PCB相关专业术语英汉对照.xls

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1、PCB相关专业术语英汉对照安装孔mounting hole跨接线jumper wire凹痕dents跨距离span凹蚀etchback拉出强度pullout strength凹蚀死角etchback拉尖solder prejection白斑measling拉离强度pull strength白度whitenness拉伸弹性模量tensile modules of elasticity板边连接器edge-board connector拉脱强度pull off strength板厚孔径比aspect ratio冷冲cold punching半加成法semi-additive process冷流col

2、d flow半润湿dewetting离子清洁度cleanliness ionic半润湿dewetting离子污染ionizable contaminant包装packing连接盘land背板backplance连接盘起翘lifted lands边距edge spacing连接盘图形land pattern边缘edges连接器区connertor area边缘腐蚀试验electrolytic corrcosion test at edge连通性continuity扁簧式接触件bellows contact连线表from-to-list扁平封装flat package裂缝split标记markin

3、g 裂缝(镀铜）cracking标志mark零省略zero suppression表面安装技术surface mount technology(SMT)领先产品leading edge product表面安装元（器件）surface-mount component(device)笼状缺陷birdcage表面电阻surface resistance露纤维fibre exposure表面电阻率surface resistivity露织物weave exposure表面腐蚀试验surface corrosion test绿油窗clearance表面间连接interfacial connection逻

4、辑图logic diagram表面空洞void in surface裸铜覆阻焊工艺(SMOBC)solder mask on bare copper表面铜导线厚度conductor thickness external麻点pit丙烯酸树脂acrylic resin盲埋孔blind(buried)via波峰焊waye soldering毛刺burrs玻璃布glass fabric毛刺（箔）foil burr玻璃化温度glass transition temperature毛圈 长feather length玻璃纤维(E)E-glass fibre铆钉rivet pin玻璃纤维突出glass fi

5、ber protrusion密（脚）距式脚格列封装品BGA剥离强度peel strength密度（光密度）density箔（剖面）轮廓foil profile模拟返工rework simulation薄层压板thin laminate母板mother borad薄铜箔thin copper foil目检visual examination不饱和聚酯unsaturated polyester内部识别标志internal identification mark不饱满焊点insufficient solder connection内层internal layer不润湿nonwetting内层分离in

6、nerlayer separation布局placement内层夹杂物inclusion innerlayer布局效率layout efficiency内层孔环annular ring internal 布设总图master drawing 内层曝光inner layer fully auomatic exposure布线routing内层铜箔裂缝crack of internal foil布线密度circuit density内审internal audit步进重复step-and-repeat耐电镀抗蚀剂plating resist材料检验materials inspection耐电弧性a

7、rc resistance参考尺寸datum dimension耐电压dielectric withstanding voltage参考基准datum reference耐化学性chemical resistance残余铜estraneous copper耐热性thermal porformance测试板test board耐热性heat resistance测试图形test pattern耐震动vibration側蚀undercut挠性覆铜板flexible copper clad laminate层间距layer-to-layer spacing挠性覆铜箔绝缘薄膜flexible copp

8、er-clad dielectric film层间连接internalyer connection挠性印制板flexible print circuit(FPC)层压（复合）laminating挠性印制板flexible printed borad 层压板laminate捻度裂缝twist of yarn层压板裂缝crack of laminate凝胶时间gel time层压板面unclad laminate surface凝渍体gel层压板缺陷laminate imperfections偶联剂coupling agent层压板完整性laminate integrity排气outgassing

9、层压膜板laminate moulding plate盘址anchoring插（贴）装mounting喷嘴spary nozzle差分驱动differentia drive坯布grey fabric差分蚀刻法differential etching坯料blank差示扫描量热法differential scanning caborimetry 偏移excursion潮湿和绝缘电阻moisture and insulation resistance偏址连接盘offset land成品板production board偏置定位polariztion成像imaging拼板multiple printe

