HDI印刷线路板流程介绍ppt.ppt

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1、HDIManufacturingProcessFlow,Pre-engineering,Patternimaging,Etching,Laminating,Drilling,Desmear,Cuplating,Holeplugging,Cuplating,BeltSanding,LaserAblation,Mechanicaldrilling,Cuplating,SolderMask,Goldplating,Routing,Electricaltest,Patternimaging,Holecounter,Shipping,Visualinspection,*Rawmaterial(ThinC

2、ore,Copper,Prepreg.),RawMaterial:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheetsize:36”*48”,40”*48”,42”*48CoreThickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”CopperFoil:1/3oz,1/2oz,1.0oz,2ozPrepregtype:1080,2113,2116,1506,7628,7630,4.內層線路製作(顯影)(De

3、velop),5.內層線路製作(蝕刻)(Etch),6.內層線路製作(去膜)(StripResist),7.黑氧化(OxideCoating),8.疊板(Lay-up),9.壓合(Lamination),10.鑽孔(Drilling),11.電鍍Desmear&CopperDeposition,12.塞孔(HolePlugging),13.去溢膠(BeltSanding),14.減銅(CopperReduction)Option,15.去溢膠(BeltSanding)Option,16.外層壓膜DryFilmLamination(Outerlayer),17.外層曝光Expose,18.Aft

4、erExposed,19.外層顯影Develop,20.蝕刻Etch,20.去乾膜StripResist,21.壓合(Build-upLayerLamination),21.護形層製作(壓膜)(ConformalMask),22.護形層製作(曝光)(ConformalMask),BeforeExposure,AfterExposure,23.護形層製作(顯像)(ConformalMask),24.護形層製作(蝕銅)(ConformalMask),25.護形層製作(去膜)(ConformalMask),26.雷射鑽孔(LaserAblation)及機械鑽孔,27.機械鑽孔(MechanicalD

5、rill),28.電鍍(Desmear&CopperDeposition),29.外層線路製作(Patternimaging),壓膜(D/FLamination),曝光(Exposure),顯像(D/FDeveloping),蝕銅(Etching),去膜(D/FStripping),30.防焊(綠漆)製作(SolderMask),WWEI94V-0,R105,31.S/M顯像(S/MDeveloping),32.印文字(LegendPrinting),33.浸金(噴錫)製作(ElectrolessNi/Au,HAL),DedicateoruniversalTester,FlyingProbeT

6、ester,34.成型(Profile),35.測試(ElectricalTesting),36.終檢(FinalInspection),37.O.S.P.(entekplusCu_106A.)Option,LASERBLIND&BURIEDVIALAY-UP,A=THROUGHVIAHOLE(導通孔),B=BURIEDVIAHOLE(埋孔),C=OneLevelLaserBlindVia(雷射盲孔),LASERBLIND&BURIEDVIALAY-UP,BURIEDVIAANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇),D,C,C,D=TwoLevelLaserVia(雷射盲

7、孔),C,D,C,B-STAGE,FR-4Core,RCC,A,B,B,A,BURIEDVIALAY-UP,A=THROUGHVIAHOLE(導通孔),B=BURIEDVIAHOLE(埋孔),C=BLINDVIAHOLE(盲孔),D=BLINDHOLEMLBVIA(多層盲孔),BLINDVIALAY-UP,BLINDVIASEQUENTIALLAY-UP,A,B,B,A,RESIN,B-STAGE,BLINDANDBURIEDVIAOPTION(盲埋孔之選擇),D,A,C,C,E=VIAINPAD(VIP)(導通孔在pad裡面),E,ConventionalPCB,Photo-ImageableDielectric(PID),ConventionalPCB,BlindViaPCB,Q&A,END,