PCB工程 中常见的英文缩写汇总.docx

《PCB工程 中常见的英文缩写汇总.docx》由会员分享，可在线阅读，更多相关《PCB工程 中常见的英文缩写汇总.docx（40页珍藏版）》请在淘文阁 - 分享文档赚钱的网站上搜索。

1、PCB工程中常见的英文缩写汇总工程圖檔資料中常見的英文縮寫匯總?AOI:AutomaticOpticalInspection自動光學檢測?SMD:SurfaceMountDevices外表安裝設備?SMB:SurfaceMountBoard外表安裝板?SMT:SurfaceMountTechnology外表安裝技術?MIL:MilitaryStandard美國軍用標准?LPI:LiquidPhotoImageableSolderMask液態感光阻焊油?SMOBC:SolderMaskOnBareCopper裸銅覆蓋阻焊工藝?OSP:OrganicSolderabilityPreservativ

2、e焊錫性有機保護劑?PTI:ProofTrackingIndex耐電壓起痕指數?CTI:ComparativeTrackingIndex相對漏電起痕指數?HASL:HotAirSolderLeveling噴錫HAL:HotAirLeveling噴錫?PCB:PrintedCircuitBoard印制電路板?PWB:PrintedWiringBoard印制線路板?CCL:Copper-cludlaminat覆銅箔層壓板?FPC：Flexibleprintedboard柔性线路板简称，又称软板?CAD:ComputerAidedDesign計算機輔助設計?CAM:ComputerAidedManu

3、facturing計算機輔助制造?CAT:ComputerAidedTesting計算機輔助測試?PTH:PlatedThroughHole鍍通孔?IC:IntegratedCircuit集成線路?UL:UnderWritersLaboratories美國保險商實驗室?CNS:ChineseNationalStandards中國國家標准?BGA:BallGridArray球柵陣列?BUM:Build-upMultilayer積層法多層板?CFR:CodeofFederalRegularations聯邦法規全書?AQL:AcceptableQualityLevel允收品質水准?LDI:Laser

4、DirectImaging鐳射直接成像?HDI:HighDensityInterconnection-Build-upMultilayer高密度互連積層多層板1.按照標准(inaccordingwithrelatedstandards)：IPC:TheInstituteforInternationalandPackagingElectronicCircuit美國電路互連與安裝學NEMA:NationalElectronicManufacturingAssociation國家電子制造協會/美國電氣制造協會2.基本材料(basematerial)：naturalcolor自然色externalco

5、pperweight外層銅厚copperclad覆銅箔prepreg預浸材料指半固化膠片Tgrating玻璃化溫度laminate基板cross-section切片cutout切口Metalcore金屬芯typeofboard板類(singlesided單面doublesided雙面multilayer多層)epoxyglassfiber環氧玻璃纖維flammabilityrating/class防火等級dielectricmaterial介質材料temperature溫度ResinContent膠含量GlassTransitionTemperature(由玻璃态转化为橡皮态简称为TG!)ba

6、secopper(基銅)3.偏差及公差(deviation&tolerance):registration對位(重合度)dimension(長/寬/高)尺寸大小radius&diameter半徑/直徑holesize/aperture孔徑width寬度length長度depth深度height高度thickness厚度spacing間距axis軸coordinate坐標parameter參數copperfoil銅箔boardoutline/contour板輪廓圖edgetoedge邊到邊heatsinkplane散熱層stackup疊層$疊放finish(ed)thickness完成厚度tra

7、ce=track=line=pattern=conductorrail=circuit線路toplayer上層&bottomlayer下層layertolayerregistration層與層對位interlayer&externallayer內層&外層clearance空隙、間空、間隔&gap間隙guidehole=pilothole導引孔tangency切線、相接觸diagonal對角線、對頂線signalplane信號層voltageplane電源層groundplane接地層C/Scomponentside元件面S/S=solderside焊接面Primaryside主層seconda

8、ryside輔層supportingplane支撐面Film底片/菲林masterfilm主稿片artwork底稿片masterdrawing布設總圖4.工藝process:surfacefinishing=surfacetreatment=finish外表處理hardgold重金Entek/Flux防氧化ImmersionAg化银goldplating鍍金immersiongold沉金flashgold閃金tin/leadplating鍍鉛錫electrolessgold(plating)無電鍍金nickel/goldplating鍍鎳金HASL:HotAirSolderLeveling噴錫

