品质管理英语词汇分类大全.doc

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1、【精品文档】如有侵权，请联系网站删除，仅供学习与交流品质管理英语词汇分类大全.精品文档.品质管理英语词汇大全Cosmetic Defect TermsPlastic PartsNo.中文名称英文名称No.中文名称英文名称1黑条纹Black Streaking21成品表面模糊Surface Haze2破碎Brittleness22扭曲Torsion3烧焦Burning23侧面低陷Under Cut4褪色Color Fading24表面不平坦Unevenness5表面陷痕Crater Pit; Sink Mark25拖痕Drag Mark6未着色,异色Discoloration26缩水Shrink

2、 Mark7流纹(痕)Flow lines( Mark); Tear27冲料痕Ejector Mark8毛边Burrs; Sharp edge28冷流Cold Variation9成品脆弱Fragile29变色Color Variation10喷痕Jetting Mark30反翘Warping11表面无光泽Lack of Gloss; Glossiness31出料痕Gate Mark12刮伤Scratches; Nicks;32成品离模不良Sticking of parts in the mold13银条Silver Streaking33冷流Cold Flow14填充不足Short Shot

3、(Filling)34翘曲Warpage15表面剥落Surface Peeling35亮斑Flash Mark16气泡Void36异色点Color stain17结合线Weld Line; Knit Line37油污Oil; Grease;18指印(痕)Finger Prints(Marks)38白点(斑)White Spot(Mark)19粘漆Paint Adhesion39变形20色不匹配Color Mismatch402. Metal PartsNo.中文名称英文名称No.中文名称英文名称1腐蚀,铁锈Corrosion5外被不良Poor Coating2刮伤Scratches6毛刺Sha

4、rp Edges(saw burrs)3踫伤Bumps7电镀不良Poor Plating4污点StainsCable PartsNo.中文名称英文名称No.中文名称英文名称1油污Grease; Oils7套子毛边Obvious Burrs at the Sleeves2卷曲Overstressed Curls8印字图案不清Unclear Letter, Pictograms3绑带过松Unfunctional Bandages9印刷歪斜Skew4插头损坏Damaged Plugs10色斑Color Stain5SR硫化不良Poor Vulcanization of SR11指痕Finger Pr

5、ints(Marks)6Conn缝合不良Poor Crimping of conn.12外被不完整Incomplete CasingManuals, Packages, Printed Information and Type LablesNo.中文名称英文名称No.中文名称英文名称1内容不完整Uncompleteness7折皱Folds2色彩错误Wrong Tint8裂纹Flaws3印字图案不清Unclear Letter, Pictograms9覆盖Coverage4印刷歪斜Skew10印刷不良Poor Printing5一致性不佳Poor Layer Congruence11字体错误In

6、correct Font6起泡Bubble12裁边毛边及纸屑Burrs and grains from cuttingProcess Defect Terms1. Soldering QualityNo.中文名称英文名称No.中文名称英文名称1包焊Excess Solder7锡裂Split Solder2冷焊Cold Solder8锡桥Solder Bridge3浮焊Floating Solder9开路Open4空焊Empty Solder10短路Short5冰柱Icing11掉件,漏件Missing Component6锡尖突出Solder Tip12虚焊Inveracious Solder

7、ingOperational Defect TermsNo.中文名称英文名称No.中文名称英文名称1漏插Missing Parts(component)6踫伤Bumps2错件Wrong Part7粘胶Paint Adhesion3零件插反Backward Part8零件错位Misaligned Part4异物Foreign Part9零件损坏Broken Part5刮伤Scratches10漏焊Open SolderICT Fail Cause and Repair ActionsNo.中文名称英文名称No.中文名称英文名称1短路Short11桥焊Solder Bridge2错件Wrong P

8、art12加锡Solder Added3零件插反Backward Part13去锡Solder Removed4掉件Missing Part14换零件Part Replaced5PCB缺陷PCB Defect15加零件Part Added6零件损坏Broken Part16零件修复Part Repaired7零件缺陷Defective Part17板送去分析Board Sent For Analysis8PCB 开路PCB Open18板修复Board Repaired9零件损坏Broken Part19板报废Board Scrapped10漏焊Open Solder20板丢失Board Lo

