蓝牙模块BTHM501 规格书.pdf

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1、?10?HM?!?#?$?%?&?#?(?#)?*?&+?,?!?%+?-?-+%?.?-+%?&?&?%?/0-?1?$?*?*?02?$3#?4*?,05?,?!?+?6?!7?.!/?18?1?9?$,?0?#?9?1?9?*?9?4#?5?+?%?:?-?8%?/?-?%?1?%?&?0?9?-?1$65*?6?$5?1?1?4?-?3?%?*?$?+?7?!?*?0?;?%?#?%?&+?5?%?,?&?,?5?$.!?%?%?&%!?/?-?%?&?&?!?%?,?*$#?%?!?+?%?&+?%?%?&?!?#?%+?!?4+?%?=?9?0?$?%?=?%?%?=?9?0?3?

2、=?%?%?=?%0?*?A?%?0?-?4?&?%?-?%?%?$+?%?15?%?%?4?9?$?&?9?%?HM?Has been BQB! Page2 of 10Contents1Key Features.3 2Package Information.3 2.1 Pinout Diagram.32.2 Device Terminal Functions.4 2.3 Block diagram.6 3 Electrical Characteristics.63.1Absolute Maximum Ratings.6 3.2 Recommended Operating Conditions

3、.63.3 Microphone input.73.4 Speaker output.74Application Schematic.85PCB Layout.95.1PCB Details.96SMT Reflow Profile.9 6.1 Reliability solder temperature chart.9 6.2 Reflow temperature chart.97 PCB Board Land Dimensions.108 Document H Page3 of Page4 of 10Device Terminal Functions27GNDGNDG Page5 of 1

4、0?Page6 of 102.3 Block diagram 1.Electrical Characteristics 3.1Absolute Maximum Ratings 3.2Recommended Operating Conditions ParameterSymbol Condition Rating Power Supply VoltageVDD_BAT,VRE_IN-0.4V?+4.9V Power Supply VoltageVDD_CHG-0.4V?+6.5V Power Supply Voltage+1V8 -0.4V?+1.85V Power Supply Voltage

5、 VDD,VDD_USB-0.4V?+3.6V Storage Temperature Tstg-40?+105?ParameterSymbol Min Type Max Power Supply VoltageVDD_BAT,VRE_IN 3.3V 3.6V 4.9VPower Supply VoltageVDD_CHG 4.9V 5V 6.5V I/O Voltage VDD,VDD_USB3.15V 3.3V 3.6VPower Supply Voltage+1V81.65V 1.8V 1.85 V?10?.!.?+?+?.!:?$+?+?+?1+?+?;?!?#?$%&?$%&?(?)

6、?*?!?(?)?$%&?+?,?)?-%#./?)?0!?1?$?#?2?3?-4?3?5?6?2?(?7+?$?$?6?2?(?7?8?9?2?*?)?8?(?1?:?2?;?-%#?,?)?+?-%#?)?+?7? Page8 of 102.Application Schematic ?Page9 of 103.PCB Layout 5.1 PCB Details 6.SMT Reflow Profile 6.1 Reliability solder temperature chart:6.2 Reflow temperature chart:PCB NO Revision Board Thickness Board Material Date-?-HM?V1.0 0.8mm FR4October 200 ?Page10 of 10?B!5*?&?%?%?7.Document History RevisionDateHistory?07Original publication of this document1.10mm1.2mm0.8mm13.3mm20.2mm