9、HAL:HotAirLeveling噴錫NPTH:NotPlatedThroughHole非鍍通孔非電鍍孔Flatpackagetype平裝型SMOBC:SolderMaskOnBareCopper裸銅覆阻焊工藝plugthroughhole塞孔Void空洞slot開槽/槽孔tentedvias掩孔/導通孔annularring孔環mountinghole安裝孔toolinghole管位孔定位孔wetsoldermask濕膜dryfilm/drysoldermask干膜preflux&postflux預塗助焊劑&後塗助焊劑carbonink碳油silkscreenlegend絲印字符non-c

10、onductive非導電的Permanent耐久的Solderresist阻焊劑&soldermask阻焊油膜Flowsoldering流焊Reflowsoldering再流焊Wavesoldering波焊Dipsoldering浸焊Dragsoldering曳焊Floatsoldering浮焊withdrawallacquer=peelablesoldermask藍膠2.25mmwindowaroundfiducialwithoutsolderresistOveralldiameterofsolderresistfreearea=6.0mm5.標識(marking):vendersident

11、ification(賣主身份)=manufacturesidentification(制造商名)=companyname(公司名稱)datecode生產周期ULlogo(denotation)UL標識trademark商標typedesignation型號標志revisionletter版本字母dustbinsymbol垃圾箱標志stamp蓋印、壓印short/opentest短/斷路測試liabletoread易於辯认6彎曲與扭曲(bowandtwistortwistandwarp)：notexceed不超過7.外形profiling:mechnicaloutline外形圖countersi

12、nk鑽孔routebit鑼鑽頭score劃痕、刻痕、劃線scoreline分割線slot開槽/槽孔&cutouts切口panelizationdetail拼板圖cosmetic=appearance外觀keepoutarea保留區域breakawayrails沖破導線arraysize拼板尺寸punch沖床drill鑽孔route鑼板V-cut切割、分割8.清潔度clealiness:Finishedcircuitboardshallbefreeofdirt，oil，ioniccontaminatesorotherforeignmatterwhichcouldaffectsolderabili

13、tycircuitperformance，liftorappearance。譯文：成品電路板應無污塵、油污、微粒污染及可能影響到阻焊性能、線路性能、翹度及外觀的異物。9.包裝packaging:slipsheets簿襯紙vacuumpackaging真空包裝10.其它others:detail(詳細)appear(出現)enlarge(擴大)confirm(確認)Provide(提供)method(方法)ignore(忽視)avoid(避免)minor(較輕)major(嚴重)critical(致命性)drawnby(制作)Model(型號)Warp-wise(經向)Weft-wise(緯向)

14、Stencil(網版)pattern(圖形)pattern(線路圖)grade等級issueddate發行日期corresponding(相應的)build(製作，構造)adjacent(臨近的，接近的)Indicate(指出，簡要說明)exact(精確的，準確的)accuracy(精確性，正確度)attachment(附件，附加裝置)modify(更改，修改)accordingto(按照)properly(適當地。完全地)dummypad(假盤)thermalpad(散熱盤)isolationpad(孤立盤)specification規格說明hatchingpart陰影部分productio

15、nprocess生產工藝mattfinish粗化面printedcontacts印制插頭thermalstress熱應力thermalshock熱沖擊repeatability再現性viewfromtop頂層府視圖verticalview俯視圖upwardview仰視圖sideview側視圖preparedby制作DrawingNo.圖檔編號checkedby(auditedby)審核approvedby批准acceptability可接受性reproducibility再生性traceability可追溯性Flyprobe:飞针测试solderability可焊性separationline

16、(隔離線)clearancehole(隔離孔)dimensionedhole(注尺寸孔)holelocation(孔位)stamp/perforatedhole(郵票孔)datumreference(參考基準)fiducialmark(光學點)solderplug(焊料塞孔)Laminateparaform(壓合參數表)stackupdata(曡構圖)drillholesheet(鑽孔資料單)AspesctRatio(纵横比)Delamination:(分层)Flipflop(鏡像排版)electrolessplating(無電鍍)tenting(一銅蓋孔法)narrow/reduce狹窄/縮