9、stTools, Jigs, and EquipmentNo.中文名称英文名称No.中文名称英文名称1电铬铁Soldering Iron12超声波焊接机Ultrasonic Welding Machine2吸锡枪De-solder Gun13游标卡尺Sliding Callipers3波峰炉Wave Soldering Machine14螺旋测微器Micro Meter Callipers4回焊炉Reflow Oven15数字扭力器Digital Torque Meter5电锁Screw Driver16接地阻抗测试仪Ground Continuity Tester6电子负载Smart Ele

10、ctronic Load17高压测试仪AC/DC Withstanding Voltage Tester7示波器Oscilloscope18电声分析仪Electroacoustic Analyzer8万用表Multimeter19恒温恒湿机Temperature/Humidity Chamber9功率表Power Meter20烤箱Oven10漏电流测试仪Leakage Current Meter21信号发生器Function Generator11推拉力器Push-Pull Scale22烫金机Hot Stamping MachineSafety and EMCNo.简称英文名称中文名称1E

11、MCElectro-Magnetic Compatibility电磁兼容2EMIElectro-Magnetic Interference电磁干扰3EMSElectro-Magnetic Susceptibility电磁耐受4EMPElectro-Magnetic Pulse电磁脉冲5ESDElectro-Static Discharge静电放电6ULUnderwriters Laboratories Inc.美国安规(担保实验室)7CSACanadian Standards Association加拿大标准协会8FCCFederal Communication Commission美国联邦通

12、讯委员会9IECInternational Electrotechnical Commission国际电工委员会10TUV德国技术监护委员会(莱茵公司)11CE欧洲共同市场标准12CCEE/CCIB中国电工产品安全认证委员会13VDE德国电气标准14CBCertification Body全球性相互认证体系15NCBNational Certification Body国家认证机构QA TestNo.中文名称英文名称No.中文名称英文名称1冷藏实验Cold Test9吊重测试Cord/Strain Relief Durability2干热实验Dry Heat Test10落下实验Drop Te

13、st3湿热实验Damp Heat Test11扫频振动实验Sweep Vibration Test4温度循环实验Temp. Cycling Test12随机振动实验Random Vibration Test5储藏温湿循环实验Storage temp./humidity Cycling Test13开/关冲击实验Power on/off Test6工作温湿循环实验Operating temp./humidity cycling Test14开关寿命测试Switch Durability Test7温度冲击实验Thermal Shock Test15标签耐磨测试Label Durability T

14、est8烧机实验Burn in Test16印字耐磨测试Printing Durability Test六. Abbreviation No.简称英文名称中文名称1MTBFMean Time Between Failure平均失效间隔时间2FMEAFailure Mode and Effects Analysis失效模式与效应分析3GR&RGauge Repeatability and Reproducibility量规仪器重复性与再现性4APQPAdvanced Product Quality Planning前期产品质量规划5CaCapability of Accuracy 制程准确度6C

15、pCapability of Precision制程精密度7EIAElectronic Industries Association电子工作协会8ISOInternational Organization for Standard国际标准组织9SMTSurface Mounting Technology表面组装技术10SMDSurface Mounting Device表面组装设备11PDPProduct Development Procedure产品开发流程12DVTDesign Verification Test设计验证测试13MVTManufacturing Verification T

16、est生产验证测试14MBOManagement By Object目标管理15RMAReturned Merchandise Access退货16MDRMaterial Defect Report材料不良报告17DPMODefect Per Million Opportunities每百万机会的不良次数18KPIKey Performance Indicating主要绩效指标19BSCBalanced Score Card平衡绩分卡20OOBAOut Of Box Audit开箱检验21PPMPieces Per Million每百万中的不良数22RPNRisk Priority Numbe

17、r风险优先指数23ESGEnergy Systems GroupMotorola的一个事业部的名称24ESPEmployee Suggestion Program员工提案制度25BOMBill of Material料单26QIIQuality Inspection Instruction质量检验说明书27MOIManufacturing Operation Instruction作业指导书MIManual In Process手插件28ICTIn Circuit Test在线测试29MSDSMaterial Safety Data Sheet材料安全数据表30SPCStatistical P

18、rocess Control统计制程管制31DOEDesign of Experiments实验设计1.缺件（MISSING PARTS）2.错件（WRONG PARTS）3.多件（EXCESSIVE PARTS）4.短路（SHORT）5.断路（OPEN）6.线短（WIRE SHORT）7.线长（WIRE LONG）8.拐线（WIRE POOR DDRESS）9.冷焊（COLD SOLDER）10.包焊（EXCESS SOLDER）11.空焊（MISSING SOLDER）12.锡尖（SOLDER ICICLE）13.锡渣（SOLDER SPLASH）14.锡裂（SODER CRACK）15.

