最新半导体集成电路概述PPT课件.ppt

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1、半导体集成电路概述半导体集成电路概述IC常用术语园片：硅片芯片(Chip, Die)：6、8 ：硅（园）片直径：1 25.4mm6150mm; 8200mm; 12300mm; 亚微米1m的设计规范深亚微米=0.5 m的设计规范0.5 m 、 0.35 m 设计规范（最小特征尺寸）布线层数：金属（掺杂多晶硅）连线的层数。集成度：每个芯片上集成的晶体管数Another view of one of the Fab Two Photolithography areas. Here we see a technician loading 300mm wafers into the SemiTool.

2、 The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties and SemiTool in 1995. Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried). As we look in this window we see the Worlds First true 300mm production furnace. Our development and des

3、ign of this tool began in 1992, it was installed in December of 1995 and became fully operational in January of 1996. Here we can see the loading of 300mm wafers onto the Paddle. Process Specialties has developed the worlds first production 300mm Nitride system! We began processing 300mm LPCVD Silic

4、on Nitride in May of 1997. 2,500 additional square feet of State of the Art Class One Cleanroom is currently processing wafers! With increased 300mm & 200mm processing capabilities including more PVD Metalization, 300mm Wet processing / Cleaning capabilities and full wafer 300mm .35um Photolithograp

5、hy, all in a Class One enviroment.Currently our PS300A and PS300B diffusion tools are capable of running both 200mm & 300mm wafers. We can even process the two sizes in the same furnace load without suffering any uniformity problems! (Thermal Oxide Only)Accuracy in metrology is never an issue at Pro

6、cess Specialties. We use the most advanced robotic laser ellipsometers and other calibrated tools for precision thin film, resistivity, CD and step height measurement. Including our new Nanometrics 8300 full wafer 300mm thin film measurement and mapping tool. We also use outside laboratories and our

7、 excellent working relationships with our Metrology tool customers, for additional correlation and calibration. One of two SEM Labs located in our facility. In this one we are using a field emission tool for everything from looking at photoresist profiles and measuring CDs to double checking metal d

8、eposition thicknesses. At the helm, another one of our process engineers you may have spoken with Mark Hinkle. Here we are looking at the Incoming material disposition racks Above you are looking at a couple of views of the facilities on the west side of Fab One. Here you can see one of our 18.5 Meg

9、/Ohm DI water systems and one of four 10,000 CFM air systems feeding this fab (left picture), as well as one of our waste air scrubber units (right picture). Both are inside the building for easier maintenance, longer life and better control. 集成电路（集成电路（Integrated Circuit, IC）：半导体：半导体IC，膜，膜IC，混合，混合IC

10、半导体半导体IC：指用半导体工艺把电路中的有源器件、无源元件及指用半导体工艺把电路中的有源器件、无源元件及互联布线等以相互不可分离的状态制作在半导体上，最后封装在互联布线等以相互不可分离的状态制作在半导体上，最后封装在一个管壳内，构成一个完整的、具有特定功能的电路。一个管壳内，构成一个完整的、具有特定功能的电路。半导体半导体IC双极双极ICMOSICBiCMOSPMOS ICCMOS ICNMOS ICTransistor Counts1,000,000100,00010,0001,000101001197519801985 19901995 20002005 2010808680286i38

11、6i486PentiumPentium ProKPentium IIPentium IIICourtesy, IntelMoores law in Microprocessors40048008808080858086286386486Pentium procP60.0010.010.1110100100019701980199020002010YearTransistors (MT)2X growth in 1.96 years!Transistors on Lead Microprocessors double every 2 yearsCourtesy, IntelDie Size Gr

12、owth40048008808080858086286386486Pentium procP611010019701980199020002010YearDie size (mm)7% growth per year2X growth in 10 yearsDie size grows by 14% to satisfy Moores LawCourtesy, IntelFrequencyP6Pentium proc486386286808680858080800840040.111010010001000019701980199020002010YearFrequency (Mhz)Lead Microprocessors frequency doubles every 2 yearsDoubles every2 yearsCourtesy, IntelPower DissipationP6Pentium proc486386286808680858080800840040.1110100197119741978198519922000YearPower (Watts)Lead Microprocessors power continues to increaseCourtesy, Intel40 结束语结束语