IGBT导热硅脂的涂抹及表面粗糙度要求(40页).doc

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1、-Thermal grease forInfineon modulesWhat should be the behavior and how agrease has to look like第 40 页-BaginskiIFAG AIM PMD ID AE2007-06-01ConsiderationsInfineon modules with baseplate: Roughness of baseplateRZmax. = 16 m;RZtyp. = 4 6 mInfineon modules without baseplate: Roughness of ceramicRZmax. =

2、9 m; RZtyp. = 3 4 mHeatsink: Specification of roughness regarding Application NoteModules with and without baseplate: RZmax. = 10 mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any descri

3、ption of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and envi

4、ronmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual pr

5、operty rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 2ConsiderationsExample of roughness of baseplate and heatsinkBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkThe information gi

6、ven in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communic

7、ation, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technolog

8、ies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2

9、006. All rights reserved.Page 3ConsiderationsThermal conductivity:Copper: 390 W / mKAluminium: 237 W / mKThermal compound: 1 W / mKCopperTIMAluminium= Thermal barrierThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and

10、shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementatio

11、n, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of

12、non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 4ConsiderationsRth CH metall Rth CH thermal grease0.004 mK/W 1 mK/W Rth CH air Metal t

13、o Metal contact essential= Thermal grease that fills only the gapes is preferedThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditi

14、ons or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this

15、presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any

16、 and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 5Diagram with thermal greaseDiagram with thermal greaseRth JCRth CHthermalgreaseRth HAR Rth greaseRth JCRth CH Rth CHthermalmetallgreaseRth HA| Rmetall th greaseConsideratio

17、nsThermal grease consists of different componentsOily partsOnly needed to adjust the viscosity of the greaseThermal conducting partsNecessary to conduct baseplate and heatsink togetherBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkThe information given in this presentation is given as a hint for the impl

18、ementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or met

19、hodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilit

20、ies of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 6ConsiderationsThermal int

21、erface material: Example for better understandingGrain size: Up to 70 mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or q

22、uality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presenta

23、tion must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all

24、 information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 7ConsiderationsExample: Thermal grease with 40 m size in applicationTemperaturedrop390 W/mKSmalltemp. dropBaseplateNo chance to moveOilypart1 W/mKBigtemp. dropHeat conductingpart237

25、 W/mKSmalltemp. dropHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies compone

26、nts. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described her

27、ein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-M

28、ar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 8ConsiderationsExample of grains of 40 m sizeGrease workslike distancespacersBaseplateHeatsink= RthCH = badThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies com

29、ponents only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user bef

30、ore implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitati

31、on warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 9ConsiderationsExample: Thermal grease with 5 m size in applicationTe

32、mperaturedropBaseplateHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies compo

33、nents. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described h

34、erein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6

35、-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 10ConsiderationsExample of grains of 5 m sizeHole to fix module with the heatsinkBaseplateHeatsinkMetal to metal contact possible= RthCH = goodThe information given in this presentation is given as a hint for the implement

36、ation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodol

37、ogy, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities o

38、f any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 11ConsiderationsViscosity of th

39、ermal grease: High viscosity (hard)BaseplateHeatsinkBaseplateHeatsinkDots ofgreasePermanentgapBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certa

40、infunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ

41、. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird pa

42、rty) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 12HeatsinkConsiderationsViscosity of thermal grease: Low viscosity (fluid)BaseplateHeatsinkBaseplateHeatsinkDots ofgreaseGreasecomesoutBaseplateThe i

43、nformation given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function describe