17、小NB:notebook(笔记本电脑)MB:mainboard主机板Foolproofmethod:防呆线dielectricconstant(介電常數)arcresistivity耐電弧數弧阻Massproduction(量产)Layer-to-layerspacing(層間距)dielectrictangent介電正切Stamp-hole/threadhole郵票孔layer-to-layerregistration(層對準度)multilayerconstruction(層疊構)multilayerlayup(多層疊層)groundplaneclearance(接地層隔離)voltage

18、planeclearance(電源層隔離)losstangent損頛因數、損頛角正切nonfunctionalland(無功能連接盤)thesolderresistclearance(防焊凈空度)Manufacturingdrawing(加工圖)drillmap/drilldrawing/holechart孔圖Laminationstructure壓合結構minimumplatingthickness(電鍍最小厚度)soldplatestrippingmethod二銅圖形電鍍V-grooving(V-CUT)dimension/score(刻痕)caminstructioncam制作指示(OP

19、指示)DesignrulecheckingDRC設計規則檢查Characteristicimpedance特性阻抗線路板常見不良項目術語nick缺口tears撕裂splay斜孔haloing暈邊crazing龜裂dent凹坑壓痕burnt燒焦measling白斑micro-void微空洞protrusions象牙exposedcopper露銅breakout破裂poorplating電鍍不良skipplating漏鍍misregistration錯位burr毛刺、披峰dewetting半潤濕holepullout孔斷裂pinhole針孔cornercrack孔緣斷裂pit麻點weavetext

20、ure顯布紋discoloration變色、褪色gouge劃溝weaveexposure露織物mis-drilledhole鑽孔錯位fray磨傷Crackoffoil金屬箔裂縫Wrinkle皺褶Liftedland銅皮卷起breakoutorflare沖破及喇叭口delamination分層、爆板blistering/bubble起泡、冒泡foreigninclusion異物scratch刮花、擦傷、劃痕、刮傷resinsmear樹脂污染lossofadhesion附著力喪失pinkring粉紅圈projection疤點凸出的事物physicaldamage外傷liabletobemisrea

21、d易於誤認cross-talk漏線/交連illegible難讀的、難認的annularring孔環excessiveetchback過蝕breaksharpedge破邊breakawaytabs突出物、凸出物blind/buriedvias肓/埋孔foilburr(箔毛刺)holebreakout(孔破)IPQAENGLISHKNOWLEDGETRAINING(IPQA英語知識培訓)(一)ABOUTENGINEERINGCHANGE(工程變更)1.EngineeringChangeflow(工程變更流程)(1)engineering工程學/工程/設計engineer:工程師(2)Change改

22、變，變化(3)Flow流動(4)Bank(河，海的)岸堤2.Engineeringchangeflow:(工程變更流程)SCRECNMECNPECNECR(客戶或業務提出變更要求)(R/D發變更通知)(工廠正式變更)3.SCR:SaleschangeRequest(業務變更需求)(1)Salesad:銷售的業務(2)requestvt:要求，請求要求4.ECR:EngineeringchangeRequest(工程變更需求)5.ECN:Engineeringchangenotice(工程變更通知)notice警告.通知6.MECN:MaterialEngineeringchangenotice

23、(材料工程變更通知)7.PECN:ProcessEngineeringchangeNotice(制程工程變更通知)8.TECN:TemporaryEngineeringchangenotice(臨時工程變更通知)9.changemode(變更方式)(1).Changeimmediately(立即變更)指以發出通知日期起，所有材料，半成品。成品均需符合變更後之要求。如半成品，成品有變更前之物料，則Rework?Assoonasreleasenoticedate，ALLmaterial。WIP.F/Gwouldconformwithrequestchanged。Forexample。Materia

