塑胶电镀介绍ppt课件.ppt

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1、 塑膠電鍍介紹 Plating on Plastics塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項Principles of Plating on Plastic 第一站第一站 素材選擇素材選擇 ABS塑料案例塑料案例 (Step 1:Selecting Material ABS Plastic Case)1.最好採用電鍍級最好採用電鍍級ABSABS塑膠如圖所示其丁二烯含量塑膠如圖所示其丁二烯含量15%16%15%16%密著密著強度最好強度最好 Selects the ABS plastics showing on the right which the butadiene is 15%-16

2、%.Its adhesion is best. 2.采用采用70%95%PC+ABS70%95%PC+ABS材料要請供應商提供防火材料材料要請供應商提供防火材料% %、PC%PC%、等、等相關資料相關資料 Applier should offer fireproof material, PC%,etc,and references before selecting 70%-95%PC+ABS.3.塑膠電鍍原料應完全乾燥塑膠電鍍原料應完全乾燥( (含水率含水率0.1%0.1%以下以下) ) Materials of plating on plastic should be dried total

3、ly.4.塑膠電鍍原料盡量避免染色塑膠電鍍原料盡量避免染色Materials of plating on plastic must prevent dyeing.5.塑膠電鍍原料塑膠電鍍原料ULUL認證認證 Materials Materials of plating on plastic should of plating on plastic should be attested by UL.be attested by UL.0.51.52.02.53.03.54.04.51.0141915161718密著強度Kgf/cm丁二烯t %各材質丁二烯之含量塑膠電鍍介紹 Plating on

4、Plastics塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項第二站第二站 模具設計模具設計 Step2:Mould Design1.塑膠電鍍模具必須預留電鍍夾具掛架點塑膠電鍍模具必須預留電鍍夾具掛架點( (以防產品變形及生產便利性以防產品變形及生產便利性) )Remains points for electroplating rack in mould of plating on plastic .Remains points for electroplating rack in mould of plating on plastic .2.模具設計趨向：耐高溫不易頂開產生毛邊、射出點不可太細

5、以防入水斷裂脫模具設計趨向：耐高溫不易頂開產生毛邊、射出點不可太細以防入水斷裂脫 落、落、預防尖端放電預防尖端放電( (加框加框) )、注意離模斜度、預留排氣孔、注意頂針粗細影響外觀及進、注意離模斜度、預留排氣孔、注意頂針粗細影響外觀及進膠口位置產生之結合線等膠口位置產生之結合線等Trend of moulds design: Moulds should of be Trend of moulds design: Moulds should of be resistant to high temperature and not easily open to create crude resis

6、tant to high temperature and not easily open to create crude outline, the ejection point should not be too small to prevent outline, the ejection point should not be too small to prevent entering water and breaking. Prevents discharge of tip. Reminds the entering water and breaking. Prevents dischar

7、ge of tip. Reminds the ventilator. Pays attention to that thickness of tip will influence the ventilator. Pays attention to that thickness of tip will influence the exterior and the combination line created in the ejection hole.exterior and the combination line created in the ejection hole. 5.模具需預留電

8、鍍後膜厚及組裝間隙模具需預留電鍍後膜厚及組裝間隙Remain the thickness of membrane which formed after electroplating.3.塑膠電鍍模具成型盡量避免尖端設計，盡可能改為塑膠電鍍模具成型盡量避免尖端設計，盡可能改為R R角角 Adopts round corner instead of tip corner in mould design. Adopts round corner instead of tip corner in mould design. 4.模具孔洞盡量設計導通，預防殘留藥水不易清洗模具孔洞盡量設計導通，預防殘留藥

9、水不易清洗Designs passage in the hole to clean the remnants.塑膠電鍍介紹 Plating on Plastics塑膠電鍍介紹 Plating on Plastics塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項第三站第三站 成型射出成型射出 Formation and Ejection 5.尺寸確認：依廠商訂定長寬尺寸、範圍尺寸確認：依廠商訂定長寬尺寸、範圍Affirming the size:decides the size and range of lenth and width according to the requirement of

10、 the firm.2.射出參數在不頂模、不起毛邊狀況下，盡可能拉高樹脂溶解溫度及模溫溫度，射出參數在不頂模、不起毛邊狀況下，盡可能拉高樹脂溶解溫度及模溫溫度，降低射出壓力及射出速度，以減少應力產生降低射出壓力及射出速度，以減少應力產生The ejection parameter such as plastic Tm and mould tempreture should rise as high as possidble and the ejection stress and speed should be reduced to lessen the stress. 3.成形表面確認：不可有

