PCB中英术语对照表.pdf

《PCB中英术语对照表.pdf》由会员分享，可在线阅读，更多相关《PCB中英术语对照表.pdf（13页珍藏版）》请在淘文阁 - 分享文档赚钱的网站上搜索。

1、上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 印制电路术语总汇(中英文)行业术语 一、综合词汇 1、印制电路：printed circuit 2、印制线路：printed wiring 3、印制板：printed board 4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component 7、印制接点：printed cont

2、act 8、印制板装配：printed board assembly 9、板：board 10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid singl

3、e-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible pr

4、inted circuit(fpc)24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board,rigid-flex printed board 26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board 28、齐平印制板：flush printed bo

5、ard 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-lamin

6、ated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board 40、积层多层印制板：build-up mulitlayer printed board(bum)上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 41、积层挠印制板：build-up flexible printed board 42、表面

7、层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper

8、-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：inter

9、connection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conduct

10、ive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark 二、基材：1、基材：base material 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 2、层压板：laminate 3、覆金属箔基材：metal-clad bade material 4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided co

11、pper-clad laminate 6、双面覆铜箔层压板：double-sided copper-clad laminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate 11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film 12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bond

12、ing sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated u

13、ncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base f

14、ilm surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/pape

15、r ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040

16、QQ：764340707/869227002 Http:/ E-mail: 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber f

17、abric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates 三、基材的材料 1、a 阶树脂：a-stage resin 2、b 阶树脂：b-stage resin 3、c 阶树脂：c-stage resin 4、环氧树脂：epoxy res

18、in 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silico

19、ne resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value 28、双氰胺

20、：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film(pi)38

21、、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、e 玻璃纤维：e-glass fibre 43、d 玻璃纤维：d-glass fibre 44、s 玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝

22、：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise,filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease

23、66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-5

24、1413040 QQ：764340707/869227002 Http:/ E-mail: 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive f

25、oil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil 92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metalli

26、c material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil 四、设计 1、原理图：shematic diagram 2、逻辑图：logic diagram 3、印制线路布设：printed wire layout 4、布设总图：master drawing 5、可制造性设计：design-for-m

27、anufacturability 6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design auto

28、maton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display.(ccd)16、布局：placement 17、布线：routing 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 18、布图设计：layout 19、重布：rerouti

29、ng 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization(design)31、供设计优化坐

30、标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、

31、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rule checking 53、走（布）线器：router(cad)54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit an

32、alysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 62、方块框图：block diagram 63、迷宫：moze

33、 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、

34、分层：separated layer 78、定顺序：definite sequence 五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width 3、导线距离：conductor spacing 4、导线层：conductor layer 5、导线宽度/间距：conductor line/space 6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad

35、 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、v 形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：com

36、ponent hole 26、安装孔：mounting hole 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole(pth)31、余隙孔：access hole 32、盲孔：blind via(hole)33、埋孔：buried via hole 34、埋/盲孔：buried/bl

37、ind via 35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45

38、、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance 54、基准尺寸：reference dimension 55、参考尺寸：reaerence dimension 56、直接量定尺寸：direct dimensioning 57、基准图：datum feature 58、

39、基准边：reference edge 59、导线设计距离：design space of conductor 60、导线设计宽度：design width of conductor 61、中心距：center to center spacing 62、线宽/间距：conductor width/space 63、节距：pitch 64、精细节距：fine pitch 65、层：layer 66、层间距：layer-to-layer spacing 67、边距：edge spacing 68、外形线：trim line 69、截面积：crossection area 70、真实值表测量：trut

40、h table test 71、准确位置：true position tolerance 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 72、精确位置：accuracy 73、精确位置误差：cumulative tolerance 74、精确度：accuracy 75、累积误差：cumulative tolerance 76、焊垫：footprint 77、外层：external layer 78、内层：internal layer 79、接地

