BSOB模式与BBOS模式.ppt
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1、ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New HeightsCHAPTER 61 1ASMASMASMTechn
2、ology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New HeightsBond Stick On Ball(BSOB)/Bond Ball On St
3、itch(BBOS)/Tail Break2 2ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights1.
4、0)BOND STICK ON BALL(BSOB)1.1)DescriptionThis bonding process is specially developed by ASM to handle multi-die(MCM)bonding application.In the conventional approach,if one is trying to connect the gold wire from one die to the another,a capillary mark of second bond will be evident on top of the die
5、 which may damage the die.The BSOB process will solve this problem by bonding a ball onto the dies surface first,followed by bonding another wire where the second bonds wedge will be landing on top of this bonded ball(figure 1).3 3ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Si
6、ngapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New HeightsDie 1Die 2Bond Ball2nd Bond(wedge)1st Bond Figure 1:Bond Stick On Ball(BSOB)4 4ASMASMASMTechnol
7、ogy SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights2.0)BOND BALL ON STITCH(BBOS)/SECURITY BON
8、D2.1)DescriptionThis process is also known as security bond.It bonds a ball on top of the wedge of the normal connection wire.This process is mainly used to secure the second bond sticking capability.(Figure 2)Die 1LeadBond Ball2nd Bond(wedge)1st Bond Figure 2:Bond Ball On Stitch(BBOS)5 5ASMASMASMTe
9、chnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.1)Free Air Ball(FAB 2)is aligned to
10、 the center of the bond pad on device 2.Device 1Device 2FAB 23.0 STANDOFF BALL CONTROL BONDING SEQUENCE6 6ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring
11、to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.2)Capillary descends and bonds ball to bond pad.Device 1Device 2W/clamp openCapillaryApplication of 1st bond stand off ball parameter to form Ball Thickness and Ball SizeDuring Stand Off Bonding,SOB parameters are appl
12、ied.7 7ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.3)Capillary rises
13、 to loop base to clear ball.Device 1Device 2W/clamp openCapillary rises to set Loop BaseLoop BaseContact Pt.Loop base is the distance between the capillary tip and contact point.Recommended setting=28 8ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-75263
14、11,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.4)Capillary move to programme ball offset.Ball offset can be programmed towards or away from the first bond.+ve towards 2n
15、d bond -ve away 2nd bond Device 1Device 2W/clamp openActual Ball Offset=Setting x 10umIf Ball Offset Setting=22Then Actual Loop Base=220umRecommended Setting=-ve 359 9ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue
16、7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.5)Capillary descends and forms stitch bond on top of the ball.Device 1Device 2W/clamp open*Ball ThicknessSOB Parameter (Stand Off Ball Parameter)Capillary de
17、scends to set Ball Thickness(Amt.Z movement above the ball height)Contact Pt.*Ball Thickness is the distance between the capillary tip and contact point Recommended setting=2 1010ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yi
18、shun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.6)Capillary moves horizontally for a scrub distance to weaken the wire at ball neck.Device 1Device 2W/clamp openScrub one direction away from bal
19、lActual Scrub Distance=Setting x 0.8 umIf Scrub Distance Setting=10Then Actual Scrub Distance=8 um Capillary move to set Scrub Distance One direction ONLY-Away from the ball Recommended setting=81111ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,
20、Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.7)Capillary rises to tail heightDevice 1Device 2W/clamp closeCapillary moves to set Tail Length(Amount Z movement above the b
21、ump before the wire clamp closes)Recommended setting=351212ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to
22、New HeightsSoaring to New Heights3.8)Capillary rises and tears the wire,as BH ascend to Fire Level.Device 1Device 2W/c close1313ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax
23、:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.9)EFO fires to form free air ball.Cycle repeats until all“Standoff Ball”are placed.Device 1Device 2Bond BallFAB1414ASMASMASMTechnology SingaporeTechnology Singapore2 Yishun Avenue 7,Singapore 7689
24、24.Tel:(65)-7526311,Fax:(65)-75822872 Yishun Avenue 7,Singapore 768924.Tel:(65)-7526311,Fax:(65)-7582287 Soaring to New HeightsSoaring to New HeightsSoaring to New HeightsSoaring to New Heights3.10)After placing all standoff balls.The machine continue to bond wires.2nd Bond(wedge)1st Bond Device1Dev
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- 关 键 词:
- BSOB 模式 BBOS
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