硬件工程师英文简历表格.doc

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1、此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。硬件工程师英文简历表格每位求职者想要赢得招聘单位的认可，首先需要展现自己独有的竞争力，能够依靠个人简历将优势突出展现与招聘人员的面前，让招聘单位感觉到求职者能够胜任招聘的岗位需求。只要可以获得招聘人员的认可，求职者获得工作机会的概率非常高。任何企业在招聘的时候，均希望招聘到工作经验较为丰富的求职人员。优质的人才不仅需要具备较高的学历水平，同时更为难得的是丰富的经验。具备丰富经验的工作人员，可以在更短的时间内完成全部的工作内容，有效降低企业运行的成本。因此企业在招聘的时候，更加重视个人简历的工作经历内容，任何信息均

2、可以忽略，但是填写工作经历的时候必须谨慎小心。通过填写与招聘岗位类似的工作经历，可以达到更好的求职效果。求职者是否具备丰富的经验直接影响到能够获得满意的工作。实际参与竞争的时候，能够在个人简历具体内容上突出个人丰富的工作经历，可以增加招聘单位对于自己的认可程度，从而达到提高求职者竞争力的效果，帮助求职者在更短的时间内，找到满意的工作单位。所以在写作简历时就要注意了，更多相关资讯请继续关注个人简历网站。Name：XXXHukou：Residency：ShanghaiWork Experience：Current Salary：Tel：E-mail：www.XXX.comCareer Object

3、iveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan

4、 ,MacaoDesired Salary：NegotiableWork Experience2020/06;Present*CompanyIndustry: Electronics/Semiconductor/ICIntel Flash Engineering Department Individual Contributor Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June

5、of 2020.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:1.The yield of year 2020 has been dramatically increased than that of year 2020.2.The yield of all products, consecutively meets the goal.3.The total amount of co

6、st saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team member

7、s, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.Report Directly to: Department ManagerNumber of Subordinate: 14Reference: Bao PowelAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our effo

8、rts are paid off:1.The yield of year 2020 has been dramatically increased than that of year 2020.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repair Team

9、 in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.2020/01;2020/05Intel(Shanghai)

10、 Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics Development Engineer Responsibilities：1.I had been working in STTD-China since Jan 2020 to May 2020 as a senior module engineer.2.At that time, as a main contributor of this project, we

11、succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumber of Subordinate: 14Reference: Bao PowelReason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the intern

12、al re-organization in June of 2020.Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2020/05;2020/01Nanyang University of Scienc

13、e & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Research Fellow Responsibilities：1.I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.2.I majored at Gate Oxid

14、e Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acqui

15、red the wonderful data for the project by myself.Project Experience2020/01;PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing g

16、uy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2020/01;2020/12Marginal Electrical Boards RescueProject Des

17、cription: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took

18、 the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2020/10;2020/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficienc

19、y, a Task Force team has been called and started by me.Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.2020/05;2020/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a

20、Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.Responsib

21、ility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2020/05;2020/01Nanyang University of Science & Technology Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research

22、Fellow. I major at Gate oxide Reliability research in the duration.2020/03;2020/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of 2020 to March of 2020 as a Post-doctor. Where I unhook the proj

23、ect of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.2001/03;2020/03Shanghai Institute of Microsystemsand I

24、nformation Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09;2001/03Nanjing University of Science & Technology Material Science and Engineering MasterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical cha

25、racteristics.1993/09;1997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor1997/07;1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional Skills

26、Language Skills：English: EXCELLENTKorean:AVERAGEComputer Skills：Technology skilled 96MonthSAPunderstanding 8MonthCertificate：2000/11MCSE1999/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.