电气工程英文简历表格.doc

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1、此资料由网络收集而来，如有侵权请告知上传者立即删除。资料共分享，我们负责传递知识。电气工程英文简历表格作为求职者想要凭借个人简历求职成功就必须要知道自己有什么样的求职优势，了解自己的求职优势才能够掌握编写个人简历中的侧重点。金无足赤人无完人，在个人简历的编写中要学会扬长避短。如果你没有高等学历就需要着重编写专业技能，如果你没有工作经验就需要着重编写学业成就，如果你没有专业技能就需要着重编写英语水平。在个人简历中要挑选自己擅长的技能编写，这样才能够更大程度上取得用人单位的青睐，从而获得面试机会。有针对性的个人简历更容易获得面试机会，想要通过个人简历获得招聘人员的认可在编写个人简历之前就要知道自己

2、想要在用人单位中获得一个什么样的职位。当明确自己的职位过后就可以按照职位所需要的人才来编写自己的个人简历，并且在编写工作经验时也需要选择与职位相关的来编写。Name:XXXSex：Date of Birth：Hukou：Residency：Work Experience：Current Salary：Tel：E-mail：www.XXX.comCareer ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesi

3、red Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2020/06;Present*CompanyIndustry: Electronics/Semiconductor/ICIntel

4、Flash Engineering Department Individual Contributor Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June of 2020.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. O

5、ur efforts are paid off:1.The yield of year 2020 has been dramatically increased than that of year 2020.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repa

6、ir Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.Report Directly to: Dep

7、artment ManagerNumber of Subordinate: 14Reference: Bao PowelAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our efforts are paid off:1.The yield of year 2020 has been dramatically increased than that of year 2020.2.The yield of al

8、l products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2020. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the sch

9、edule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2020.2020/01;2020/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics

10、Development Engineer Responsibilities：1.I had been working in STTD-China since Jan 2020 to May 2020 as a senior module engineer.2.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 uni

11、ts in one time.Report Directly to: Hopman MarkNumber of Subordinate: 14Reference: Bao PowelReason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2020.Achievements: As a main contributor of STTD-China department, I co-work with my

12、 colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2020/05;2020/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Resear

13、ch Fellow Responsibilities：1.I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.2.I majored at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick

14、LowReason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2020/01;PresentAssembly NPI (New Product Introd

15、uction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working

16、as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2020/01;2020/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We

17、categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follo

18、w up the progress.2020/10;2020/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.Responsibility: Being the Project leader, I take the main r

19、esponsibility, such as, design, plan, organize and implement.2020/05;2020/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the f

20、ailure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up

21、.Education and Training 2020/05;2020/01Nanyang University of Science & Technology Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.2020/03;2020/03Seoul National University of Kor

22、ea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of 2020 to March of 2020 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CM

23、OS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.2001/03;2020/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09;2001/03Nanjing University

24、 of Science & Technology Material Science and Engineering MasterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.1993/09;1997/07Nanjing University of Science & Technology Material Science and Engineering Bachel

25、or1997/07;1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENTKorean:AVERAGEComputer Skills：Technology skilled 96MonthSAPunderstanding 8MonthCertificate：2000/11MCSE1999/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.