计算机术语英文缩写解释.docx
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1、在使用计算机的过程中,各种各样的专业术语,特别是那些英文缩写常让我们不知所云,下面收集了各方面的词组,希望对大家有帮助。一、港台术语与内地术语之对照港台计算机发展相对快,许多人都去港台寻找资料,但是港台的电脑专业术语与内地不同,你也许曾被这些东西弄得糊里糊涂的。港台术语内地术语埠接口位元位讯号信号数码数字类比模拟高阶高端低阶低端时脉时钟频宽带宽光碟光盘磁碟磁盘硬碟硬盘程式程序绘图图形数位数字网路网络硬体硬件软体软件介面接口母板主板主机板主板软碟机软驱记忆体内存绘图卡显示卡监视器显示器声效卡音效卡解析度分辨率相容性兼容性数据机调制解调器二、英文术语完全介绍按照字母排序:1、CPU3DNow!(3
2、D no waiting,无须等待的3D 处理)AAM (AMD Analyst Meeting, AMD 分析家会议)ABP (Advanced Branch Prediction,高级分支预测)ACG (Aggressive Clock Gating,主动时钟选择)AIS (Alternate Instruction Set,交替指令集)ALAT (advanced load table,高级载入表)ALU (Arithmetic Logic Unit,算术逻辑单元)Aluminum (铝)AGU (Address Generation Units,地址产成单元)APC (Advanced
3、 Power Control,高级能源控制)APIC (Advanced rogrammable Interrupt Controller,高级可编程中断控制器)APS (Alternate Phase Shifting,交替相位跳转)ASB (Advanced System Buffering,高级系统缓冲)ATC (Advanced Transfer Cache,高级转移缓存)ATD (Assembly Technology Development,装配技术发展)BBUL (Bumpless Build-Up Layer,内建非凹凸层)BGA (Ball Grid Array,球状网阵排列
4、)BHT (branch prediction table,分支预测表)Bops (Billion Operations Per Second,10亿操作秒)BPU (Branch Processing Unit,分支处理单元)BP (Brach Pediction,分支预测)BSP (Boot Strap Processor,启动捆绑处理器)BTAC (Branch Target Address Calculator,分支目标寻址计算器)CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)CDIP (Ceramic Dual-In-Line,陶瓷双重直线)Cente
5、r Processing Unit Utilization,中央处理器占用率CFM (cubic feet per minute,立方英尺秒)CMT (course-grained multithreading,过程消除多线程)CMOS (Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)CMOV (conditional move instruction,条件移动指令)CISC (Complex Instruction Set Computing,复杂指令集计算机)CLK (Clock Cycle,时钟周期)CMP (on-chip mul
6、tiprocessor,片内多重处理)CMS (Code Morphing Software,代码变形软件)co-CPU (cooperative CPU,协处理器)COB (Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度)COD (Cache on Die,芯片内核集成缓存)Copper (铜)CPGA (Ceramic Pin Grid Array,陶瓷针型栅格阵列)CPI (cycles per instruction,周期指令)CPLD (Complex Programmable Logic Device,辘可程式化暹元件)CPU (Cent
7、er Processing Unit,中央处理器)CRT (Cooperative Redundant Threads,协同多余线程)CSP (Chip Scale Package,芯片比例封装)CXT (Chooper eXTend,增强形 K6-2内核,即 K6-3)Data Forwarding (数据前送)dB (decibel,分贝)DCLK (Dot Clock,点时钟)DCT (DRAM Controller, DRAM 控制器)DDT (Dynamic Deferred Transaction,动态延期处理)Decode (指令解码)DIB (Dual Independent
8、Bus,双重独立总线)DMT (Dynamic Multithreading Architecture,动态多线程结构)DP (Dual Processor,双处理器)DSM (Dedicated Stack Manager,专门堆栈管理)DSMT (Dynamic Simultaneous Multi thread i ng,动态同步多线程)DST (Depleted Substrate Transistor,衰竭型底层晶体管)DTV (Dual Threshold Voltage,双重极限电压)DUV (Deep Ultra-Violet,纵深紫外光)EBGA (Enhanced Ball
9、 Grid Array,增强形球状网阵排列)EBL (electron beam lithography,电子束平版印刷)EC (Embedded Controller,嵌入式控制器)EDB (Execute Disable Bit,执行禁止位)EDEC (Early Decode,早期解码)Embedded Chips (嵌入式)EM64T (Extended Memory 64 Technology,扩展内存64技术)EPA (edge pin array,边缘针脚阵列)EPF (Embedded Processor Forum,嵌入式处理器论坛)EPL (electron project
10、ion lithography,电子发射平版印刷)EPM (Enhanced Power Management,增强形能源管理)EPIC (explicitly parallel instruction code,并行指令代码)EUV (Extreme Ultra Violet,紫外光)EUV (extreme ultraviolet lithography,极端紫外平版印刷)FADD (Floationg Point Addition,浮点加)FBGA (Fine-Pitch Ball Grid Array,精细倾斜球状网阵包装)FBGA (flipchip BGA,轻型芯片 BGA)FC-
11、BGA (Flip-Chip Ball Grid Array,翻转芯片球形网阵包装)FC-LGA (Flip-Chip Land Grid Array,翻转接点网阵包装)FC-PGA (Flip-Chip Pin Grid Array,翻转芯片球状网阵包装)FDIV (Floationg Point Divide,浮点除)FEMMS: Fast EntryExit Multimedia State,快速进入退出多媒体状态FFT (fast Fourier transform,快速热欧姆转换)FGM (Fine-Grained Multithreading,高级多线程)FID (FID: Fre
