PCB制作过程图解.ppt

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1、How is a PCB made?What determines impedance?Version IIa2Manufacturing PManufacturing Processes for a Multi-layer PCBSection through PCBVia holeSMD PadThe following presentationcovers the main processesduring the production ofa multi-layer PCB.The diagrams which followrepresent a section througha 6 l

2、ayer PCB,as indicatedin red.Tracks under solder mask3Manufacturing PTypical Layer Construction -6 Layer PCBLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERCopperLaminateLayer build/stackup is one of the most im

3、portant aspects of controlled impedanceMany combinations of material thickness and copper weights can be used.PCB Fabricators manufacturing techniques varyImpedance Considerations4Manufacturing PInner Layer Processing Material SelectionLayer 2(Inner)Layer 3(Inner)CoreCopperLaminate(Dielectric)Select

4、ing inner layer Core materials is very important when using embedded microstrip and offset stripline structuresInner layer Core materialsare usually processed as“Layer pairs”Impedance Considerations5Manufacturing PLayer 2(Inner)Layer 3(Inner)CoreDoes not effect impedanceImpedance ConsiderationsLamin

5、ating and Imaging of Internal LayersUV sensitive film is laminated over top and bottomsurfaces of the CoreAreas of the Core where no copper is required are left exposed6Manufacturing PCoreThe etch process produces an etch back or undercut of the tracks.This can be specified by the W1/W2 parametersTh

6、is means that tracks will end up approximately0.025 mm(0.001”)thinner than the original design.Impedance ConsiderationsEtch Process -Remove Exposed CopperCopper RemovedLayer 2(Inner)Layer 3(Inner)7Manufacturing PCoreDoes not effect impedanceImpedance ConsiderationsRemove Laminating FilmLayer 2(Inner

7、)Layer 3(Inner)8Manufacturing PCoreDoes not effect impedanceImpedance ConsiderationsCompleted Inner Layer CoreLayer 2(Inner)Layer 3(Inner)All inner layer Core materials are processed as“Layer Pairs”prior to BondingAt this stage the Cores are inspected visually(AOI)and defective Cores rejectedSometim

8、es a surface treatment is applied to the Cores to aid with the Bonding process9Manufacturing PImpedance ConsiderationsLayer stackupLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Lay

9、er 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height w

10、hen calculating Impedance10Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-

11、PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup11Manufacturing PImpedance

12、ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the

13、 Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup12Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(In

14、ner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have

15、 a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup13Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFO

16、ILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatl

17、y affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup14Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLaye

18、r 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finis

19、hed Post-Processed height when calculating ImpedanceLayer stackup15Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)

20、Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating Impedance

21、Layer stackup16Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREG

22、PRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup17Manufacturing PImpedance Consideratio

23、nsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding pro

24、cess,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup18Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(

25、Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great inf

26、luence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup19Manufacturing PImpedance ConsiderationsLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPR

27、E-PREGPRE-PREGINNER LAYERINNER LAYERLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects im

28、pedance.It is important to use the Finished Post-Processed height when calculating ImpedanceLayer stackup20Manufacturing PImpedance ConsiderationsBonding HeatLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERLaye

29、r 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finis

30、hed Post-Processed height when calculating Impedance21Manufacturing PImpedance ConsiderationsBonding Multilayer PressLayer 1(Outer)Layer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer 5(Inner)FOILFOILPRE-PREGPRE-PREGPRE-PREGINNER LAYERINNER LAYERDuring the Bonding process,press temperature

31、and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating Impedance22Manufacturing PImpedance ConsiderationsBonding Multilayer PressLayer 6(Outer)Layer 2(Inner)Layer 3(Inner)Layer 4(Inner)Layer

32、5(Inner)During the Bonding process,press temperature and pressure have a great influence on substrate heights,which greatly affects impedance.It is important to use the Finished Post-Processed height when calculating Impedance23Manufacturing PBonding Multilayer PressPhoto Robert Brkle GmbHwww.buerkl

33、e-gmbh.de24Manufacturing PDrilling of Bonded PanelLayer 1Layer 6Layer 2Layer 3Layer 4Layer 5CopperLaminateDrilled HoleImpedance ConsiderationsDrilling itself does not effect impedance25Manufacturing PElectroless Copper ProcessAddition of Copper to all Exposed SurfacesLayer 1Layer 6Layer 2Layer 3Laye

34、r 4Layer 5CopperDrilled HoleElectroless copper effects copper thickness on outer layers(T1)Sometimes other solutions are used containing carbon,etc.Impedance Considerations26Manufacturing PLayer 1Layer 6Layer 2Layer 3Layer 4Layer 5Laminating and Imaging of External LayersUV sensitive film is laminat

