工程部专用术语-英文.xls

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1、工程術語專用表訂 單 內 容Part No.零件編號General information普遍信息Questions問題Contact聯絡Technical技術性的TEL:電話Order information訂單信息Revision level修訂版本Vendor賣方,供方Type of order訂單類型Vendor status賣方情況Quantity數量Price each單價Present介紹、表示File name文件名/檔案名出 貨 要 求Delivery information交貨資料Attach with delivery出貨附加E-test report電測報告Micros

2、eetion report微切片報告Final inspection report出貨檢驗報告Other requirement 其它要求Impedance test report阻抗測試報告Cross-section切片Solder sample焊錫樣板Inoic testing離子污染度測試板 材Layer count層數Laminate type板材類型Base copper foil基材銅厚Lay up setup壓合疊構設計Dielectrics specified介質層規格Combination粘結物(PP)Core板芯Polt tetra fluoro ethylene(PTFE

3、)鐵氟龍Glass transition temperature(Tg)玻璃態轉換溫度Tg ratingTg點等級Copper clad epoxy glass laminate玻璃樹脂覆銅板Lay up疊合Gel time凝膠時間Stagger dots(板邊)阻流塊Tg:(glass transition temperature玻璃轉化溫度點Td:(Timperature decomposition)板材固化溫度點Material(FR-4,CEM-1,CEM-3,FR-1)板材 Halogen free materials無鹵素板材Dielectric layer介質層Insulator

4、介質層、絕緣層Length wise dimension徑向板材Cross wise dimension緯向Thin core薄基板Toflon鐵氟龍Prepreg膠片,樹脂片Copper foil銅箔/銅皮Laminate基板,積層板鑽 孔 電 鍍Plating電鍍Countersinks錐形孔Plated throngh hole copper thickness孔壁銅厚Sencondary drill二次鑽孔Drill chart鑽孔表/分孔圖Fabrication drawing制造圖Hole count孔數Smallest hole size最小孔徑Drill file鑽孔文件/鑽孔

5、檔Hole locations孔位置Counter boad沉頭孔Counter sink錐形孔Hole孔Drilling鑽孔Component hole零件孔Slot/Slotting槽口,開槽Indexing hole基率孔/參考孔內、外 層 制 作Outer layer外層Inner layer內層Top-only頂層C/(Companeit side)Bottom-only底層S/(Solder side)Netlist testing required網絡測試要求Inpedance control阻抗控制OHM(電阻單位)Minimum line width最小線寬Minimum s

6、pacing最小間距Top circuit頂層線路Conductor width導線寬度Differential resistart差動(阻抗)Surround by land環繞接地Signal信號Plane平面、大地Min trace最小線寬Surface表面Thieving電鍍干擾塊Singel end單端Etch蝕銅Copper border板邊設計Tent蓋孔Fiducial uark光學點內、外 層 制 作Time-domain refelectometry(TDR)時域反射器(測阻抗用)Signal line訊號線Referance plane參考層Ground plane接地層

7、Tab接點,金手指Non-Circular land非圓形孔環焊墊Lead pitch腳距Lag out布線,布局Fine line細線Transmission line傳輸線Pitch跨距,腳距,墊(線)距Fine pitch密(腳,線,墊)距Film底片防 焊 文 字Soldermask阻焊Plugged(filled)soldermask in via hole導通孔塞孔Via hole treatment導通孔處理Legend文字Double side雙面Color顏色Green綠色Red紅色Blue藍色Black黑色White白色Matte霧面Light亮面Gloss半光面Dry f

8、ilm gloss干膜綠漆On sold side在焊接面On comp side在零件面Plug via holes導通孔塞孔Solder mask sides防焊層Solder mask color防焊顏色Solder mask type防焊類型WKYR(WWYY)週週年年WKYR(YYWW)年年週週W(Week)周Silkscreen絲網印刷(文字)Vendor logo and ul賣方(制造商)logo和UL標識Photimageable液態感光油Solder resist焊錫保護層(阻焊)Y(Year)年Month月Date code周期Date 日期Tape test撕膠帶試驗表

9、 面 處 理Surface finish成品表面處理Hasl熱風整平/(噴錫)Flash gold水金/(全面金)Immersion gold 沉金/(化金)OSP抗氧化Immersion tin 沉錫/(化錫)Immersion silver沉銀/(化銀)Hasl gold finger(噴錫)/熱風整平+鍍金手指Smobc with hasl噴錫板Carbon碳油Peelable mask可剝膠Top pasteC面錫膏Solder paste錫膏Hot air solder levelled噴錫Lead free無鉛噴錫Silver paste銀膏成 型 外 觀Overall board

10、 thickness總的板厚度Measure after plating and solder mask 電鍍、阻焊後測量Finish thickness 成品板厚Bevel angle 斜邊角度Gold finger bevel金手指斜邊Bevel depth斜邊深度Board or unit size 大板或單PCS尺寸Array size(排版)連片尺寸Scoring angle 切割角度Finished Web Thickness殘厚Finish Type成品類型Outline外形Break Away折斷邊Tolerance公差Board Size板的尺寸Dimensional Tol

11、erance尺寸公差Rectangle矩形Fabricable PCB成型的PCBProbe探針Optical Inspection光學檢驗Visual Inspection目視檢查Flatness平坦度Insulation絕緣電阻Hipot test高壓電測Yield良品率,產率Short短路Punch沖切Omega meter離子污染檢測儀Contact resistance接觸電阻其它項Measure測量其 它 項Format(周期)格式As Original Geber File同原始GEBER文件一樣表 面 處 理None無Mark標記、標識Date Code日期Detail詳解,放

12、大圖Test Stamp測試印章(ET章)See Spec Note看規范要求Acceptance Specification接收標准The drawing takes precedent圖紙依前例Reference提及、關於Connection聯結Between兩者之間Data數據Where哪裡May可以Use使用Any一些With In在以內Or或者Modify修改Meet達到Requirements要求Prior預先,提前Notify注意事項Approval批准Fabrication制造、裝配General specification一般規格Not more than不超過Rating等

13、級Flammability易燃能力Metal金屬L.P.IBoard dimension板子長、寬、高(體積)List on列在上Accordance按照Located within設計在以內Monday星期一Tuesday星期二Wednesday星期三Thursday星期四Friday星期五Saturday星期六Sunday星期日BOW板彎TWIST板翹其它項Reflow熔焊Dirty Foreign Materials異物、雜質Data數據其 它 項Assembled In Usa美國裝配Mulitilayer多層板Solder Floating漂錫試驗VCC(Voctage)電壓Phototool底片Packaging封裝Mather board主機板Deviation偏差Template模板Silk screen絲網印刷Nickel gold immersion化鎳金其它項