11、感結合線、刮痕、頂凸、拉模、縮水、起蒼、包風、及成形表面確認：不可有感結合線、刮痕、頂凸、拉模、縮水、起蒼、包風、及異色點異色點( (浮出表面上浮出表面上) )等等等等Affirming the Affirming the surface:Theresurface:There must be no must be no combination line ,combination line ,scratch,etcscratch,etc. .4.成型品包裝：用成型品包裝：用Tray(Tray(托盤托盤)+)+紙箱，以防碰刮傷紙箱，以防碰刮傷Packing:adoptPacking:adopt t

12、ray and tray and paper case to prevent being scratched.paper case to prevent being scratched.1.脫模劑最好能不用，要用務必使用含氟水性脫模劑脫模劑最好能不用，要用務必使用含氟水性脫模劑Avoid using the mould releases,if it is essential to use one,the Fluorine-type may be used springly.塑膠電鍍介紹 Plating on Plastics塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項模溫與密著力關系模溫與密著

13、力關系relation between tempreture of mould and adhesion 樹脂溶溫度與密著力關系樹脂溶溫度與密著力關系relation between plastic melting temperature and adhesion 射速與密著強度關系射速與密著強度關系 relation between speed of ejection and adhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion模溫 (C)tempreture of mould溶融溫度 (C)tempreture

14、of plastic melting射出速度(mm/sec)speed of ejection01342013420134250607080210 220 230 240 25020000010305070塑膠電鍍介紹 Plating on Plastics第四站第四站 防鍍方式防鍍方式 Methods of Plating-proof塑膠電鍍原理及注意事項塑膠電鍍原理及注意事項1.與機構與機構R&DR&D、RFRF、EMIEMI、ESDESD、電子等人員討論絕緣區位置、熱溶點位置、卡勾、電子等人員討論絕緣區位置、熱溶點位置、卡勾防鍍、耳機孔迴朔、防鍍、耳機孔迴朔、EMIEMI歐姆值歐姆值Di

15、scusses position of insulation area and melting point ,plating-proof Discusses position of insulation area and melting point ,plating-proof of hooks in rack ,EMI ohm. of hooks in rack ,EMI ohm. 2.防鍍方式：噴塗、貼膠、蝕刻、照影防鍍方式：噴塗、貼膠、蝕刻、照影 、印刷印刷 (依需求而決定依需求而決定)Method of Plating-proof :spraying paint, etching, p

16、rinting ,etc. (decided by requirements)塑膠電鍍介紹Plating on Plastics硬度 耐溶劑 抗紫外線 表面細膩 邊緣覆蓋 作業性 膜厚均勻 耐磨性R.C.A 價格 技術性 灰塵毛屑附著 液體垂涎 電子功能EMI ESD 量產性良率 金屬感 電器電鍍 9H以上優良 優良 優良 優良 複雜 優良 優良通過 普通 高 不會 不會 優良 普通 優良 真空濺鍍+UV烤漆 3H 優良 優良 普通 普通 普通 普通 通過 普通普通 會 會 需二次加工 優良 普通 彩色電鍍 5H 優良 優良 優良 優良 複雜 優良 優良通過貴 高 不會 不會 優良 普通 優良

17、 I.M.D 4H 優良 通過 優良普通 普通 普通 通過普通普通 會 會 需二次加工 優良 普通 PU烤漆 2H NG 通過 普通 普通 普通 普通 NG 普通普通 會 會 需二次加工 優良 普通 UV烤漆 3H 優良 優良 普通 普通 普通 普通 通過普通普通 會 會 需二次加工 優良 普通 PVD TiN ZrN 9H以上 優良 優良 優良優良複雜 優良優良通過最貴 高不會 不會 優良 普通優良水轉印 2H NG NG普通 普通 普通 普通 NG 普通普通 會 會 需二次加工 優良 普通 方法項目工業塑膠表面處理比較表工業塑膠表面處理比較表塑膠電鍍介紹Plating on Plastic

18、s HardnessResistance to solventANTI-UV Fineness of surface Verge coverage operationEvenness of membrane R.C.A price Technique norm Adhesion of dust Dropping of liquidElectric power function EMI ESD quality of batchproduction Sense about mentalElectrical Applianceplating 9Hgood good good good complex

19、 goodPass successfullyaverage HIGH NO YESgood averagegood Spraying paint in vacuum+UV paint 3H good good averagegood averageaverage paverageaverage Y YSecondary process is necessarygood average Color plating5H good good good good complex good Pass successfullyexpensive HIGH N NO good good goodI.M.D

20、4H good pass goodgood average average passaverageaverage Y YSecondary processis necessarygood average PU paint 2H NG pass average good average average NG averageaverage Y Y Secondary processis necessarygood average UV paint3H goodpassaverageaverage averageaveragepassaverageaverage Y Y Secondary proc