10、d panel尺寸稳定性dimensional stability拼底版multiple-image production master尺寸要求dimensional requirements拼图multiple pattern冲切punching品质因素Q factor(Q值）抽查spot-check平纹组织plain weave出厂交收条件inspectin of product for delivery破坏hole breakout储存storage曝光exposure储存期storage life曝光灯UV-lamp处理剂含量finish level曝光机能量计uv meter处理面t

11、reated side齐平导线flush conductor处理物转移treatment transfer齐平印制板flush printed borad处理织物finished fabric起泡blister触变性thixotopic气孔blow hole穿线弯连clinched-wire through connection气相再流焊vapor phase feflow soldering(VPS)传输线transmission line铅lead串扰crosstalk桥接solder bridge垂直度rectangularity切削量chip load粗糙面matte side 清晰度

12、definition粗化面matt finish 去毛刺deburr大众化产品commodity product去铜箔面foil removal surface带载式元件taped components去钻污smear removal带载自动安装tape automated bonding(TAB)缺胶区resin-starved area带状线stripline缺口nick单板底版single-image production master缺纬mis-picks单面印制板single-side printed board绕接solderless wrap单体simple substance热

13、冲击thermal shock刀具标记tool marks热导率thermal conductivity刀片blade热风整平hot air leveling line导电箔conductive foil热风整平HASL导电图形conductive pattern热隔离heat shield导通孔via热机分板thermal-machanical analysis导线conductor热膨胀系数coefficient of thermal expansion导线（体）层conductor layer热熔fusing导线底距conductor base spacing热熔液fusing flui

14、d导线底宽conductor base width热态强度保留率hot strength retention导线厚度conductor thickness热应力方法thermal stress method导线厚度conductor thickness热应力试验thermal test导线厚度减少conductor thickness intermal copper foil人力资源部human resource department导线间距conductor spacing乳胶面emulsion side导线间距缩小conductor spacing reduction润湿剂wetting

15、agent导线精度conductor definition三级封装(各种电子整机产品)electronic equipment导线宽度conductor width三聚氰胺甲醛树脂melamine formaldehyde resin导线宽度减少conductor width reduction散热层heat sink plane导线面conductor side 扫描式电子显微镜SEM导线缺陷conductor imperfections闪镀strike导线设计间距design spacing of conductor烧焦镀层burned palting导线设计宽度design of con

16、ductor烧灼cauterization倒角chanfer设计规则检查design rule checking等离子体显示器PDP射频干扰RFI低压压制10W-Pressure moulding伸长率elongation第一 导线层conductor layerNo.1渗出bleading电磁干扰EMI生产底版production master电磁屏蔽electromagnetic shielding生物制品biological product电镀palting施工质量construction quality电解清洗electrolytic cleaning湿法贴膜wet laminatio

17、n电解铜箔electrodeposited copper foil湿强度保留率wet strength retention电路层circuit lager湿热后绝缘电阻insulation resistance anter exposure to moisture电路绝缘性insulation resistance蚀刻etching电路修复repair circuit蚀刻剂etchant电木板riser plate蚀刻系数etch factor电气性能electronic characteristics蚀刻指示图etching indicator电桥接electrical bridging食品

18、food电容耦合capacitive coupling适用期pot life电源层voltage plane术语terms电源层隔离voltage plane clearance树脂凹缩resin recession电子制造服务EMS树脂含量resin content垫内孔via-in-pad树脂流动度resin flow叠层layup树脂塞孔resin fill钉头nail heading树脂钻污resin smear定位特征tooling feature数字化digitizing定义definitions双列直插式封装dual-in-line package(DIP)镀层分离plating

19、 separation双马来酰亚胺三嗪树脂bismaleimide-triazine resin镀层附着力plating adhesion双面印制板double-side printed borad镀层裂缝crack of plating双氰胺dicyandiamide镀层突沿voerhang水平显微剖切horizontal microsection镀层完整性plater intrgrity撕裂强度tear strength镀层增宽outgrowth损耗因数dielectric dissipation factor镀层折叠plating folds探测点probe point镀覆plating