12、quency identify,频率鉴别号码)FIFO (First Input First Output,先入先出队列)FISC (Fast Instruction Set Computer,快速指令集计算机)flip-chip (芯片反转)FLOPs (Floating Point Operations Per Second,浮点操作秒)FMT (fine-grained multithreading,纯消除多线程)FMUL (Floationg Point Multiplication,浮点乘)FPRs (floating-point registers,浮点寄存器)FPU (Float
13、 Point Unit,浮点运算单元)FSUB (Floationg Point Subtraction,浮点减)GFD (Gold finger Device,金手指超频设备)GHC (Global History Counter,通用历史计数器)GTL (Gunning Transceiver Logic,射电收发逻辑电路)GVPP (Generic Visual Perception Processor,常规视觉处理器)HL-PBGA表面黏著,高耐热、轻薄型塑胶球状网阵封装HTT (Hyper-Threading Technology,超级线程技术)Hz (hertz,赫兹,频率单位)I
14、A (Intel Architecture,英特尔架构)IAA (Intel Application Accelerator,英特尔应用程序加速器)IATM (Intel Advanced Thermal Manager,英特尔高级热量管理指令集)ICU (Instruction Control Unit,指令控制单元)ID (identify,鉴别号码)IDF (Intel Developer Forum,英特尔开发者论坛)IDMB (Intel Digital Media Boost,英特尔数字媒体推进指令集)IDPC (Intel Dynamic Power Coordination,英
15、特尔动态能源调和指令集)IEU (Integer Execution Units,整数执行单元)IHS (Integrated Heat Spreader,完整热量扩展)ILP (Instruction Level Parallelism,指令级平行运算)IMM Intel Mobile Module,英特尔移动模块Instructions Cache,指令缓存Instruction Coloring (指令分类)IOPs (Integer Operations Per Second,整数操作秒)IPC (Instructions Per Clock Cycle,指令时钟周期)ISA (ins
16、truction set architecture,指令集架构)ISD (inbuilt speed-throttling device,内藏速度控制设备)ITC (Instruction Trace Cache,指令追踪缓存)ITRS (International Technology Roadmap for Semi conductors,国际半导体技术发展蓝图)KNI (Katmai New Instructions, Katmai 新指令集,即 SSE)Latency (潜伏期)LDT (Lightning Data Transport,闪电数据传输总线)LFU (Legacy Fun
17、ction Unit,传统功能单元)LGA (land grid array,接点栅格阵列)LN2(Liquid Nitrogen,液氮)Local Interconnect (局域互连)MAC (multiply-accumulate,累积乘法)mBGA (Micro Ball Grid Array,微型球状网阵排列)nm (namometer,十亿分之一米毫微米)MCA (Machine Check Architecture,机器检查架构)MCU (Micro-ControIler Unit,微控制器单元)MCT (Memory Controller,内存控制器)MES I (Modifi
18、ed, Exclusive, Shared, Invalid:修改、排除、共享、废弃)MF (MicroOps Fusion,微指令合并)mm (micron metric,微米)MMX (MultiMedia Extensions,多媒体扩展指令集)MMU (Multimedia Unit,多媒体单元)MMU (Memory Management Unit,内存管理单元)MN (model numbers,型号数字)MFLOPS (Million Floationg PointSecond,每秒百万个浮点操作)MHz (megahertz,兆赫)mil (PCB或晶片怖局的房度军位,1 mi
19、l =千分之一英寸)MIMD (Multi Instruction Multiple Data,多指令多数据流)MIPS (Million Instruction Per Second,百万条指令秒)MOES I (Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)MOF (Micro Ops Fusion,微操作熔合)Mops (Million Operations Per Second,百万次操作秒)MP (Multi-Processing,多重处理器架构)MPF (Micro processor Forum,微处理器
20、论坛)MPU (Microprocessor Unit,微处理器)MPS (MultiProcessor Specification,多重处理器规范)MSRs (Model-Specific Registers,特别模块寄存器)MSV (Multiprocessor Specification Version,多处理器规范版本)MVP (Mobile Voltage Positioning,移动电压定位)IVNAOC (no-account OverClock,无效超频)NI (Non-Intel,非英特尔)NOP (no operation,非操作指令)NRE (Non-Recurring
21、Engineering charge,非重性工程费用)OBGA (Organic Ball Grid Arral,有机球状网阵排列)OCPL (Off Center Parting Line,远离中心部分线队列)OLGA (Organic Land Grid Array,有机平面网阵包装)OoO (Out of Order,乱序执行)OPC (Optical Proximity Correction,光学临近修正)OPGA (Organic Pin Grid Array,有机塑料针型栅格阵列)OPN (Ordering Part Number,分类零件号码)PAT (Performance A
22、cceleration Technology,性能加速技术)PBGA (Plastic Pin Ball Grid Array,塑胶球状网阵排列)PDIP (Plastic Dual-In-Line,塑料双重直线)PDP (Parallel Data Processing,并行数据处理)PGA (Pin-Grid Array,引脚网格阵列),耗电大PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)Post-RISC (加速 RISC,或后 RISC)PPE (Power Processor Element, Power 处理器元件)PPU (Physics
23、 Processing Unit,物理处理单元)PR (Performance Rate,性能比率)PIB (Processor In a Box,盒装处理器)PM (Pseudo-Multithreading,假多线程)PPGA (Plastic Pin Grid Array,塑胶针状网阵封装)PQFP (Plastic Quad Flat Package,塑料方块平面封装)PSN (Processor Serial numbers,处理器序列号)QFP (Quad Flat Package,方块平面封装)QSPS (Quick Start Power State,快速启动能源状态)RAS
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