19、锡洞（PIN HOLE）16.锡球（SOLDER BALL）17.锡桥（SOLDER BRIDGE）18.滑牙（SCREW LOOSE）19.氧化（RUST）20.异物（FOREIGNER MATERIAL）21.溢胶（EXCESSIVE GLUE）22.锡短路（SOLDER BRIDGE）23.锡不足（SOLDER INSUFFICIENT）24.极性反（WRONG POLARITY）25.脚未入（PIN UNSEATED）26.脚未出（PIN UNVISIBLE）27.脚未剪（PIN NO CUT）28.脚未弯（PIN NOT BENT）29.缺盖章（MISSING STAMP）30.缺标

20、签（MISSING LABEL）31.缺序号（MISSING S/N）32.序号错（WRONG S/N）33.标签错（WRONG LABEL）34.标示错（WRONG MARK）35.脚太短（PIN SHORT）36.J1不洁（J1 DIRTY）37.锡凹陷（SOLDER SCOOPED）38.线序错（W/L OF WIRE）39.未测试（NO TEST）40.VR变形（VR DEFORMED）41.PCB翘皮（PCB PEELING）42.PCB弯曲（PCB TWIST）43.零件沾胶（GLUE ON PARTS）44.零件脚长（PARTS PIN LONG）45.浮件（PARTS LIFT

21、）46.零件歪斜（PARTS TILT）47.零件相触（PARTS TOUCH）48.零件变形（PARTS DEFORMED）49.零件损坏（PARTS DAMAGED）50.零件脚脏（PIN DIRTY）51.零件多装（PARTS EXCESS）52.零件沾锡（SOLDER ON PARTS）53.零件偏移（PARTS SHIFT）54.包装错误（WRONG PACKING）55.印章错误（WRONG STAMPS）56.尺寸错误（DIMENSION WRONG）57.二极管坏（DIODE NG）58.晶体管坏（TRANSISTOR NG）59.振荡器坏（XTL NG）60.管装错误（TUB

22、ES WRONG）61.阻值错误（IMPEDANCE WRONG）62.版本错误（REV WRONG）63.电测不良（TEST FAILURE）64.版本未标（NON REV LEBEL）65.包装损坏（PACKING DAMAGED）66.印章模糊（STAMPS DEFECTIVE）67.标签歪斜（LABEL TILT）68.外箱损坏（CARTON DAMAGED）69.点胶不良（POOR GLUE）70.IC座氧化（SOCKET RUST）71.缺UL标签（MISSING UL LABEL）72.线材不良（WIRE FAILURE）73.零件脚损坏（PIN DAMAGED）74.金手指沾锡

23、（SOLDER ON GOLDEN FINGERS）75.包装文件错（RACKING DOC WRONG）76.包装数量错（PACKING QTY WRONG）77.零件未定位（PARTS UNSEATED）78.金手指沾胶（GLUE ON GOLDEN FINGERS）79.垫片安装不良（WASHER UNSEATED）80.线材安装不良（WIRE UNSEATED）81.立碑（TOMBSTONE）SMT 不良描述中英文对照1 露底材 Base material expose2 偏位 Shift3 短路/连锡 Short4 少锡 Insufficient solder5 多锡/包焊 Exce

24、ss solder6 漏印 Missing print7 反白 Upside down8 少件 Missing component9 反向 Wrong orientation10 错件 Wrong component11 多件/残件 Extra component12 破损 Damaged13 空焊 No solder14 立碑 Tombstoning15 锡珠 Solder balls16 侧立 Side termination17 零件氧化 Parts oxidation18 锡尖 Solder projection19 浮高 Float20 翘脚 Lifted lead21 PAD不上锡

25、 PAD discoloration22 针洞 Pinholes23 压件 Cover component24 残异物 Residues25 助焊剂残留 Flux residues26 少胶 Insufficient glue27 溢胶 Overflow glue28 误判 No Fail29 其它 Other30 印刷不良 Print Defect31 上盖脱落/断裂 Top cover missing/crack32 掉件/撞件 Drop component33 内PIN翘起（缺PIN/短PIN/翘PIN） Lifted inside-pin34 版本混装 Mixed edition35

26、线路偏移 Circuit shift36 错位 Error position37 脚歪/变形 Lead deformed/deformation38 混料 Mixed material39 胶未固化 Glue not be solidified40 烫伤 Scald41 堵孔 Obstacle on via42 PCB白化/分层 PCB Delamination43 漏洞 Exposed copper44 无极性 Missing polarity45 压伤 Crush46 漏点胶 Missing glue47 气泡 Air bubble48 屏蔽架变形 Shield Deformation49