35、ed over top and bottomsurfaces of PCBIt is then exposed and developed,leaving an exposed image of the PCB patternCopperDoes not effect impedanceImpedance Considerations27Manufacturing PLayer 1Layer 6Layer 2Layer 3Layer 4Layer 5Electro-plating Process 1Additional Copper to all Exposed SurfacesLaminat

36、ed FilmPlate Additional CopperElectro-plating increases the copper thickness on outer layers(T1)There will always be variations in the amount of copper added.This finished copper thickness should be used in structure calculationsImpedance Considerations28Manufacturing PLayer 1Layer 6Layer 2Layer 3La

37、yer 4Layer 5Electro-plating Process 2Add Tin over Exposed Copper AreasLaminated FilmAdditional CopperTin PlatingImpedance ConsiderationsDoes not effect impedance29Manufacturing PLayer 1Layer 6Layer 2Layer 3Layer 4Layer 5Electro-plating Process 3Remove Laminated FilmLaminated Film RemovedTin PlatingI

38、mpedance ConsiderationsDoes not effect impedance30Manufacturing PEtch Process -Remove Exposed CopperCopper RemovedTin PlatingThe etch process produces an etch back or undercut of the tracks.This can be specified by the W1/W2 parametersThis means that tracks will end up approximately0.025 mm(0.001”)t

39、hinner than the original design.Impedance ConsiderationsLayer 1Layer 6Layer 2Layer 3Layer 4Layer 531Manufacturing PLayer 1Layer 6Layer 2Layer 3Layer 4Layer 5Tin Strip -Remove Tin PlatingTin Plating RemovedThe removal of tin will slightly reduce the copper thickness(T1)on the outer layersImpedance Co

40、nsiderations32Manufacturing PPCB is now complete except forsurface finishes and panel routingLayer 6Layer 1Via HoleSMD PadTracksTracks33Manufacturing PSolder Mask Application-Curtain Coated MethodLayer 6Layer 1Apply Liquid Photo-Imageable Resist,then drySome PCB fabricators chose to check the impeda

41、nce before the solder mask is addedStructures can be checked in Normal and Coated modeThickness of solder mask should be specified using C1 and C2Impedance Considerations34Manufacturing PSolder Mask ApplicationImage,Develop and CureLayer 6Layer 1UV Image,Develop and CureImpedance ConsiderationsDoes

42、not effect impedance35Manufacturing PSurface Finish ProcessLayer 6Layer 1Apply Solder to Exposed Copper AreasSurface Finish(Tin/Lead/Gold/Silver)is usually only added to padsIf board has no solder mask the thickness of finish should be added to T1.Impedance Considerations36Manufacturing PComponent N

43、otationSCL2 9624Impedance ConsiderationsDoes not effect impedance37Manufacturing PRouting(includes second stage drilling)Impedance ConsiderationsControlled Impedance coupons are routed from the panelGood controls are necessary to ensure that coupons can be matched to manufacturing panels38Manufactur

44、ing PProcess finished PCB and coupons fortestingImpedance ConsiderationsIt is good practice to place TDR coupons in the“X”and“Y”axis of the manufacturing panel to ascertain any process variations due to spray patterns when using horizontal conveyorised equipment.Coupons39Manufacturing PProcess finis

45、hed PCB and coupon fortestingImpedance ConsiderationsControlled Impedance coupons are routed from the panelControls are necessary to ensure that coupons can be matched to manufacturing panels this should be performed on trial panels prior to production ramp up.40Manufacturing PWhy as a designer do y

46、ou need to discuss your design with your PCB fabricator?Impedance ConsiderationsPCB manufacture is a process,it uses materials which are not“ideal”FR4 for example is a glass resin mix madeof two substances with differing electrical properties.PCB Manufacturers need to make small adjustments to desig

47、ns to maximise yieldsGlass Er 6Resin Er 3(FR4)Resin Er 3(High performance laminates)41Manufacturing PWhy as a designer do you need to discuss your design with your PCB fabricator?Impedance ConsiderationsProcess varies from one fabricator toanother.Press pressures temperatures may varyPrepreg and cor

48、e may vary from onesupplier to another.Supplier variations42Manufacturing PPolar tools to assist in layer stackup:SB200a PCB Stackup design system43Manufacturing PPolar tools to assist in impedance prediction:Si8000m Controlled impedance design systemFor more information please visit:2006 Polar InstrumentsYour contacts at Polar:USA Software sales:Ken Taylor(503)356 5270USA Equipment sales:Richard Smith(650)344 1416 UK/Europe:Neil Chamberlain+44 23 9226 9113Asia/Pacific:Amit Bhardwaj+65 6873 7470