TDA7391PD PDF规格书.pdf

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1、July 2008 Rev 21/1111TDA7391PD32 W bridge car radio amplifierFeaturesHigh power capability:40 W/3.2 EIAJ32 W/3.2 VS=14.4 V,f=1 kHz,d=10%26 W/4 VS=14.4 V,f=1 kHz,d=10%Differential inputs(either single ended or differential input signal are accepted)Minimum external component count:No bootstrap capaci

2、torsNo Boucherot cellsInternally fixed gain(30 dB)No SVR capacitorStand-by function(CMOS compatible)Programmable turn-on/off delayNo audible pop during mute and stand-by operationsProtectionsShort circuit(to GND,to VS,across the load)Very inductive loadsChip over temperatureLoad dumpOpen GNDESDDescr

3、iptionThe TDA7391PD is a bridge class AB audio power amplifier specially intended for car radio high power applications.The high power capability together with the possibility to operate either in differential input mode or single ended input mode makes it suitable for boosters and high end car radi

4、o equipment.The exclusive fully complementary output stage and the internal fixed gain configuration drop the external component count.The on board clipping detector allows easy implementation of gain compression systems.PowerSO-20Table 1.Device summaryOrder codePackagePackingTDA7391PDPowerSO-20Tube

5、TDA7391PD13TRPowerSO-20Tape and ContentsTDA7391PD2/11 Contents1Test and application circuit,block diagram .32Pins description .43Electrical specifications.53.1Absolute maximum ratings.53.2Thermal data .53.3Electrical characteristics.53.4Electrical characteristics curves.64Package information.95Revis

6、ion history .10TDA7391PDTest and application circuit,block diagram 3/111 Test and application circuit,block diagramFigure 1.Test and application circuitFigure 2.Block diagram14159IN-C2 0.22FC1 0.22FIN+4ST-BY81,10,11,20OUT+OUT-21917VrefCDTDA7391PDD98AU871R14.7KC4 1000FGNDR256KC333FC5 100nF516TO C+VSV

7、SSW112+-516VCC1VCC2REFERENCESSTANDBY THRESHOLDSHORT CIRCUITDUMP&THERMALPROTECTIONICM1415COMMONMODE-+VCC/2-+gm+-MUTE THRESHOLDPROGRAMMABLECURRENT CIRCUITLTSV=f(Tj)POWER AMPPOWER AMPTHDDETECTLTSDISABLE89419172IN-IN+OUT-CDOUT+12MUTESYNCS-GNDSTANDBYD98AU872VSP-GND1,10,11,20Pins descriptionTDA7391PD4/11

8、2 Pins descriptionFigure 3.Pins connection(top view)Table 2.Pins functionPinFunctionDescription14,15INPUTSThe input stage is a high impedance type also capable of operation in single ended mode with one input capacitively coupled to the signal GND.The impedance seen by the inverting and non invertin

9、g input pins must be matched.5,16+VSSupply voltage.17CDThe TDA7391PD is equipped with a diagnostic circuitry able to detect the clipping in the Output Signal(distortion=10%).The CD pin(open collector)gives out low level signal during clipping.2,19OUTPUTSThe output stage is a bridge type able to driv

10、e loads as low as 3.2.It consists of two class AB fully complementary PNP/NPN stages fully protected.A rail to rail output voltage swing is achieved without need of bootstrap capacitors.No external compensation is necessary.1,10,11,20GNDPower Ground.12S-GNDSignal ground.4STAND-BYThe device features

11、a ST-BY function which shuts down all the internal bias supplies when the ST-BY pin is low.In ST-BY mode the amplifier sinks a small current(in the range of few A).When the ST-BY pin is high the IC becomes fully operational.8SYNCA resistor(R2)has to be connect between pin 8 and GND in order to progr

12、am the currentthat flows in the C3 capacitor(pin 9).The values of C3 and R2 determine the time required to bias the amplifier.9MUTEThe pin will have a capacitor(C3)tied to GND to set the MUTE/STAND-BY time.An automatic Mute during turn on/off is provided to prevent noisy transients.P-GNDOUT+N.C.ST-B

13、YVCCN.C.N.C.SYNCMUTES-GNDN.C.IN-VCCIN+CDN.C.OUT-P-GND1324567891817161514121311191020P-GNDP-GNDD98AU873TDA7391PDElectrical specifications 5/113 Electrical specifications3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Electrical characteristics Table 3.Absolute maximum ratingsSymbolParameterValueUni

14、tVSDC supply voltage28VVOPOperating supply voltage18VVPEAKPeak supply voltage(t=50 ms)50VIOOutput peak current repetitive(f 10 Hz)4.5AOutput peak current non repetitive6APtotPower dissipation(Tcase=85 C)32WTstg,TjStorage and junction temperature-40 to 150CTable 4.Thermal dataSymbolParameterValueUnit

