铜线工艺培训教材.ppt

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1、铜线工艺培训教材铜线工艺培训教材ASMCopper Wire BondingIntroductiontocopperwirebondingCopperwirebonding,asthenameimplies,usescopperwiresinwirebondingtechnology.Copperwires,withitsexcellentcharacteristicsandproperties,haveprovedbondingresultsrobustandcomparabletothatofgoldwirebonding.Withtherecentgoodresultsandsucces

2、sbroughtaboutbythedifferentevaluationsandtestingperformedforcopperwirebonding,thetechnologyhaspointedoutitsadvantagesanddisadvantagesinwirebondingapplication.ASMCopper Wire PropertiesCopperwireadvantagesandpropertiesPossessestensilestrengthandelongationcharacteristicsthatarecomparabletogoldwireShows

3、excellentresponseinballneckformationaswellasloopstabilityduringplasticencapsulationormoldingprocessMoreconductivethangoldwireProvidesbetterheatdissipationandincreasedpowerratings(thatiswhymostpowerdevicesusecopperwiresinsteadofgoldwireswithoutaffectingprocessperformanceandpackagereliability)Hasducti

4、lepropertiesthatallowcopperwirestobeeasilydrawnintofinerwires(thatcanbeusedforultrafinepitchapplications)Costslesscomparedtothatofgoldwiregivingasmuch(sometimesevenbetter)performanceasthegoldwireASMCopper Physical PropertiesPhysicalCharacteristicsofCopper,GoldandAluminumAuCuAlDensity(g/cc)MeltingPoi

5、nt(C)ThermalConductivity*1ThermalExpansion*2ElectricalResistivity*3Units:*1(cal/cm,sec);*2(/Cx10-6);*3(-.cm)19.38.922.71106310836590.700.940.5714.217.023.52.31.672.69ASMCopper vs Gold in Ball ShearBothshowsgoodshearresponse(6.5g/mil2)GoldBallShearswithinballCopperBallshearswithinAlmetallizationASMCo

6、pper vs Gold in IntermetallicGoldBalliscoveredwithlargeIntermetalliccoverageCopperBallhasverylittleornoIntermetalliccoverageASMCopper Wire BondingWireRecommendedStorageConditionsN2cabinetatroomtemperature(2025C)4to6monthsshelflife(originallysealedpackage)insidetheN2cabinetOnceopenedandused,consumewi

7、thin23days.SparkingSequenceChangetocoppersequenceinEFOSettingmenuEFOwillsparkjustbeforebondingorZstarttomoveItsparksabove1stbondposition,goldsequencesparksat2ndbondposition.BQMAlwaysuseModeA138kHzASMCu Kit Installation ProcedureStep 1:Mount the Cu kit on the BH ModuleTighten two M3 screws with sprin

8、g washer after adjusting the kit in the x direction(left/right)refer to Fig.1Bondhead ModuleM3 screwsStopper ScrewUsed to tighten Cu kitFig.1:Cu Kit MountingASMCu Kit Installation ProcedureStep 2:Install a dummy capillaryA dummy capillary is preferred so as to prevent breakage during adjustment of C

9、u kit.refer to Fig.2Dummy capillaryFig.2:Dummy capASMCu Kit Installation ProcedureStep 3:Turn off BH power(Z motor)Lower down the transducer until capillary is touching the lowest possible contact position(i.e.DAP)refer to Fig 3Adjust the z position of the Cu kit nozzle.Note:Ensure that the cap scre

10、w is not hitting the nozzle and there is sufficient gap between the nozzle and window clampTop plateAdjustthexpositionaccordingtothespecificationof2mmdistancebetweencapwallandnozzletipAdjusttheypositionofthenozzleuntilthecapillary(atsideview)isseeninthemiddleofthenozzlehole.Fig.3:AdjustmentASMCu Kit

11、 Installation ProcedureStep 3a:Adjusting x,y,z position2 x M3 screws(x axis)1 x M3 screw(y axis)1 x M3 screw(z axis)1 x M3 stopper screw(z axis)ASMCu Kit Installation ProcedureStep 4:Fine tune x,y and z position of nozzleThe tip of the capillary should be within the nozzles openingDistance between c

12、apillary wall and tip of nozzle hole or=60um.Capillary is not limited by bond pad pitchWe choose big tip,CD size and smaller FAFirst bond do not have too much difficultyForm good FAB and bonding similar to Au wireSecond bond need good capillary and parameter to eliminate tail short and get high pull

