2022年电气工程英文简历表格.docx

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1、2022年电气工程英文简历表格 作为求职者想要凭借个人简历求职胜利就必需要知道自己有什么样的求职优势，了解自己的求职优势才能够驾驭编写个人简历中的侧重点。金无足赤人无完人，在个人简历的编写中要学会扬长避短。假如你没有高等学历就须要着重编写专业技能，假如你没有工作阅历就须要着重编写学业成就，假如你没有专业技能就须要着重编写英语水平。在个人简历中要选择自己擅长的技能编写，这样才能够更程度上取得用人单位的青睐，从而获得面试机会。 有针对性的个人简历更简单获得面试机会，想要通过个人简历获得聘请人员的认可在编写个人简历之前就要知道自己想要在用人单位中获得一个什么样的职位。当明确自己的职位过后就可以根据职

2、位所须要的人才来编写自己的个人简历，并且在编写工作阅历时也须要选择与职位相关的来编写。 Name:Sex：ate of Birth：Hukou：Residency：ork Experience：urrent Salary：Tel：E-mail：areer bjectiveesired Industry：Electronics/Semiconductor/I ,Science/Research ,Government ,thers ,Testing, ertificationesired Position：Senior Hardware Engineer ,Semiconductor Techn

3、ology, Branch ffice anager ,hief Representative ,Research Specialist Staffesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,acaoesired Salary：Negotiableork Experience2022/06Present*ompanyIndustry: Electronics/Semiconductor/IIntel lash Engineering epartment Individual ontributor Responsibilities：I

4、have been working in Intel lash Assembly Test Engineeringepartment as an Individual ontributor since June of 2022.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. ur efforts are paid off:1.The yield of year 2022 has been dramatically increased

5、than that of year 2022.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2022. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to re

6、place the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. inally, the team has made a great cost saving of $2.5 in 2022.Report irectly to: epartment anagerNumber of Subordinate: 14Reference: Bao PowelAchievements: Being Leader of AT

7、E Yield team, I have been working with the team members to improve the products yield.ur efforts are paid off:1.The yield of year 2022 has been dramatically increased than that of year 2022.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield impro

8、vement is more than $1 million compared with year 2022. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. inally,

9、 the team has made a great cost saving of $2.5 in 2022.2022/012022/05Intel(Shanghai) Technology evelopment Ltd. ompanyIndustry: Electronics/Semiconductor/IIntel STT-hina epartment Electronics evelopment Engineer Responsibilities：1.I had been working in STT-hina since Jan 2022 to ay 2022 as a senior

10、module engineer.2.At that time, as a main contributor of this project, we succeeded in developing a set of ASSIVELY PARALLEL LASS TEST equipment, which is able to test more than 6730 units in one time.Report irectly to: Hopman arkNumber of Subordinate: 14Reference: Bao PowelReason for Leaving: I was

11、 transferred to Intel（Shanghai）Products Ltd. ompany due to the internal re-organization in June of 2022.Achievements: As a main contributor of STT-hina department, I co-work with my colleagues to succeed in developing a set of ASSIVELY PARALLEL LASS TEST equipment, which is able to test more than 67

12、30 units in one cycle.2022/052022/01Nanyang University of Science TechnologyIndustry: Electronics/Semiconductor/IElectronics Electrical Engineering epartment Research ellow Responsibilities：1.I work in Electronics Electrical Engineering epartment of Nanyang University of Science Technology as a Rese

13、arch ellow.2.I majored at Gate xide Reliability Research in the duration.Report irectly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.Achievements: In less than one year, I ma

14、de a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2022/01PresentAssembly NPI (New Product Introduction)Project escription: To introduce more products into Intel lash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate

15、 with IE, Planner, arketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2022/012022/12arginal Electric

16、al Boards RescueProject escription: To rescue some electrical boards of testing equipment, a Task orce team was built up and led by me. e categorized each kind of board, made historical failure analysis on each kind of board and around 2.5 million dollars was saved finally.Responsibility: Being the

17、team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2022/102022/05ptimization the current Test Process rder for lash emoryProject escription: To simplify the current Test procedure and enhance the work

18、ing efficiency, a Task orce team has been called and started by me.Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.2022/052022/12Test Yield of lash memory ImprovementProject escription: To improve the test yield of different pro

19、ducts, a Task orce team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.R

20、esponsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2022/052022/01Nanyang University of Science Technology icroelectronics octorateI worked in Nan yang University of Science Technology as a Research ellow.

21、I major at Gate oxide Reliability research in the duration.2004/032022/03Seoul National University of Korea icroelectronics thersI had been working in National Physical Lab of Seoul National University in Korea since arch of 2004 to arch of 2022 as a Post-doctor. here I unhook the project of researc

22、h development of arbon-Nan tube Biosensor. And only after one year, an EIS sensor based on S technology has been successfully produced. And one SI paper about it has been published in Semiconductor Science and Technology.2001/032004/03Shanghai Institute of icrosystemsand Information Technology，hines

23、e Academy of Sciences InformationTechnology octorate19101/092001/03Nanjing University of Science Technology aterial Science and Engineering asterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.11013/0919101/07Nanjing

24、University of Science Technology aterial Science and Engineering Bachelor19101/0739101/07Assistant Engineer in uality Verification epartment, Boiler actory in Zhengzhou city of Henan resistant Engineer in uality Verification epartmentProfessional SkillsLanguage Skills：English: EXELLENTKorean:AVERAGE

25、omputer Skills：Technology skilled 96onthSAPunderstanding 8onthertificate：2000/11SE11019/06ET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.第7页 共7页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页第 7 页 共 7 页