20、陶瓷印制板ceramic substrate printed borad镀覆孔plated throughhole特性阻抗characteristic inpedance镀覆孔结构检验plated-through hole structure test体积电阻volume resistance镀通孔palted through体积电阻率volume resistivity镀屑sliver贴膜roller coater断经end missing贴膜机热压辘hot roll断裂长breaking length贴装装连SMT对位registration通孔安装through-hole mountin

21、g对准标记register mark通孔孔径via diameters多层次印制板multilayer printed borad铜箔copper foil多层叠层mutilayer lay up铜箔面copper-clad surface多层线路板multilayer PCB铜纯度copper purity多层压制multilayer laminating凸瘤bump多官能环氧树脂polyfunctional epoxy resin凸起bulge多重布线印制板multi-wring printed borad图形pattern返工rework图形电镀pattern plating防静电用品a

22、nti-static electricity product图形转移imaging防霉性fungus resistance图形转移pattern tranfer防锈处理stain proofing 涂胶铜箔adhesire coated foil防粘膜release film涂胶粘剂绝缘薄膜adhesive coated dielectric film放气degassing退火铜箔annealed copper foil飞针测试机flying prode tester拖焊drag soldering非导电图形non-conductive pattern脱膜剂release agent非功能表面

23、间连接nonfunctional interfacial connection外层external layer非功能连接盘nonfunctional land外层孔环annular ring external非支撑孔unsupported hole外层铜箔裂缝crack of external foil非支撑孔孔环annular ring of unsupoportedhiole外镀层overplate非织布non-woven fabric外观检查externally inspection分辨率resolution外来夹杂物foreign inclusions分步层step drilling外

24、形线trim line分部焊接step soldering弯度camber分层delamination弯曲强度flexural strength分流阴极plating thief网版stencial分散能力throwing power网表net list酚醛树脂phenolic resin网格grid粉红环pink ring网印screen printing封装package网状残锡solder webbing敷形涂层conformal coating微带线microstrip敷形涂层微裂纹crazing of conformal coating微导通孔micro viahole 浮焊试验so

25、lder float teat微电子microelectronics辅面secondary side微裂纹crazing负凹蚀negative etchback微蚀soft-etching负像negative微蚀刻microetch负像图形nagative pattern纬向weft-wise;filling-wise负性抗蚀剂negative-acting resist纬斜bias附加连线haywire位置定位槽polarizing hot附连测试板test coupon温度指数temperature index(TI)附着力adhesion无连接盘孔landless hole复合层压板co

26、mposite laminate无卤型halogen-free复合金属箔composite metallic material无支撑粘剂膜unsupported adhesive film富胶区resin-rich area吸水高度height of capillay rise覆箔clad稀松织物woven scrim覆箔板厚度metal-clad laminate thickness锡珠solder plugs覆盖层cover layer洗孔hole cleaning覆盖检验板inspection overlay显布纹weave texture覆金属箔基材metal-clad base ma

27、terial显微剖切mircosectioning覆铜箔层压板copper-clad laminate显微剖切技术microsection technology干膜光致抗蚀剂dry film photoresist相比起痕指数comparative tracking index干扰信号interference signal相对坐标incremental刚挠印制板flex-rigid printed borad消除应力stress relief刚性单面印制板rigid single-sided printed borad斜孔splay刚性多层印制板rigid multilayer printed

28、 board芯板core刚性双面印制板rigid double-sided printed borad芯带拆焊solder wicking刚性印制板rigid printed board芯片尺度级封装品CSP高层印制线路板high layer count PCB芯片载体chip carrier高可靠性high reliable芯片直装chip-on-board(COB)高密度互连high density interconnect(HDI)芯吸wicking高频电子机器high frequency electronic machine芯吸作用wicking高压压制high-pressure mo