13、 strengthUse Normal or Constant P BQM ModeLonger Rise Time or use power delayHigher Contact Force and Base ForceContact time can use up to 4 to 5ms,depends on clamping conditionMatte finish capillary has stable bondingASMSOT Bonding WireTypeTanaka1.0milCuwireDeviceSOT238RCapillarySPTUTF-38JE-CM-1/16

14、-XLTemperature230oCWireTypeTanaka0.8milcopperwireDeviceSOT238RCapillarySPTCUB-33HD-CM-1/16-XLTemperature230oCBallSize(um)BallShear(g)StitchPull(g)WirePull(g)63.1334.427.1912.77BallSize(um)BallShear(g)StitchPull(g)WirePull(g)68.4656.889.3018.63ASMParameters of SOT1.0milCopperWire0.8milCopperWire1stBo

15、nd2ndBond1stBond2ndBondStandbyPower15301530ContactTime1111ContactPower0000ContactForce120160110120PowerDelay0000BaseTime8888BasePower6510065120BaseForce3512035120WireClampForce100100100100SearchSpeed384384384384SearchHeight810810PowerModeA,Const-IA,Const-PA,Const-IA,Const-PRiseTime1313ContactThresho

16、ld24282428EFOCurrent40004000EFOTime11501000EFODelay55ASMSample Bonding Part II0.8-1.0mil Wire Fine Pitch Bonding(50um-80um BPP)ASM0.8-1.0mil Wire Fine Pitch Bonding Use dual nozzles to form centered FAB,E-torch is Pt 0.5mm in diameterChallengesFirst bond peeling and ball shape controlSecond bond fis

17、h tail and low pull strengthLooping controlCapillary selection is very important Capillary using smaller OR 6um for BGA and some L/FAdvance features is very helpful1st bond scrub to improve peeling and ball shear2nd bond SPC and bond smooth to enhance pull strength and stitch shapeNote:big contact f

18、orce cause fish tail(1mil wire use 60g)ASM0.8-1.0mil Wire Fine Pitch Bonding Looping issuesWire is easy to sway2nd kink is not sharpLoop height is difficult to controlLooping controlUse pull ratioControl landing angleUse last kink bump factorLHCorrection=-7SpanLength=20%SpanLengthAngle=1002ndkinkHT=

19、40%Slopestraightness=0LoopTop=NoPullratio=7milPullratiospeed=35%(inSpeedProfile)Searchspeed384SearchHT=12Lastkinkbumpfactor=-50degTraj=Arc5ASMTQFP176LdsSEM Photos Wire StraightnessLoop FormationWire Length Average 3mmASMOR Effect on 2nd BondCapillary STD OR 12umCapillary Cu OR 6umWedge shape between

20、 two caps OR12Break position(4-6g)Break position(6-8g)Bigger area of weld OR6:More compression and power transferASM50um BPP BondingASM50um BPP Bonding1st Bond&2nd Bond Shape40-SamplesBall Size(um)Ball Thickness(um)Ball Shear(g)Neck PullStitch PullMax39.97.717.92210.1355.45Min37.4611.6697.3143.463Ra

21、nge2.51.76.2532.8211.987Ave38.71256.9416.1031259.07454.703575BottomRightLeftUpASMParameters of 50um BPP ASMCu 65umCustomerdevice:LFBGAwithSTtestdieWireTypeAFWiCu1.0milCuwireEl:12-18%BL:8-15CapillarySPTSBNE-30AA-AZM-1/16-XLOR6micTemperature170oCASMParameters of 65um BPPParameterStandbyPowerDAC1520Con

22、tactTimems22ContactPowerDAC1020ContactForce g3060BaseTime ms812BasePowerDAC43150BaseForce g2770PF/FF4526WireClampOpen/close g8080Bond ParametersTailLength30FireLevel627SearchHeightD/L1212SearchSpeed1/2128/384BQM ParametersRisetime(1/2)11PowerLevel(1/2)HighLowPowerControl(1/2)ConstIConstIModeAAEFO Pa

23、rametersEFOCurrentmA48EFOtimems607EFOGapVoltage4500First bond table scrubT1=12Cycle=2Amplitude=6Yscrubdelay=0scrubzdelay=104SPCspeed72%Direction=CircleForce=20Power=25ASM70um BPP ATK1 Sample BondingCustomerdevice:PBGA1200withASM2000testdieWireTypeAFWiCu1.0milCuwireEl:12-18%BL:8-15gCapillarySPTSBNE-3