27、 屏蔽架毛刺 Shield Burr50 刮伤 Scraped51 弹片翘起 Spring lifted52 弹片失效 Spring failure53 弹片无法复位Spring cant replace54 零件沾锡 Solder on parts序号 汉语意义 英文翻译 焊锡质量类 1 冷焊 cold solder 2 零件偏移 component shifted3 污损 contamination 4 坏件 damaged component5 锡多 excessive solder 6 装插不良 improper insertion7 绝缘不良 insulation damaged 8

28、 线脚长 lead protrusion out of spec9 漏点胶 missing glue10 漏标示 missing marking11 近似短路 near short12 无线尾 no lead protruded13 翘皮 peeling off 14 极性反 polarity reversed15 成型不良 poor preforming 16 锡桥 solder bridge17 锡裂 solder crack 18 锡尖 solder icicle19 锡少 solder insufficient20 防焊漆胶落 solder mask peeling off21 锡渣

29、solder spatter 22 锡洞 solder void23 错件 wrong partICT Fail Cause and Repair Actions 1 短路 Short2 零件插反 Backward Part3 板丢失 Board Lost4 板修复 Board Repaired5 板报废 Board Scrapped 6 板送去分析 Board Sent For Analysis7 零件损坏 Broken Part 8 零件缺陷 Defective Part9 掉件 Missing part 10 加零件 Part Added11 零件修复 Part Repaired 12

30、换零件 Part Replaced13 PCB缺陷 PCB Defect 14 PCB开路 PCB Open 15 加锡 Solder Added 16 桥焊 Solder Bridge17 去锡 Solder RemovedSolding quality 1 空焊 Empty Solder 2 包焊 Excess Solder 3 浮焊 Floating Solder 4 冰柱 Icing5 虚焊 Inveracious Soldering 6 掉件，漏件 Missing Component7 开路 Open 8 漏焊 Open Solder9 锡桥 Solder Bridge 10 锡尖突

31、出 Solder Tip 11 锡裂 Split SolderOperational defect terms1 零件插反 Backward Part2 零件损坏 Broken Part3 碰伤 Bumps 4 异物 Foreign Part5 零件错位 Misaligned Part 6 漏件 Missing Parts (component)7 粘胶 Paint Adhesion 8 刮伤 Scratches9 错件 Wrong PartOthers 1 不正常 Abnormal 2 附件 Accessory3 外观 Apperance 4 装配 Assembling5 附着，贴附 Att

32、ached6 弯曲 Bent7 束线 Bind 8 翘皮 Blister/peeling9 接 Bridge 10 破损 Broken11 毛边 Burrs 12 裂纹 Chip / crack13 夹住 Clip14 污染 Contamination15 腐蚀 Corrosion 16 交叉 Cross17 损坏 Damage 18 减少 Decrease19 深刮伤 Deep Scratch20 缺点 Defect21 变形 Deformed22 凹痕 Dent23 偏差 Deviation24 尺寸 Dimension25 变色(白化) Discoloration 26 化状箱 Disp

33、lay box27 双重 Double 28 脱落 Drop , Tall off29 超过 Excess 30 假焊 False Solder (Cold)31 频率 Fequency 32 塞住 Fill Up33 浮 Float 34 异物 Foreign Material35 碎片塞 Fragement 36 胶 Glue37 溢胶 Glue overflow 38 重 Heavy39 不清楚 illegible 40 不完全 Incomplete41 增加 Increase 42 确认 Indentify43 指示灯 Indicate Lamp 44 不合治具 Ingagued45

34、未固定 Insecurely 46 插配 Insertion47 内部 Inside 48 干扰 Interference49 间断，不安定 Intermittent 50 杂物 Junk51 纠缠 Kink52 布置，配置 Layout53 线脚 Lead 54 浅音 Leakage Sound55 翘起 Lifted 56 轻 Light57 位置 Location 58 松 Loose59 方向不对 Misorientation 60 未镀表层 Misplating61 欠缺 Missing 62 混 Mix63 多重 Multiple 64 不良 No Good (NG)65 偏心 Off center 66 振荡 Oscillation67 外部 Outsid68 脱漆 Paint drop69 部分 Partial70 铜箔 Pattem (PAD）71 太差 Poor 72 凸 Protrude73 残留物 Residue