SMT生产能力评估审计worksheet.ppt

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1、SMT MANUFACTURINGCAPABILITY ASSESSMENTSCORE BOOKCategory 1:Design for ManufacturabilityCriteria 1.1 Concept and PracticeElementsDesigners or responsible staff can explain the concept of DFM Management and how company deploy them.Design guidelines are available,cross reference to production line capa

2、bility,process requirements and Quality standards.GreenRedThere are reports and meetings between Process&Design department on DFM Yield for every product.Evidence of using all findings.Checklist and/or software are used for DFM assurance.System available to ensure implementation.StrengthsImprovement

3、 OpportunitiesRemarksApproachImplementationTotal Element ScoreDesigners and Process Engineer can explain the importance of DFM with examples.Awareness1)2)Aware that there are various DFM rules in the industry,each of them has their specific conditions.3)4)There is a in-house DFM training and control

4、 system.5)6)7)Both process and design engrs are trained on DFM(with control records).8)9)50%50%50%3333Design and Process Engineers can demonstrate understanding of design rules.10)The responsibility to ensure good DFM is clear in everyones mind.Category 1:Design for ManufacturabilityCriteria 1.2 Pro

5、cess knowledgeElements1)Designers aware the importance of them knowing SMT process and the design rules shold not be determined without knowing the inhouse process.GreenRedStrengthsImprovement OpportunitiesRemarks-placement alignment method vs SMDs.-feeder efficiency.-IR vs Hotair reflow.-paste/glue

6、 printing vs dispensing.ApproachImplementationTotal Element ScoreAwareness2)Designers can clearly explain the various types of process used in their production.(types,main characteristics and application).3)There are in-house Process training course design for designers.System is available to ensure

7、 implementation.4)Process release documents are available in the Design department and cross link to their design rules.5)Supporting documents for DFM rules from the process point of view is well organized and maintained.6)Designers are able to explain key process parameters:7)Designers know what is

8、 process window and how their design rules relate to the process window.8)Designers who responsible for design release(or DFM check)are trained in Process knowledge(control and records).012390%80%40%Category 1:Design for ManufacturabilityCriteria 1.3 Design Know-how(substrate selection)Elements1)Des

9、igners aware that there are many different substrate types and each have different consideration in process and product reliability.GreenRedStrengthsImprovement OpportunitiesRemarksApproachImplementationTotal Element ScoreAwareness2)Designers believe that theyare are encouraged and have made all nec

10、essary considerations to select their existing range of substrates.3)There are documents specified the types of substrate and consideration.Inhouse requirements are defined.4)Substrate selection is one of the key design flow with control,to ensure such consideration is made during the design.Checkli

11、st are design and provided.5)Designer can name common types of substrates,explained key differences and the impact to production on the PCB finishing types(HAL,NiAu,OSP).6)Designers know how to define PCB warpage to ensure good DFM.7)Designers know the sources of dimensional error in PCB and their t

12、ypical magnitudes.Well defined in design rules with process capability and quality standards.012390%80%40%Category 1:Design for ManufacturabilityCriteria 1.4 Design Know-how(SMD selection)Elements1)Designers aware that International stds(EIAJ,EIA,JEDEC etc.)have someGreenRedStrengthsImprovement Oppo

13、rtunitiesRemarksdifferences.Also matrix and Imperial system.ApproachImplementationTotal Element ScoreAwarenessDesigners aware that different SMDs have different impact to quality and require different design consideration.2)3)Information about package types and their failure mechanism are available.

14、Every SMD has gone through a DFM verification process during design.4)Designers know that package types also affect productivity(able to give examples).Information about production capability related to package types such as nozzle type,alignment capability and speed etc.are available.5)Designer abl

15、e to explain effect of different standoff height of SOIC:-high standoff for glue or cleaning process.-low standoff for PCBA profile and better thermal conductivity.6)Designers know the effects of different lead types:-Gull Wing(long/short),-J lead,-Leadless SMD,-Ball grid.7)Designers know the consid

16、eration of large chips as compare to small chips:-on thermal mismatch,-on board warpage,-on orientation.8)012390%80%40%Category 1:Design for ManufacturabilityCriteria 1.5 Design Know-how(Thermal management)Elements1)Designers aware that Thermal mismatch is a major problem in SMT and required differe

17、nt consideration as THT.GreenRedStrengthsImprovement OpportunitiesRemarksApproachImplementationTotal Element ScoreAwareness2)Designers aware that Thermal design affects not only product performance and life,but also production yield.3)Documents for both product performance and asssembly consideratio