24、lbeforechangeforWIPorF/G。Itmustbereworked。(2).changebylots(批量變更)?以工單/訂單(周期)月份等為單位于變更，同單位內必須使用同種材料，其中lot一堆，一批Eg(1):整批roundlot.(2)returnedlot退回的一批貨。(3)Productionlot生產批量?ALLchangebaseonmonthofW/O&S/O，Andthesamematerialmustbeusedinthesamemonth。(3).Runningchange(持續變更)?指變更前後之物料可同時使用，一般是指把舊料用完，再使用新材料。?Mate

25、rialbefore&afterchangedmaybeusedatthesametime。generallyuseupoldmaterialandthenusenewmaterial。其中runningadj.連續的(二)ECN1.CHICONYR&D群光研發部.群光開發部R:Research調查/研究/探討D:development發展/發育/開拓/研制2.releasev.發行(形.片)發表(消息)釋放解放3.correction糾正/正確/修訂4.urgentlevel:緊急水平，緊急程度5.normaladj:正常的，一般的6.RefNo=referencenumber文件編號7.r

26、eason理由/原因/結果8.QualityImp:品質提升其中(1)quality:品質/質量(2)IMP:Improvement提高/提升/改善9.MFGIMP:制程提升/改善其中MFG:manufacturing制造/生產/產品10.Costdown降低成本11.Customerrequest:客戶需求12.Costestimate費用評估13.scrapvt:丟棄/廢棄廢料14.F/G:成品即Final(完成)good(好的)model的縮寫15.BOMChangedescription:BOM變更內容描绘.Description:描绘/形容/描寫/說明16.departmentapp

27、rovalprocedure:部門核對過程(1).procedure:程序/步驟/手續(2)approval:贊成/批準/認可/通過eg(a):customerapproved客戶承認approvedvt&.vi批準/認可eg(b):conditionapproved條件承認17.Safety/prod.ENG其中Safety可靠性此處可譯為安規18.Plantphasein工廠逐步采用.即導入.(1)Plant:n植物/工廠/作物(2)Phase:狀態.階段19.prepared/checked/approved(1)prepared即preparedby構成提供者提供人等.(2)check

28、ed即:checkedby:核準20.overseasupport:海支處(1)overseasadj:外國的/海外的(2)supportn&vt:支撐(三)MECN(四)PECN(五)ECR1.SUBJ:Subject主題.主旨2.effectivedate:生效日3.expiredate:終止日4.Changereason/reasonforchange:變更理由5.agree/disagree同意/不同意6.signvt.簽字/簽名7.plantMGR:廠長MGR即Manager的縮寫:經理8.training培訓trainer:培訓者/導師/講師9.Software/hardware軟

29、件/硬件soft(軟)+ware(器件)=軟件10.Comment:vj.評論/注釋(常與onthat連用)11.waive:特采/勉強(六)LAYOUT/604/642英文單詞1.frontfaceprinting/Sidelongprint側面印刷2.Languagetype:語文別類型3.107keyJapaneselayoutenhancedkeyboard:日文107key放大的圖紙4.Spec:specification規格.規範5.Laserprint/Laserprintcolor:鐳射印刷/鐳射印刷顏色6.Keytopcolor:鍵帽顏色7.Lightcolor/darkco

30、lor:淺色/深色8.Color:Black(黑色)red(紅色)White(白色)Blue(蘭色)Green(綠色)Yellow(黃色)CoolGrey(冷灰色)silver(銀白色)9.drawingforlaserprintreferenceonly:此圖面僅用于鐳射印刷參考10.PrintsiteconsultfilmNo=印刷位置參照菲林編號核查.(1)Site:地點/場所(2)consult:vt.查閱11.Printwayconsultdrawing:印刷位置查詢.圖面18.normalkey/functionkey/specialkey:普通鍵/功能鍵/特殊鍵19.backgr

31、ound背景.個人出身.受教育經歷.素(圖紙中一般譯為“底色.)(七)BOM1.BOM:Billofmaterial物料清單.材料表2.Topcase/TopCABINET:上蓋3.Balancebar:平衡桿4.Iocn/text:圖面印刷一般指Hotkey處與燈板處的印刷5.Logo:商標.圖案6.bezelcover:裝飾板7.Hotkey/Buttonkey:按鍵8.W/Print&W/OPrint:帶印刷&不帶印刷(1)“W/Print中有W是With具有.帶有(2)“W/O:Without沒有9.paint:噴漆10.Bracket:鐵板11.Membrane:薄膜開關12.Rub

