电子元器件封装图示大全(DOC44页)bytf.doc
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1、Evaluation Warning: The document was created with Spire.Doc for .NET.电子元器器件封装装图示大大全 LQFPP 1000LMETAAL QQUADD 1000LPQFPP 1000LQFPQQuadd Fllat PacckaggeQFPQQuadd Fllat PacckaggeTQFPP 1000LRIMMMRIMMMFor Dirrectt RaambuusSBGAASC-770 55LSDIPPSIMMM30SIMMM30PPinooutSIMMM30SSinggle In-linne MMemoory Moddule
2、eSIMMM72SIMMM72PPinooutSIMMM72SSinggle In-linne MMemoory ModduleeSIMMM72SSinggle In-linne MMemoory ModduleeSIPSSinggle Inllinee PaackaageSLOTT 1FFor inttel Penntiuum III PPenttiumm IIII & Ceelerron CPUUSLOTT AFFor AMDD Atthloon CCPUSNAPPTKSNAPPTKSNAPPZPSO DDIMMMSmaall Outtlinne DDuall Inn-liine Memm
3、oryy MoodulleSOSmmalll Ouutliine PacckaggeSOCKKET 3700Forr inntell 3770 ppin PGAA Peentiium IIII & Celleroon CCPUSOCKKET 4233Forr inntell 4223 ppin PGAA Peentiium 4 CCPUSOCKKET 4622/SOOCKEET AAForr PGGA AAMD Athhlonn & Durron CPUUSOCKKET 7Foor iinteel PPenttiumm & MMXX Peentiium CPUUSOHSOJ 32LLSOJSO
4、P EIAAJ TTYPEE III 144LSOT1143SOT2220SOT2220SOT2223SOT2223SOT223SOT223/SSOT3323SOT225/SSOT3353SOT226/SSOT3363SOT3343SOT5523SOT889SOT889SSOPP 166LSSOPPSockket 6033FossterrLAMIINATTE TTCSPP 200LChhip Scaale PacckaggeTO188TO2220TO2447TO2552TO2663/TTO2668TO2664TO3TO5TO522TO711TO722TO788TO8TO922TO933TO99
5、9TSOPPThiin SSmalll OOutllinee PaackaageTSSOOP oor TTSOPP IIIThiin SShriink Outtlinne PPackkageeLAMIINATTE UUCSPP 322LChhip Scaale PacckaggeuBGAAMiccro Balll GGridd ArrrayyuBGAAMiccro Balll GGridd Arrrayy VL BBus VESAA Loocall BuusXT BBus8bittZIPZig-Zagg Innlinne PPackkageeGulll Wiing Leaads HSOPP28
6、ISAIInduustrry SStanndarrd AArchhiteectuureITO2220ITO33pJ-STTDJ-STTDJoointt IPPC / JEEDECC SttanddarddsJEPJEPJJEDEEC PPubllicaatioonsJESDDJESDDJEDDEC StaandaardssJLCCCLCCLDCCCLGALLP 8LaaLQFPPPCDIIPPCI 32bbit 5VPPeriipheerall Coompoonennt IInteercoonneectPCI 64bbit 3.33VPeerippherral Commponnentt Inn
7、terrconnnecctPCMCCIAPDIPPPGAPPlassticc Piin GGridd ArrrayyPLCCCPQFPPPS/22PS/22mouuse porrt ppinooutPSDIIPDIMMM 1668DIMMM DDDRDIMMM1688Duaal IIn-llinee Meemorry MModuuleDIMMM1688DIMMM1688PinnouttDIMMM1844Forr DDDR SSDRAAM DDuall Inn-liine Memmoryy MoodulleDIPDDuall Innlinne PPackkageeDIP-tabbDuaal II
8、nliine Pacckagge wwithh Meetall HeeatssinkkEIAEIAJJEDEEC fformmulaatedd EIIA SStanndarrdsEISAAExttendded ISAA FBGAAFDIPPFTO2220Flatt PaackAC997AC997v22.2 speecifficaatioon 详详细规格格AGP 3.33VAcccelleraatedd Grraphhicss PoortSSpeccifiicattionn 2.0详细细规格AGP PROOAccceleeratted Graaphiics Porrt PPROSSpeccifi
9、icattionn 1.01详详细规格格AGPAAcceelerrateed GGrapphiccs PPorttSpeecifficaatioon 22.0详详细规格格AMRAAudiio/MModeem RRiseerAX0778AX144C-Beend Leaad CERQQUADDCerramiic QQuadd Fllat PacckCLCCCCNRCCommmuniicattionn annd NNetwworkkingg Riiserr Sppeciificcatiion Revvisiion 1.22CPGAACerramiic PPin Griid AArraayCeraam
10、icc CaaseLAMIINATTE CCSP 1122LChhip Scaale Pacckagge窗体顶端窗体底端BGABall Grid ArrayEBGA 680LLBGA 160LPBGA 217LPlastic BallGrid ArraySBGA 192LTSBGA 680LCLCCCNR Communication and Networking RiserCPGA Ceramic Pin Grid ArrayDIP Dual Inline Package DIP-tab Dual Inline Package with Metal HeatsinkFBGAFDIPFTO-22
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