2021-2022年收藏的精品资料三电子组装.doc

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1、精品资料网（）25万份精华管理资料，2万多集管理视频讲座三、电 子 组 装（Assembly） IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 IPC-TM-650 Test Methods Manual试验

2、方法手册 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 IPC-A

3、-610C Acceptability of Electronic Assemblies印制板组装件验收条件 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 IPC/WHMA-A-620 Requirements an

4、d Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Application

5、s倒装芯片用半导体设计标准 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 SMC-WP-003 Chip Mounting Technology 芯片贴装技术 J-STD-013 Implementation of B

6、all Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注： IT (The Californ

7、ia Institute of Technology) JPL (The Jet Propulsion Laboratory) IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则 IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute) IPC-MC-790 Guidelines for Multichip Module Technology Utilizat

8、ion多芯片组件技术应用导则 IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?电路板离子洁净度测量：它告诉我们什么？ IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则 IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗

9、手册 IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 IPC-TR-580 Cleaning and Cleanliness Test Program Phas

10、e 1 Test Results清洗及清洁度试验计划1阶段试验结果 IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 -Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册 IPC-TP-1

11、04K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 IPC-M-109 Component Handling Manual 元件处理手册 IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度再流焊敏感度分类 IPC/JEDEC J-STD

12、-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本 IPC-DRM-18F C

13、omponent Identification Desk Reference Manual 零件分类标识手册 IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册 IPC-DRM

14、-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册 IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册 IPC-TA-723 Technology Assessment Ha

15、ndbook on Surface Mounting表面安装技术精选手册 IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列 IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可

16、靠性试验导则 IPC-PD-335 Electronic Packaging Handbook 电子封装手册 IPC-7525 Stencil Design Guidelines 网版设计导则 IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册 IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Include

17、s Amendment 1锡焊焊剂要求（包括修改单1） IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1） IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能评价手册 IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊

18、料技术要求 IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求 IPC-CA-821 General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南 IPC-3408 General Requirements for Anisotropical

19、ly Conductive Adhesives Films各向异性导电胶膜的一般要求 IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册 IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册 IPC-SM-840C Qualification and Perfor

20、mance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1) IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能评价手册 IPC-TP-1114 The Laymans Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法 IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-

21、STD-001(焊剂控制)的支持数据及数字实例 IPC-AJ-820 Assembly & Joining Handbook 装联手册 IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定

22、要求 IPC-TP-1090 The Laymans Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施 IPC-S-816 SMT Process Guideline & Checklist 表面安装技术过程导则及检核表 IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring

23、 Boards印制板波峰焊故障排除检查表 IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安装导则 IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算 IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 IPC-9501 PWB As

24、sembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则 IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级 IPC-9504 Assembly Process Simulation for Eva

25、luation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘） IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能

26、测试用的标准工具包 IPC-9850 Placement Accuracy Verification Panels 1 IPC-9850 CMM Measurement Verification Panels IPC-9850 QFP-100 Glass Components 130 IPC-9850 QFP-208 Glass Components 150 IPC-9850 BGA-228 Glass Components NIST Traceable Measurement Certificate Custom Storage Case IPC-7711/21 7711 & 7721 Pa

27、ckage 合订本 IPC-7711 Rework of Electronic Assemblies 电子组装件的返工 IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies印制板和电子组装件的修复与修正 IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 IPC/EIA J-STD-003 Soldera

28、bility Tests for Printed Boards 印制板可焊性试验 IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 IPC-TR-464 Accelerated Aging for Solderabilit

29、y Evaluations可焊性加速老化评价(附修订) IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器温度控制稳定性联合试验 IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results 蒸汽老化时间与温度对可焊性试验结果的影响 IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA替代涂覆层的蒸汽老化评价 IPC-TR-466 Technical Report: Wetting Balance Standard Weight Comparison Test技术报告: 润湿天平称重标准对比测试 SMC-WP-001 Soldering Capability White Paper Report 可焊性工艺导论 SMC-WP-005 PCB Surface Finishes 印制电路板表面清洗精品资料网（） 专业提供企管培训资料