32、berDome:橡膠開關13.Bottoncase:下蓋14.Tappingscrew:自攻螺絲15.machinescrew:機械螺絲16.Mylarpad:防水貼紙(八)工作中有關涉及到的英文與其它1.WIP:WorkinProcess半成品2.Lead-freesurfacefinishes無鉛外表處理3.AQL:AcceptableQualityLevel允收品質水準4.Sample:樣本.樣品5.Hold待處理6.Sorting:挑選7.Rowork:返工.重工8.Waive特采9.Reject:批退10.PDR:ProcessDeviationReport:制程異常報告11.F/C

33、:FullCoating全部蓋樹脂12.T/F:TampoSurfacecoating:面coating13.P/C:Partialcoating局部coating即字符上面蓋樹脂Partialadj.部分的.不完全的14.WIP:WorkingInstruction工作指導書15.SOP:StandardofProcedure作業程序16.FAI:FirstArticleInspection首件檢查17.LaserMarking鐳射印刷18.AVL:ApprovedVendorList*合格供應商手冊19.APL:ApprovedPartsList*合格材料名冊20.FPI:FirstPro

34、cessInspection*制程換線檢查21.PMP:ProcessManagementPlan*制程管制計劃22.PF:ProcessFlow*制程流程23.MRB:MaterialReviewBoard*物料證審小組24.VA/VE:ValueAnalysis/ValueEngineering*價值分析與價值工程25.FMR:FaultyMaterialReport*不良材料報告26.FMEA:FailureModelandEffectAnalysis*失效成本形式與效應分析27.OngoingReliabilityTest可靠性測試28.PilotRun試產29.PA:PatrolAu

35、dit巡回檢查30.WA:WorkingOrderAudit首件檢查31.EVT:EngineeringValidationTest工程驗證“validation:確認32.DVT:DesignValidationTest設計驗證33.PVT:ProductionValidationTest生產驗證34.Wear:耐磨35.Abrasion:耐磨36.Stain:耐污37.crush:耐壓38.Visual:外觀39.Frnction:功能40.Assembly:組裝41.MP:MassProduction量產42.EV:EngimeeringVerification工程確認43.DV:Des

36、ignVerification設計確認44.QUAL:QualificationPhase試產承認階段45.ME:MaintainEngineering維修工程46.IE:IndustryEngineering工業工程47.SMT:SurfaceMountTechnology自動貼片48.HotStamping:燙金.燙印49.5W2H:Who/Why/What/When/Where/HowmanyorHowmuch&Howtodo.何人/為何/干什麼/何時/何地/成本多少/怎麼做50.4M1E:Man/machine/Material/Method/Environment(即:人.機.物.法

37、.環境)51.PDCA:Plan/Do/Check/Action:計劃/執行/檢查/改善52.工廠管理六大要因:Q.C.P.D.S.M.Quality/Cost/Productivity/Delivery/Safety/Morale:品質/成本/生產力/交期/安全/士氣53.MKB:MobileKeyboardOperation:可攜式鍵盤生產廠54.DKB:DeskKeyboardOperation桌上型鍵盤生產廠55.PPH:PartsPerHundred百分之幾56.PPM:PartsPerMillion百萬分之幾57.LRR:LotRejectRate批退率58.Defect/Yiel

38、d:不良數/不良品59.ComtrastRatio:對比度60.ReductionRate:衰退率61.HDI:highdensityInterconnection高密度互連，積層法多層板，微孔板62.HalogenfreeLaminates&Dielectrics無鹵化基板材料及介質63.customerdissatisfaction顧客不滿64.qualitymanagementsystem品質管制體系65.totalqualitymanagement全面品質管制TQM66.qualityplanning品質策劃67.qualitypolity品質方針68.qualityassurance

39、品質保證69.qualityrequirement品質要求70.LCD:LiquidCrystaldisplay(液晶显示器)一Note(注釋):(一).unlessotherwisespecified(除非另有說明)1.ManufactureperMaxtorspecNO10207。FinishtobeSMOBC/HASL2.Soldermaskcoverviapadsontop/primaryside。0.25minimum(最小值)3.Soldermaskbetweenviaholeandsmdpadrequired.Viapadsareleftexposedonbottom/secon