41、层：ground plane 80、接地层隔离：ground plane clearance 81、电压层：voltage plane 82、电源层隔离：voltage plane clearance 83、电源层：power plane,bus plane 84、导通网络：basic grid 85、导通网格：track grid 86、导通孔网格：via grid 87、连通盘网格：pad(land)grid 88、定位偏差：positional tolerance 89、对准靶标：bornb sight 90、梳状图形：comb pattern 91、对准标记：register mark

42、 92、散热层：heat sink plane 六、电气互连 1、表面间连接：interlayer connection 2、层间连接：interlayer connection 3、内层连接：innerlayer connection 4、非功能表面连接：nonfunctional interfacial connection 5、跨接线：jumper wire 6、节（交）点：node 7、附加线：haywire 8、端接（点）：terminal 9、连接线：terminated line 10、端接：termination 11、连接端：pad,land 12、贯穿连接：through

43、connection 13、支线：stub 14、印制插头：tab 15、键槽：keying slot 16、连接器：connector 17、板边连接器：edge board connector 18、连接器区：connector area 19、直角板边连接器：right angle edge connector 20、偏槽口：polarizing slot 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 21、偏置端接区：offset te

44、rminal area 22、接地：ground 23、端接隔离（空环）：terminal clearance 24、连通性：continuity 25、连接器接触：connector contact 26、接触面积：contact area 27、接触间距：contact spacing 28、接触电阻：contact resistance 29、接触尺寸：contact size 30、元件引腿（脚）：component lead 31、元件插针：component pin 32、最小电气间距：minimum electrical spacing 33、导电性：conductivity 3

45、4、边卡连接器：card-edge connector 35、插卡连接器：card-insertion connector 36、载流量：current-carrying capacity 37、蹯径：path 38、最短路径：shortest path 39、关键路径：critical path 40、倒角：miter 41、串推：daisy chain 42、斯坦纳树：steiner tree 43、最小生成树：minimum spanning tree(MST)44、瓶颈宽度：necked width 45、短叉长度：spur length 46、短柱长度：stub length 47、

46、曼哈顿路径：manhattan path 48、连接度（性）：connectivity 七、其它 1、主面：primary side 2、辅面：secondary side 3、支撑面：supporting plane 4、信号：signal 5、信号导线：signal conductor 6、信号地线：signal ground 7、信号速率：signal rate 8、信号标准化：signal standardization 9、信号层：signal layer 10、寄生信号：spurious signal 11、串扰：crosstalk 12、电容：capacitance 13、电容耦

47、合：capacitive coupling 上美电科技 SunmadiaTechnologies Tel:010-84829432 Fax：010-51413040 QQ：764340707/869227002 Http:/ E-mail: 14、电磁干扰：electromagnetic interference 15、电磁屏蔽：electromangetic shielding 16、噪音：noise 17、电磁兼容性：electromagnetic compatbility 18、特性阻抗：impedance 19、阻抗匹配：impedance match 20、电感：inductance

48、 21、延迟：delay 22、微带线：microstrip 23、带状线：stripline 24、探测点：probe point 25、开窗口：cross hatching 26、跨距：span 27、共面性（度）：coplanarity 28、埋入电阻：buried resistance 29、黄金板：golden board 30、芯板：core board 31、薄基芯：thin core 32、非均衡传输线：unbalanced transmission line 33、阀值：threshold 34、极限值：threshold limit value(TLV)35、散热层：hea

49、t sink plane 36、热隔离：heat sink plane 37、导通孔堵塞：via filiing 38、波动：surge 39、卡板：card 40、卡板盒/卡板柜：card cages/card racks 41、薄型多层板：thin type multilayer board 42、埋/盲孔多层板：43、模块：module 44、单芯片模块：single chip module(SCM)45、多芯片模块：multichip module(MCM)46、多芯片模块层压基板：laminate substrate version of multichip module(MCM-L

50、)47、多芯片模块陶瓷基数板：ceramic substrate version o fmultichip module(MCM-C)48、多芯片模块薄膜基板：deposition thin film substrate version of multilayer module(MCM-D)49、嵌入凸块互连技术：buried bump interconnection technology(B2 it)50、自动测试技术：automatic test equipment(ATE)51、芯板导通孔堵塞：core board viafilling 52、对准标记：alignment mark 53