24、0XB-AZM-1/16-XL50MTAT95MICOR6MICTemperature170oCASMParameter of 70um BPPStandbyPower1520ContactTime22ContactPower1020ContactForce4060PowerDelay00BaseTime815BasePower45130BaseForce3060WireClampForceOpen/Close8085SearchSpeed128384SearchHight1212PowerFactor50ForceFactor25PowerModeConst-IConst-IRiseTime

25、11PowerLevelHighLowContactSearchThreshold2832EFOCurrent4800EFOTime696EFODelay3First bond table scrubT1=12Cycle=2Amplitude=6Yscrubdelay=0scrubzdelay=104SPCspeed72%Direction=CircleForce=20Power=25ASMSample Bonding Part III1.5-3mil Heavy Wire BondingASM1.5-3mil Heavy Wire BondingNeed to convert machine

26、 to 1kg configurationSingle STD nozzle is good enoughForming gas flow rate:0.6-0.8LPM1mm stainless E-torch need burn-in longer time before useCapillary should use matte finish tipPad metallization can affect bonding quality and bonding parameters greatlyForce is important factor for cratering and ta

27、il short improvementASMConversion Procedure Important:If the machine has been bonding under standard machine configuration and have decided to upgrade it to heavy machine configuration,save the calibration data to a diskette,mark it as Standard Calibration file and keep it for future use.Following c

28、ourses of action should be carried out Software and Motion Control UpgradeHardware Upgrade and CalibrationASMSoftware and Motion Control UpgradeSoftware Load the software and check for the necessary features needed for bonding.09.05.96 rev.8 ref 60 or higher supports Standard and Heavy Wire Bonding.

29、Note:09.05.96 rev.8 ref 60 or higher may contain Standard Servo or Heavy Servo Parameters.Motion ControlInsert the floppy disk in the floppy disk driver to update the motion control parameters for Heavy Wire bondingWarm start the bonder by turning the machine on off.ASMHardware Upgrade and Calibrati

30、onBondhead SystemOpen the back cover of the machine and change the Bondhead Driver to a 1 Kg(Heavy)Bondhead Driver.Bondhead Driver Identification Part No:02 82735(this is also the Wire Clamp Identification Part No.since both Bondhead and Wire clamp shares the same Driver)Standard Bondhead driver can

31、 output up to 450 g,while 1 Kg(Heavy)Bondhead Driver can output up to 1Kg.Feature Management:1000 gram bond force is YesPerform Bond force Calibration(follow the conventional Bond force calibration procedure)Specification:Force Ratio 1.0+/-0.1If Force ratio is not within the specification,use the Fo

32、rce Ratio Adjustment Unit to fine-tune the force ratio and perform calibration again until specification is met.ASMHardware Upgrade and CalibrationWireClampConfigurationInstallthe700gWireclamp(WireClampIdentificationPartNo.:0186836).Followtheconventionalprocedureonchangingwireclamp.Alignthewireclamp

33、tothetransducercapillaryholebythreadingawireandtightenthescrews.Installthewireclampcooling.ForheavyEagle60machine,aseparatecoolingforTransducerandWireclampwillbeinstalledat5LPMeach(StandardmachineusesthesplittypesharedwiththeTransducerat5lpm).Adjustthewireclampgapaccordingtothewiresizetobeused.Perfo

34、rmwireclampcalibrationatHVY700modeASMHeavy Wire Bonding ConfigurationWireSizevsWireClampgapandForceWireSize(mil)WireClampGap(mil)WireClampForce(g)(open)WireClampForce(g)(close)GoNogoMinMaxMinMax0.61.52.0506550650.71.52.0506550650.81.52.0507550750.91.52.0507550751.01.52.0709570951.21.52.0709570951.31

35、.52.01201501502001.53.04.01201501502002.03.04.02002503504502.54.05.02002503504503.04.05.0200250350450ASMHardware Upgrade and CalibrationInstall the EFO Box,EFO Cable and E torch:EFO BoxSG29,SG39,SG40 with the proper jumper may be used in Eagle 60 Heavy(1kg)Wire Machine.These EFO Boxes,with the prope