18、n related to thermal characteristics of SMD are available.4)There are test records for all common SMD packages used in terms of thermal fatigue life(from in-house,external sources or suppliers).5)Designers able to explain which of the following are more suspective to thermal problem and why:-1206 vs

19、 0805,-LCC vs PLCC,-QFP vs PLCC.6)Designers can explain different between THT and SMT in the aspect of thermal consideration.7)Designers know some method of eliminating thermal mismatch problems:-compliant layer PCB,-standoff joints,-leaded SMDs,-matching materials,-use Cu clad Invar cord.012390%80%

20、40%Category 1:Design for ManufacturabilityCriteria 1.6 Design Know-how(Solderland)Elements1)Designers aware that solderland design are important for manufactureability and are specific to components,production capability and quality standards.GreenRedStrengthsImprovement OpportunitiesRemarksApproach

21、ImplementationTotal Element ScoreAwareness3)Design rules includes cross references such as production capability,PCB&component specification,process type and qaulity standards.4)Designers are trained on how to determine own inhouse solderland specification and always work together with the process e

22、ngineering staff.5)Designers able to explain the use of different solderland size for 0805C and 0805R,or why it is not being use inhouse.6)Designers able to show calculation of soldeland dimensions which considered SMD&PCB tolerances,process type/capability and Q std.7)Solderland definition includes

23、:-SMD&PCB tolerances,-Process definition,-Process/Equip.Cpk,-SMD Spacing,-Dummy tracks,-Solder resist.8)Designers able to explain how solderland affect process problems such as:-Tombstone,-Solder balling,-Shorts,-Shadowing,-Wicking or Welling.9)Are special shape of solderland ever being considered f

24、or small chips,small IC corner pads,SOT23 or other example etc.Why?2)Designers can give examples of process failure due to solderland design problems,by comparing difference between wave and reflow process.012390%80%40%Category 1:Design for ManufacturabilityCriteria 1.7 Design Know-how(PCB layout)El

25、ements1)Designers aware that the layout of SMDs and PCB also affects products manufacturability and long term product reliability(examples).RedStrengthsImprovement OpportunitiesRemarksDesigners know why special Annular Ring shape(filleting,corner entry,key hole)are used or not used.ApproachImplement

26、ationTotal Element ScoreAwareness3)Comprehensive PCB layout requirement documents are available.Supported by technical evaluation reports/market standards.5)Design of fiducial:-shape,-no.,-Global/local/circuit,-contrast,-asymmetrical location,-clearance.6)Design of Via:-fillet,-aspect ratio 0.4mm,-k

27、eepout zone.7)SMDs near breakaway edges,hinge and connector force in,has keep out zone and orientation well defined.8)Green4)DFM checklist includes orientation and layout checks.It is a standard checking process in the product development.2)Designers know the effect of layout w.r.t.to the following

28、processes:-Reflow oven,-Stencil Printing,-Placement012390%80%40%Category 1:Design for ManufacturabilityCriteria 1.8 Design Know-how(Stencil)Elements1)Designers know that stencil design should be part of the total design responsibility and related to solderland&printing process.GreenRedStrengthsImpro

29、vement OpportunitiesRemarksApproachImplementationTotal Element ScoreAwareness3)Design rules shown that stencil design is closely related to solderland.Cpk of all printing process are recorded and used as a design guide.5)Designers able to explain the effects of:-too large aperture,-too small apertur

30、e,-wrong aspect ratio,-different aperture shape.6)Designers know how to define the clearance of aperture to pad size.Related to Cpk of printing and PCB stability.7)Aperture design is smaller than pad and pad tolerance is-0.0+0.X to ensure no solder balling etc.8)Different aperture shapes are used fo

31、r large chips 1206.2)Designers able to mention the key parameters of stencil and how they relate to the assembly process.4)All key stencil parameters are clearly defined in the Purchasing specification(such as stencil fabricating process,materials,thickness etc.)012390%80%40%Category 2:Process Capab

32、ilityCriteria 2.1 Process conceptElements1)Engineers know why process control is needed when test&QC are available.RedThere is evidence for using process control.e.g.use of Cpk measurement from time to time,control chart etc.StrengthsImprovement OpportunitiesRemarksApproachImplementationTotal Elemen

33、t ScoreAwareness3)There are evidence that the management stress on process control more than Inspection,test and rework.5)6)Engineers can explain what are the process windows for their current processes.7)Engineers can explain what is Cp and Cpk.2)Engineers know Process control starts from stabilizi

