Wire-Bond-Introduction(焊线动作分解说明).ppt

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1、封裝簡介封裝簡介晶片晶片Die金線金線 Gold Wire導線架導線架Lead framWafer GrindingDie BondingWafer Sawtoaster Wire BondingDie Surface Coating Molding Laser Mark Solder Ball Placement SingulationPacking封裝流程封裝流程 Dejunk TRIM Solder Plating Solder PlatingFORMING/Singulation TRIM/ FORMING BGASURFACEMOUNTPKGTHROUGHHOLE PKGWire B

2、ond 原理原理GLASSSiO2SiGOLD BALL B.PRINCIPLE銲接條件銲接條件 HARD WELDING Pressure (Force)Amplify & Frequecy Welding Time (Bond Time)Welding Tempature (Heater)THERMAL BONINGThermal Compressure Ultrasonic Energy (Power)Bonding ProcessThe Wire Bond TempFree air ball is captured in the chamferFree air ball is capt

3、ured in the chamferSEARCH HEIGHTFree air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Free air ball is captured in the chamferSEARCH SPEED1SEARCH TOL 1Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Free air ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Free air

4、 ball is captured in the chamferSEARCH TOL 1SEARCH SPEED1Formation of a first bondSEARCH SPEED1SEARCH TOL 1Formation of a first bondSEARCH SPEED1SEARCH TOL 1IMPACT FORCEFormation of a first bondContact Formation of a first bondBase Capillary rises to loop height positionCapillary rises to loop heigh

5、t positionCapillary rises to loop height positionCapillary rises to loop height positionCapillary rises to loop height positionCapillary rises to loop height positionFormation of a loopRD (Reverse Distance)Formation of a loopCalculated Wire LengthWIRE CLAMP CLOSECalculated Wire LengthSEARCH DELAYTRA

6、JECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORYTRAJECTORY2nd Search HeightSearch Speed 2Search Tol 22nd Search HeightSearch Speed 2Search Tol 2Search Speed 2Search Tol 2Formation of a second bondFormation of a second bondContact Tail Length Tail Leng

7、th Tail LengthTail length Tail LengthDisconnection of the tailDisconnection of the tailDisconnection of the tailFormation of a new free air ballFormation of a new free air ballMaterial Leadfram Capillary Gold Wire Leadfram (I)Leadfram ( II )CAPILLARY (I) Capillary Manufacturer (SPT, GAISER, PECO, TOTO) Capillary Data ( Tip , Hole , CD , FA&OR , IC )CAPILLARY (II)CAPILLARY (III)TIP . Pad Pitch Pad pitch x 1.3 TIPHole . .Wire Diameter Wire diameter + 0.30.5 = HCDPad size/open/1st Ball CD + 0.4 0.6 = 1st Bond Ball sizeFA & OR.Pad pitch(um) FA 100 0,4 90/1004,8,11 9011,15IC type loop type