36、r jumpering setting,can supply up to 200mA.EFO CableHeavy EFO Cable:SG40 use 1k dual HV cable,others use 2k heavy cable Etorch1mm Platinum(Pt)E torch for gold wire bonding and 1.0 mm Std Steel or Pt E torch for Copper wire bonding is used for heavy wire bonding.ASMASMStandard E60 Vs 1kg Heavy Wire E

37、60MACHINE CONFIGURATIONSTANDARDHEAVYWire ClampConfigurationStandardHeavyWCW/CIdentificationPN01-8683601-88444ClampForceMax200gmMax700gmW/CDriverStandardHeavyDriverW/CDriverIdentificationPN02-827350282735withalabelmarked“HeavyWire”ClampGaprefertoAppFfordetailsrefertoAppFfordetailsW/CCooling8lpm(split

38、fromtransducercooling)IndividualFlowmeter;rate=5lpmEFO SystemEFOCurrent12-50/75mA50-200mAEFOBoxSG29*SG29*SG39*SG39*SG40M*-SG40*SG40*EFOCable3.9K2KDual3.9HVCable(SG40)Dual1kHVCable(SG40)E-Torch0.5mmPt(Au)1mmPt(Au)0.5mmStdSteel/Pt(Cu)1.0mmStdSteel/Pt(Cu)ASMBonding of Heavy WireBQM settings:Normal or C

39、onst-P mode for both 1st and 2nd bond Low level mode is usedRise Time put 2,3 or longer for cratering and tail short reasonContact force should be sufficient to deform ball and open wedge shapeContact force can reduce cratering and tail shortBond force should be bigger than powerThis can control bal

40、l shape and stitch shape wellBase Power 1st bond do not use too big value,sometimes need standby and contact power to compensate.2nd bond,the value will depend on the pull value and tail short.ASMBonding of Heavy WireContact timeIf lead frame is floating,contact time is longerLonger contact time can

41、 make bonding more stableReduce tail short and tangent ball problemStandby and contact powerIt is used as supplement power of base powerIt can increase ball shear/pull and reduce non-stickIt can not be very big,it can cause cratering or tail shortPower delayIf encounter tail short or cratering,you n

42、eed to try power delay CapillaryMatte finish is better for 2nd bondFA is 8 to 11 deg.Bigger tip size is easier to bondASMControl Parameters Z-SpeedProfile Blk0Acceleration:600010000Blk5Acceleration:800012000 WireClampBlocksBlk3,8,9closeattailBlk1,10openat1stand2ndsearchHTBlk5isidle,itisalways150gfor

43、copperBlk11isfeedwire,shouldbe150-250gorsameasBlk9 EndForceisYesThevalueissimilartocontactforce WireClamppre-triggeropenShouldbesmallerthan8orput0(defaultis16)ThiscancausetangentballASMMLP 2mil Cu WirePackageMLP deviceCu WireK&S 2.0mil DHF EL15-25%TS40-55g CapillaryGaiser 1520-25-437GM 82(5-8D-15)20

44、D-CDRBonding Temp.200oCASMMLP 2mil Cu WireASMParameters of MLPParameterSettingBase ParametersStandbyPower1/250/100ContactTime1/22/1ContactPower1/260/80ContactForce1/2200/600PowerDelay1/20/0BaseTime1/215/25BasePower85/100BaseForce1/2200/400PowerFactor0ForceFactor0BQM SettingsPowerModeA/APowerLevelhig

45、h/lowRiseTime2/2PowerControlConst-I/NormalEFO ParametersEFOCurrent15000EFOTime1300EFOVoltage5000EFODelay10TailLength50FormingGasFlowRate0.6-0.8LPMSearchHeight1/220/20SearchSpeed1/2384/384SPT1/248/15ReleaseForce1/220/60ReleaseTime1/21/8EndForce1/235/3502ndBondEnhancerModeF2ndBondSPCEnabledASMTroubles

46、hooting of BondingTangent ballCheck FAB shape,is oxidized or off-centered?Check 2nd bond parameter,increase force and reduce powerCheck Wire Clamp pre-trigger open and Speed ProfileIncrease contact force and contact timeCratering Increase contact force and base forceReduce base power,if has non-stic

47、k,increase standby or contact powerUse 1st bond scrubASMTroubleshooting of BondingTail shortUse big force and small powerUse power delayIncrease contact time and contact forceUse Normal or Const-P BQM modeChange capillary type and check copper wireLow pull strengthAdjust power and force Check capillary lowest contact positionUse SPC and 2nd bond scrubASMThank You