40、darysideperartwork.SeeODB+noteforsoldermaskmodifications。(修改，更改)4.Allinternalradius/radii(半徑)tobe1.0mmmaximum。5.Artworkdepictions(描绘)forreferenceandquotes(引用)only。6.Nominal(符合，滿意的)finishedconductorwidth=0.15mm+/-20%.7.Nominalfinishedconductorspacing=0.15mm+/-20%。8.Construction(构造)ofmultilayer。(多層)9.

41、Chamfer(斜角)allexternal(外面的)corners0.5x45DEG。10.Connectorpadsonbottom/solder/secondarysidetobeflat(平坦的)within(在之內)0.025mm。soldermaskthickness0.038mm。11.Vendortosilkscreen4digitdatecode(WWYY)。ULlogoandflamerating(防火等級)inspecifiedareaontop/component/primaryside。Flameratingmustbe94v-1orbetter。12.Buildin

42、4-uparrayper“arraylayerinartwork。13.1.24shallbeformed(成型加工的)byroute/drill。(二).unlessotherwisespecified1.Material:perIPC-4101typeGFNClassA/K。Laminateusingpre-preg。PerIPC-4101，doulesided。UseE-glassepoxycopperclad(环氧的)FR-4(IPC-4101/21)withaTgof140Cmin。BaseCu.1oz。Overall(全部的)bareboardthicknesstobe0.061(

43、+/-0.005)。FinalExternal(最终的外部)Copperweight2oz。2.Fabricate(构成)inaccordance(一致)withIPC-600，(class2)。Unlessotherwisespecified。3.Unlessotherwisespecified，allholedimensionsapply(适用)afterplatingtoatoleranceof+0.005-0.000。Allplatedthroughholetohaveaminimumof1milcopperplating。4.Allholesshallbelocated(位于)wit

44、hin(在.之内)0.005diameteroftrueposition。Layerregistrationshallbewithin0.005。Addteardrops(泪滴)asrequiredsothat因要allholesurrounded(包围)byland(陆地)havenomorethana25%breakout(脱逃)withaminimumlandof0.002maintained维持attracetopadjunction。连接，穿插点5.Conductorwidthsandspacingshallbewithin+/-20%or0.001ofartworkoriginal

45、s(最初，原始的)，whichever任何一个isless。较少的6.ApplysoldermaskLPI(liquidphotoimageable液态感光阻焊剂)andSMOBC(soldermaskoverbarecopper裸铜覆盖阻焊工艺)soldermasktobeperIPC-SM-840，classT，colour:transparent(明晰的)green。Allexposedconductive(传导的)surfacestobesoldercoated(涂上一层的)。7.Warp(弯曲)ortwist扭曲ofboardshallnotexceed0.010/in。8.Boar

46、dsizetoadimensiontoleranceof+/-0.0109.Applysilkscreen，asrequired，usinganonconductivepermanent(持久的)WHITEepoxy(环氧的)ink。Clip(修剪)legend0.001fromsoldermaskclearancepadsand0.003fromtheedgeofholes。10.Removeallburrsandbreak(破裂)sharp(锋利的)edges0.016max。11.Boardshallbetemperature(温度)rated(等级)toUL/CSAapproved(经

47、核准的)120Cmin。andmustmeettheflammabilityratingUL94V-0.Min.CTIof175。VendorshalllocatetheirULidentificationsymbol，ratinganddateinthesilkscreenlayer，approximately(大约)whereshown。Donotetchanyidentificationmarksortextinthecopper。12.Surfacemountpadsolderplatingmustbeflat(正好)toamaximumof0.003aboveboardsurface。13.0.050maximumradius(范围)onallinsidecorners。14.Allslotsandcutouts(剪切)arenon-platedunlessotherwiseindicated。Keepcopper0.008backfromnon-platedholesandslots。Dimensiontoleranceonslotsandcutouts+/-0.005。15.Finishedcircuitboardshallbefreeofdirt(污垢)，oil(油)，ioni