29、ulding信号层signal plane隔离孔clearance hole修复repair工程管理project management修复repairing工程设计engineer designing修整tuching up工程图engineering drawing 溴化环氧树脂brominated epoxy resin工业除湿加湿eliinating(or adding)damp system虚焊点cold solder connection工艺导线plating bar讯号完整性signal integrity弓曲和扭曲bow and twist压板press platen弓纬bow

30、 of weave压板间距daylight固化cure压垫材料cushion固化剂curing agent压痕dent固化时间curing time压配合接触件press-fit contact拐角corner压延铜箔rolled copper foil关键工序key process压制周期moulding cycle管位钉stack pin掩蔽法tenting光绘图photo plotting验收态as received光亮剂brightener验收态表面绝缘电阻insulation resistance as rec.光密度尺gray scale氧指数oxygen index(OI)光面s

31、hiny side液体光致抗蚀剂liquid photoresist光梯尺step scale液体光致阻焊剂liquid photorseneitive solder resist光致抗蚀剂photo resist一级封装(集成电路)IC packaging过量焊点excess solder connection医药medicine过量松香焊点resin solder connection仪器检验equipment calibration过热焊点overheated solder connection移位焊点disturbed海棉吸水辘sponze roller异物inclusion焊点sol

32、der connection银盐底片silver film焊缝solder filet引线伸出长度lead projection焊膏solder paste印制printing 焊剂flux印制板printed board焊接连接区solder connection areas印制板尺寸board dimensions焊接面solder side印制板厚度printed board thickness焊料solder印制板计算机辅助设计printed board computer-aided design焊料润湿wetting印制板总厚度total board thickness焊料塞sold

33、er plugs印制板组装件printed board assembly焊料整平solder leveling印制板组装图printed board assembly drawing焊盘pad印制插头edge board contact焊盘起翘lifted lands印制电路printed circuit焊渣dross印制脚（贴装焊盘）foot print黑化black oxidation印制接触片printed contact横向cross wise direction印制线路printed wiring红化red oxidation印制线路布设printed wiring layour红外

34、再流焊infrared reflow soldering(IRS)印制元件printed component后固化post cure永久性保护层permanent resist厚薄段mark用途application互串杂讯crosstalk noise优质焊点preferred solder connection互连缺陷interconnecting defect有机污染organic contamination化学蚀刻chemical-etching有焰燃烧flaming combustion划痕scratch余隙孔access hole环境试验environment testing鱼眼f

35、ish eye环形断裂circumferential separation预浸材料prepreg环氧树脂epoxy resin预浸材料固化厚度prepreg cured thickness环氧值epoxy value预制内层覆箔板mass lamination panel黄菲林diazo film元件插脚component pin挥发物含量volatile content元件孔component hole汇流条bus bar元件露出端lead extension混合安装技术mixed component mounting technlogy元件密度component density活化acti

36、vating元件面component side火山灰磨辘pumic brush元件引线component lead机械缠绕mechanical wrap原理图schematic diagram机械冲击mechanical shock原始光洁面plate finish 机械加工性machinability云织waviness基材base material运输shipment基材厚度base material thickness晕圈haloing基础知识培训elementray knowledge杂讯noise基膜面base film surface载流量current-carrying capa

37、city基准边reference edge载体箔carrier foil基准尺寸basic dimension 再流焊reflow soldering激光钻孔机laser drilling在线测试in-line test挤压引线swaged lead在制板panel计算机辅助设计技术CAD脏污stain计算机辅助制造技术CAM增强材料reinforcing material技术服务technical services摘要abstract加成法additive process粘合力增强处理adhesion promotion加成法用层压板laminate for additive process

38、粘合强度bond strength加工规范manufacturing specification粘接片bonding sheet加工图manufacturing drawing粘接增强处理(目检)bond enhancement treament(visual)加工质量workmanship粘结层bonding layer加工中测蚀undercut in process粘结剂binder夹杂物inclusion粘结增强处理bond enhancing treatment减成法subtractive peocess粘性时间tack time剪切板cut-tosize panel照相底版artwo