21、essis necessary good average PVD TiN ZrN 9H goodpass goodgoodcomplex優良Pass successfully extremely expensivehighNO N good 優良Print in water 2H NG NGaverage average average average NG averagehigh Y N secondary processis necessary good average Item Chart of Treatments on Plastic Surfacegoodgood averageM

22、ethod塑膠電鍍介紹 Plating on PlasticsPrinciple Possibilities 原理原理Pop_met0Ionic CatalystLonic催化劑催化劑Colloidal Catalyst膠狀催化劑膠狀催化劑Conductive Surface傳送面傳送面Final Layers最終層最終層Electroplating電鍍電鍍ElectrolessMetall Deposition無電鍍金屬沉澱無電鍍金屬沉澱Swell and Etch粗化粗化Chromo sulfuric Acid Etch鉻酸鉻酸硫酸硫酸 粗化粗化Comparison of Foxconns

23、 Processes 制程對比制程對比Compa201.pptCleaner (Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化Reducer還原劑還原劑PrePlate Nicke預鍍鎳預鍍鎳Electroplating電鍍電鍍Accelerator加速劑加速劑Coll. Pd Catalyst離子催化劑離子催化劑PreDip預浸預浸Eless Nickel化學鎳化學鎳Cleaner (Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化Reducer還原劑還原劑Electroplating電鍍電鍍CuLink銅槽銅槽Coll. Pd Catalyst離子

24、催化劑離子催化劑PreDip預浸預浸Cleaner (Option)清潔劑（任選）清潔劑（任選）Swell + Etch粗化粗化Conditioner調解劑調解劑PrePlate Nickel預鍍鎳預鍍鎳Electroplating電鍍電鍍Reducer還原劑還原劑Ion. Pd Catalyst離子催化劑離子催化劑Eless Nickel化學鎳化學鎳Cleaner (Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化Reducer還原劑還原劑PrePlate Nickel預鍍鎳預鍍鎳Electroplating電鍍電鍍Accelerator加速劑加速劑Coll. Ag Ca

25、talyst離子催化劑離子催化劑Eless nickel化學鎳化學鎳Cleaner (Option)清潔劑（任選）清潔劑（任選）CrO3-Etch粗化粗化PrePlate Nicke預鍍鎳預鍍鎳lElectroplating電鍍電鍍Reducer還原劑還原劑Ion. Pd Catalyst離子催化劑離子催化劑Eless Nickel化學鎳化學鎳Noviganth 341Noviganth AKFuturonNoviganth PAMellon塑膠電鍍介紹Plating on PlasticsStructure of Polymers on ABS Basis ABS表面聚合物結構基表面聚合物結

26、構基Abs_stru0塑膠電鍍介紹 Plating on PlasticsTheory of Adhesion: Mechanical Interconnection黏合原理黏合原理 自動連接自動連接Abs_aet30To separate the metal from theplastic, energy must be appliedto compensate the cohesiveforces in the plastic matrix(green) or in the metal(red).為將金屬從塑膠中分離出來必須為將金屬從塑膠中分離出來必須要求有能夠同塑膠母体（綠色）要求有能夠

27、同塑膠母体（綠色）和金屬（紅色）的能量相抵之能量和金屬（紅色）的能量相抵之能量塑膠電鍍介紹 Plating on PlasticsTypical Polycarbonate“ Blends 典型典型“多碳酸鹽多碳酸鹽” 混合混合blends10Bayblend T45Bayblend FR1441Polycarbonate 聚碳酸鹽聚碳酸鹽Polyacrylonitrile 聚聚丙烯丙烯腈腈 Polystyrene 聚苯乙烯聚苯乙烯Polybutadiene 聚丁二烯聚丁二烯Filler, Pigments,.填充料填充料 顏料顏料nArCNSANPB塑膠電鍍介紹 Plating on Pla

28、sticsSome Plateable Grade Plastics 可電鍍塑膠可電鍍塑膠galvsub0Typ 類型類型Name 名稱名稱Supplier 供應商供應商ABSABS + PCPPOPPPALCPTPONovodur P2MC, PM3CCycolacLustran PG299Ronfalin CP55Bayblend T45CycoloyNoryl PN235Codyx 4019GDurethan BM240Minlon 73M40Ultramid B3M6IXEFBayer AGGeneral ElectricsMonsantoDSMBayer AGGeneral Elec

29、tricsGeneral ElectricsRTPBayer AGDuPontBASFSolvayVectraHoechst AGRD P98119Solvay塑膠電鍍介紹 Plating on PlasticsPerfectly Pretreated ABS Surface (SEM, 5000 x)完全粗化處理之完全粗化處理之ABS表面表面 （SEM5000 x）absaet10塑膠電鍍介紹 Plating on PlasticsRinsing: Concept水水 洗洗 步驟步驟Dragout v = 0,2l/m2Dragoutv = 0,4l/m2Evaporationapprx 8

