QFP Quad Flat PackageTQ

10、FP 100LSBGASC-70 5LSDIPSIP Single Inline PackageSO Small Outline PackageSOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOP Thin Small Outline PackageTSSOP or TSOP II Thin Shrink Outline PackageuBGA Micro Ball Grid ArrayuBGA Micro Ball Grid Ar

11、rayZIP Zig-Zag Inline PackageBQFP132C-Bend Lead CERQUAD Ceramic Quad Flat PackCeramic CaseLAMINATE CSP 112L Chip Scale PackageGull Wing LeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP 3.3VAccelerated Graphics PortSpecification 2.0详细规格AGP PROAccelerated Graphics Port PROSpecification 1.01详细规格AGPAccelerated Gra

12、phics PortSpecification 2.0详细规格AMRAudio/Modem RiserAX078AX14BGABall Grid ArrayBQFP132EBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格SBGA 192L详细规格TEPBGA 288LTEPBGA 288L详细规格TSBGA 680L详细规格C-Bend Lead CERQUADCeramic Quad Flat PackCLCCRmunication and Networking Riser Specification Revision

13、 1.2详细规格CPGACeramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112LChip Scale Package详细规格DIMM 168详细规格DIMM DDR详细规格DIMM168Dual In-line Memory Module详细规格DIMM168DIMM168Pinout详细规格DIMM184For DDR SDRAM Dual In-line Memory Module详细规格DIPDual Inline Package详细规格DIP-tabDual Inline Package with Metal HeatsinkEIAEIAJ

14、EDEC formulated EIA StandardsEISAExtended ISA详细规格FBGAFDIPFTO220Flat PackGull Wing Leads HSOP28ISAIndustry Standard ArchitectureITO220ITO3pJ-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCPCDIPPCI 32bit 5VPeripheral ponent Interconnect详细规格PCI 64bit 3.3VPeriphera

15、l ponent Interconnect详细规格PCMCIAPDIPPGAPlastic Pin Grid Array详细规格PLCC详细规格PQFPPS/2PS/2mouse port pinoutPSDIPLQFP 100L详细规格METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageQFPQuad Flat PackageTQFP 100L详细规格SBGASC-70 5L详细规格SDIPSIMM30SIMM30Pinout详细规格SIMM30Single In-line Memory ModuleSIMM72SIMM72Pinout详细

16、规格SIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium II

17、I & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L详细规格SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP 16L详细规格SS

18、OPSocket 603FosterLAMINATE TCSP 20LChip Scale Package详细规格TO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32LChip Scale Package详细规格uBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayVL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline Package. .word.