39、rk剪切强度shear strength照相底片photographic film检验分类categories for inspection照相底图artwork master检验条件inspection conditions照相缩小尺寸photographic reduction dimesion检验职责responsibility for inspection照相原版original production master键key遮光剂opaquer键槽keying solt折痕crease胶化颗粒gelation particle折弯引线clinched lead胶粘剂adhesive针孔p

40、inhole胶粘剂adhesive针孔pin hole胶粘剂面adhesive face真空吸锡法pulse vacum tin removal角标corner mark整板电镀panel plating阶树脂(A阶)A-stage resin整平剂leveling agent接触电阻contact resistance正向right reading接触脚contact angle正像positive接触面积contact area正像图形positive pattern接触压力kiss pressure正性抗蚀剂positive-actiong resist接地ground支撑孔suppor

41、ted hole接地层ground plane支撑面supporting plane接地层隔离ground plane clearance织物经纬密度thread count节距pitch织物组织weave structure结构完整性structure tolerance直角板边连接器right-angle edge connector结瘤nodules制作工艺manufacturing technology结瘤nodule质量保证条款quality assurance provisions介电常数dielectric constant质量一致性检验电路quality conformance

42、 test circuit介电击穿dielecric breakdown中心距center to center spacing介电强度dielectric strength重氮底片diazo film介质层厚度dielectric thickness重合度registration介质耐电压dielectric withstanding voltage轴向引线axial lead金属箔裂缝crack of foil皱褶wrinkle金属化metallization主面primary side金属芯matal core注尺寸孔dimensioned hole金属芯覆铜箔层压板metal core

43、copper-clad laminate装联构件packaging and interconnecting structure金属芯印制板 metal core printed board装联件packaging and interconnecting assembly进给速率feed rate锥口孔flare进给转速比feed rotation rate灼热燃烧glowing combu浸焊dip soldering啄层 peck drilling浸亮bright dip字符legend浸润剂size自熄性self-extinguishing浸润剂残留量size residue综合测试图形c

44、omposite test pattern浸润剂含量size content棕化brown oxidation浸渍impregnating 纵向length wise direction;machine direction浸渍绝缘纸impregnating insulation paper阻焊soldermask经向warp-wise阻焊干膜dry film solder mask晶须whiskers阻焊剂solder resist(solder mask)精密仪器precise instrument阻焊剂solder resist净化工程purification project阻焊印料sol

45、der mask ink径向电间距internal spacing阻抗测试impedance testing镜像拼版flip flop阻燃剂flame retardant聚芳酰胺纤维纸aromatic polyamide paper阻燃性elammability retardant聚合物polyer组装密度packaging density聚四氟乙烯polytetrafluoetylene(PTFE)钻孔drilling聚酰亚胺树脂polyimide resin钻孔文件NC-drill聚酯树脂polyester resin最先进产品state of the art product聚酯纤维非织布

46、non-woven polyester fabric最小电气间距minimum electrical spacing绝对坐标absolute最小环宽minimun annular ring绝缘电阻insulation resistance最终涂覆覆盖final finish coverage绝缘性isolation预防性的preventive开槽接触件bifurcated contace抑制行动containment action开窗口cross-hatching不良现象failure phenomenon抗拉强度tensile strength不良比率failure rate抗蚀镀层plat

47、er resist良品normal good可焊性solderability存货inventory可靠度reliability抱怨complaint可燃性flammability空调系统air conditioner system空洞void空气净化purifying air孔壁hole barrel孔壁空洞hole void孔长较短的导孔short via lengths孔底连接盘targer land孔环（外层）annular ring(outlayer)孔径和孔图精度hole pattern accuracy and size孔口连接盘capture land孔密度hole density孔图hole pattern孔图精度tolerance of hole diameter孔位hole location