34、ng the process,and is sure that their process is already stabilized at this moment.Green4)The 4 steps of Process control(design,installation,tuning,control)are being used in the organization in some ways.012390%80%40%Category 2:Process CapabilityCriteria 2.2 Process know-howElements1)Engineers can d

35、escribe in confidence,the types of Process used in-house and their Process standards w.r.t.to the industry.GreenRedStrengthsImprovement OpportunitiesRemarksApproachImplementationTotal Element ScoreAwareness2)Engineers know that every process(including rework)has its way and capability.Able to descri

36、be what is the process parameters of certain process.3)There is in-house process courses design for different level of staff.System available for training control.Backup by frequently external training.4)The Process Cpk or similar measurement are used whenever possible,closely related to the design

37、rules.Example can be given.6)Engineers able to demonstrate good process control in the Printing process.-setting of parameters,-print interval control,-monitoring or print results.7)Understand effect of Coplanarity and how to define its specification.8)Able to define Solder Ball problem and know the

38、 possible causes of it.9)Able to explain what contribute to Tombstoning problem and how to eliminate it.10)Able to explain why baking of bare PCBs and SMDs were used or not used.5)Process related handbook(problems&solutions),research reports etc.are available and maintained.11)Able to explain the de

39、tails of a reflow profile(e.g.Max&Min peak temp.,soaking requirement etc.).012390%80%40%Category 2:Process CapabilityCriteria 2.3 Process ToolsElements1)Aware that use of process control tools is important,able to tell what are needed and able to describe the readiness of in-house tooling.RedStrengt

40、hsImprovement OpportunitiesRemarksFollowing tools are available:-Measuring Microscope,-Camera option,-air speed meter -Thermometer,-profiler,-XY table,-weighting m/c -torque meter -paste stirrer -viscosity meter -height measurementApproachImplementationTotal Element ScoreAwareness3)Responsibility of

41、 Maintenance and Calibration of tools are assigned,properly done and recorded.4)There are evidence of in-house designed tools for ease of process measurement and control.5)Operators have proper knowledge of using the tools.e.g.Human error elimination,right test conditions and approach.7)Methods are

42、available for most processes in measurement and control.Hard and soft Tools are used extensively in these methods.8)Green2)Aware that tools for process measurement are not always available and should be designed and fabricated to fit in-house requirements.There are evidence of using the above tools

43、for process control.6)012390%80%40%Category 2:Process CapabilityCriteria 2.4 Process StandardsElements1)Engineers know that Process Characteristics are specific in each line and each factory,and should be characterized and documented.GreenRedStrengthsImprovement OpportunitiesRemarksApproachImplement

44、ationTotal Element ScoreAwareness3)Process Standards are available,documentation consists of Process description,Process windows,Cp and Cpk,dppm level and maintenance methods etc.4)Process Standards were developed base on true experience and scientific ways rather than copying or judgement.Reference

45、 to DFM,Equip.&Quality stds.5)Special Process Standards are developed during each product process tuning.And subsequently reviewed and feedback from production to improve std.7)Engineers can explain why the process standard are written in the number of different level as it is now.e.g.1 class or 2 c

46、lasses.8)Engineers able to explain 1 or 2 standards clearly from the document.9)Process std is used in product design,or deviation from this process std will have additional verification or remarks for action during process tuning.2)Engineers can explain the use of Process standards,in relation to D

47、FM,Quality,and Equipment standards.6)Standards are design into different levels for ease of use(checklist,specification,and explanation).012390%80%40%Category 2:Process CapabilityCriteria 2.5 Process Installation and TuningElements1)Engineers aware that every new product will need a Process Installa

48、tion and Tuning(able to explain what is process installation and tuning).GreenRedStrengthsImprovement OpportunitiesRemarksApproachImplementationTotal Element ScoreAwareness2)Engineers can explain the benefits of process tuning and relation to process design and process control.Also what are the outp

49、uts from tuning.3)Process installation&tuning is clearly define as a procedures in pre-production.With all inputs(from process design phase)and outputs.5)Process Installation includes:-material check,-m/c parameters setting,-m/c status,-process design outcome documentation.6)Material Checking includ

50、es at least:-Stencil,-Solder Paste,-Adhesive,-PCBs,-SMDs.7)Process tuning records are available for each and every product.8)Production process control is closely based on the output of tuning.4)PCB supplier test data are sufficient and compared with incoming test results.(able to explain why is not