30、0l/hReducer還原劑還原劑Rinsing Cascade水洗過程水洗過程Etch粗化粗化(Spray Rinses have twice dilution factor)2 kg CrO3 = 100m2 etched ABS= 5500Ah = 230A in 24hR = C0/Cn = Q/VnCn = C0 * V/Qn塑膠電鍍介紹 Plating on PlasticsEtching Rates of Bayblend (25cm) and Resulting Adhesion of Plated Metal Layer.Bayblend (25cm)粗化率及電鍍后之金屬面所

31、產生的黏附力粗化率及電鍍后之金屬面所產生的黏附力etchrough000,20,40,60,811,21,41,60100200300400Etching Rate mg粗化率粗化率Adhesion N/mm黏附力黏附力塑膠電鍍介紹 Plating on PlasticsPalladium / Tin Cluster 鈀鈀 / 錫簇錫簇 cluste10Cl- Pd Sn2+ 0,181nm0,128nm0,093nmR.L.Cohen K.W.WestJ.Electrochem.Soc. 120, 502 (1973)Core Diameter:核心直徑核心直徑3 4nmSn塑膠電鍍介紹 P

32、lating on PlasticsElectroless Metal Deposition (Model) 化學金屬沉澱物化學金屬沉澱物eless00Active plastics surface活性塑膠表面活性塑膠表面Start of metal-deposition.開始出現金屬沉澱物開始出現金屬沉澱物Complete metalization:all activator particles areconnected electricallyconductive.金屬化完成金屬化完成 所有活性劑顆粒均結合在一起具導電性所有活性劑顆粒均結合在一起具導電性塑膠電鍍介紹 Plating on

33、PlasticsElectroless Nickel Deposition I 化學鎳沉澱物化學鎳沉澱物 IStarting Reaction 初期反應初期反應Adsorptionof Reducer還原劑吸附作用還原劑吸附作用Protolysis質子遷移質子遷移Additionof Water附加水附加水Desorption 解吸附作用解吸附作用塑膠電鍍介紹 Plating on PlasticsElectroless Nickel Deposition II 化學鎳成份化學鎳成份 IISide Reactions側邊反應側邊反應Recombinationof Hydrogen Atoms:

34、Hydrogen Gas Evolution氫原子再結合成為氫气氫原子再結合成為氫气Reduction ofHydroxide氫氧化物還原氫氧化物還原Phosphorous-Co Deposition磷酸根磷酸根 沉澱物沉澱物塑膠電鍍介紹 Plating on PlasticsElectroless Nickel Deposition III化學鎳成份化學鎳成份 IIIMetal Deposition 金屬沉澱物金屬沉澱物Main Reaction 主要反應主要反應Direct Reductionby Elektrons(only 1%)由由Elektrons直接還原直接還原（僅有（僅有1）塑

35、膠電鍍介紹 Plating on PlasticsMechanism of the CuLink Operation (Model)銅槽機能操作（模型）銅槽機能操作（模型）culime01Activator particles are bound to a plasticssurface.活化劑顆粒同塑膠件表面結合活化劑顆粒同塑膠件表面結合Chelated copper ions are reduced to eithercopper(0) or copper(I) by tin.螯合銅離子被錫還原成為銅（螯合銅離子被錫還原成為銅（0）或銅（）或銅（1）The copper crosslink

36、s the palladiumparticles resulting in a electroconductivesurface layer.銅与鈀顆粒交叉結合形成一個導電表層銅与鈀顆粒交叉結合形成一個導電表層塑膠電鍍介紹 Plating on PlasticsCuLink-Step: Dependence of the Electrical Conductivity of a Plastics Surface from Surface Bound Amount of Copper.銅槽步驟銅表面范圍同塑膠表面的電導率之依從關系銅槽步驟銅表面范圍同塑膠表面的電導率之依從關系culres0002

37、0406080100050100150200Copper 銅銅 g/dmConductivity S導電性導電性塑膠電鍍介紹 Plating on PlasticsSimplified Model of the Spreading of Metal during Plating after the CuLink Step 在完成銅槽步驟后電鍍中金屬擴散的簡單模擬圖在完成銅槽步驟后電鍍中金屬擴散的簡單模擬圖culime20Palladium cluster are crosslinked by copper or by copper ions.鈀簇由銅或銅離子相交聯構成鈀簇由銅或銅離子相交聯構成During electroplating, copper ions are reduced tocopper 在電鍍的過程中銅離子將被還原成銅在電鍍的過程中銅離子將被還原成銅 .塑膠電鍍介紹 Plating on Plastics