15、Rth j-caseThermal resistance junction to caseMax.2C/WTable 5.Electrical characteristics(VS=14.4 V;RL=4,f=1 kHz,Tamb=25 C,unless otherwise specified)SymbolParameterTest conditionMin.Typ.Max.UnitVSSupply voltage range818VIqTotal quiescent current60150mAVOSOutput offset voltage120mVISBSt-by currentVST-

16、BY=1.5 V100AISBinSt-by input Bias currentVST-BY=5 V10AVSBonSt-by on threshold voltage1.5VVSBoffSt-by off threshold voltage3.5VATTST-BYSt-by attenuation90dBIM inMute input bias current(VMUTE=5 V)10AAMMute attenuation90dBElectrical specificationsTDA7391PD6/11 3.4 Electrical characteristics curvesPOOut

17、put powerd=10%2026Wd=1%21Wd=10%;RL=3.2 32WPO EIAJEIAJ output power(*)VS=13.7 V40WdDistortion0.06%PO=0.1 to 15 W0.03%GVVoltage gain29.53030.5dBfHHigh frequency rolloffPO=1 W;-3 dB75KHzRINInput ImpedanceDifferential3660KSingle Ended3055KEINInput noise voltageRg=0;f=22 Hz to 22 kHz4mVCMRRInput common m

18、ode rejectionf=1 kHz;VIN=1 Vrms65dBSVRSupply Voltage RejectionRg=0;Vr=1 Vrms60dBCDLClipping Detection Level10%TsdAbsolute Thermal Shutdown Junction Temperature160CFigure 4.Quiescent current vs.supply voltageFigure 5.EIAJ power vs.supply voltage Table 5.Electrical characteristics(continued)(VS=14.4 V

19、;RL=4,f=1 kHz,Tamb=25 C,unless otherwise specified)SymbolParameterTest conditionMin.Typ.Max.UnitTDA7391PDElectrical specifications 7/11Figure 6.Output power vs.supply voltage(RL=4)Figure 7.Distortion vs.frequency(RL=4)Figure 8.Output power vs.supply voltage(RL=3.2)Figure 9.Distortion vs.frequency(RL

20、=3.2)Figure 10.Supply voltage rejection vs.frequencyFigure 11.Common mode rejection vs.frequency Electrical specificationsTDA7391PD8/11 Figure 12.Total power dissipation and effic.vs.output power(RL=4)Figure 13.Power bandwidth TDA7391PDPackage information 9/114 Package informationIn order to meet en

21、vironmental requirements,ST(also)offers these devices in ECOPACK packages.ECOPACK packages are lead-free.The category of second Level Interconnect is marked on the package and on the inner box label,in compliance with JEDEC Standard JESD97.The maximum ratings related to soldering conditions are also

22、 marked on the inner box label.ECOPACK is an ST trademark.ECOPACK specifications are available at:.Figure 14.PowerSO-20 mechanical data and package dimensionsOUTLINE ANDMECHANICAL DATAea2AEa1PSO20MECDETAIL ATD1101120E1E2h x 45DETAIL Aleadsluga3SGage Plane0.35LDETAIL BRDETAIL B(COPLANARITY)GC-C-SEATI

23、NG PLANEe3bcNNHBOTTOM VIEWE3D1DIM.mminchMIN.TYP.MAX.MIN.TYP.MAX.A3.60.142a10.10.30.0040.012a23.30.130a300.10.0000.004b0.40.530.0160.021c0.230.320.0090.013D(1)15.8160.6220.630D1(2)9.49.80.3700.386E13.914.50.5470.570e1.270.050e311.430.450E1(1)10.911.10.4290.437E22.90.114E35.86.20.2280.244G00.10.0000.0

24、04H15.515.90.6100.626h1.10.043L0.81.10.0310.043N8(typ.)S8(max.)T100.394(1)“D and E1”do not include mold flash or protusions.-Mold flash or protusions shall not exceed 0.15mm(0.006”)-Critical dimensions:“E”,“G”and“a3”.(2)For subcontractors,the limit is the one quoted in jedec MO-166PowerSO-200056635

25、IJEDEC MO-166Weight:1.9grRevision historyTDA7391PD10/11 5 Revision history Table 6.Document revision historyDateRevisionChanges10-Oct-19981Initial release.02-Jul-20082Document reformatted.Document status promoted from product preview to datasheet.Added Table 1:Device summary.Added ECOPACK descriptio

26、n in Section 4:Package information.TDA7391PD 11/11 Please Read Carefully:Information in this document is provided solely in connection with ST products.STMicroelectronics NV and its subsidiaries(“ST”)reserve theright to make changes,corrections,modifications or improvements,to this document,and the

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34、es.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics.All other names are the property of their respective owners.2008 STMicroelectronics-All rights reservedSTMicroelectronics group of companiesAustralia-Belgium-Brazil-Canada-China-Czech Republic-Finland-France-Germany-Hong Kong-India-Israel-Italy-Japan-Malaysia-Malta-Morocco-Singapore-Spain-Sweden-Switzerland-United Kingdom-United States of A