半导体封装制程与设备材料知识介绍知识讲解.ppt
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1、半导体封装制程与设备材半导体封装制程与设备材料知识介绍料知识介绍半导体封装制程概述半导体封装制程概述半导体前段晶圆wafer制程半导体后段封装测试封装前段(B/G-MOLD)封装后段(MARK-PLANT)测试封装就是將前製程加工完成後所提供晶圓中之每一顆IC晶粒獨立分離,並外接信號線至導線架上分离而予以包覆包装测试直至IC成品。半半 导导 体体 制制 程程Oxidization(氧化处理)Lithography(微影)Etching(蚀刻)Diffusion Ion Implantation(扩散离子植入)Deposition(沉积)Wafer Inspection(晶圆检查)Grind&D
2、icing(晶圓研磨及切割)Die Attach(上片)WireBonding(焊线)Molding(塑封)Package(包装)Wafer Cutting(晶圆切断)Wafer Reduce(晶圆减薄)Laser Cut&package saw(切割成型)Testing(测试)Laser mark(激光印字)IC制造制造开始开始前段結束前段結束后段封装开始后段封装开始製造完成製造完成封装型式概述封装型式概述IC封装型式可以分为两大类,一为引脚插入型,另一为表面黏着型 构装型态构装名称常见应用产品Single In-Line Package(SIP)Power TransistorDual I
3、n-Line Package(DIP)SRAM,ROM,EPROM,EEPROM,FLASH,Micro controllerZigzag In-Line Package(ZIP)DRAM,SRAMSmall Outline Package(SOP)Linear,Logic,DRAM,SRAMPlastic Leaded Chip Carrier(PLCC)256K DRAM,ROM,SRAM,EPROM,EEPROM,FLASH,Micro controllerSmall Outline Package(SOJ)DRAM,SRAM,EPROM,EEPROM,FLASHQuad Flat Pa
4、ckage(QFP)MicroprocessorBALL Grid Array(BGA)Microprocessor封封 裝裝 型型 式式 (PACKAGE)Through HoleMountShapeMaterialLead PitchNo of I/OTypical FeaturesCeramicPlastic2.54 mm(100miles)8 64DIPDual In-linePackagePlastic2.54 mm(100miles)1 direction lead325SIPSingle In-linePackage封封 裝裝 型型 式式 Through HoleMountSha
5、peMaterialLead PitchNo of I/OTypical FeaturesPlastic2.54 mm(100miles)1 directionlead1624ZIPZigzagIn-linePackagePlastic1.778 mm(70miles)20 64S-DIPShrinkDual In-linePackage封封 裝裝 型型 式式 Through HoleMountShapeMaterialLead PitchNo of I/OTypical FeaturesCeramicPlastic2.54 mm(100miles)half-size pitch in the
6、 width direction2432SK-DIPSkinnyDualIn-linePackageCeramicPlastic2.54 mm(100miles)PBGAPin GridArray封封 裝裝 型型 式式 SurfaceMountShapeMaterialLead PitchNo of I/OTypical FeaturesPlastic1.27 mm(50miles)2 direction lead8 40SOPSmallOutlinePackagePlastic1.0,0.8,0.65 mm4 direction lead88200QFPQuad-FlatPack封封 裝裝
7、型型 式式 SurfaceMountShapeMaterialLead PitchNo of I/OTypical FeaturesCeramic1.27,0.762 mm(50,30miles)2,4 direction lead2080FPGFlatPackageof GlassCeramic1.27,1.016,0.762 mm(50,40,30 miles)2040LCCLeadlessChipCarrier封封 裝裝 型型 式式 SurfaceMountShapeMaterialLead PitchNo of I/OTypical FeaturesCeramic1.27 mm(50m
8、iles)j-shape bend4 direction lead18124PLCCPlastic LeadedChip CarrierCeramic0.5 mm32200VSQFVerySmallQuadFlatpackSanDisk Assembly Main ProcessDie Cure(Optional)Die BondDie SawPlasmaCard AsyMemory TestCleanerCard TestPacking for OutgoingDetaping(Optional)Grinding(Optional)Taping(Optional)WaferMountUV C
9、ure(Optional)Laser markPost Mold CureMoldingLaser CutPackage SawWire Bond SMT(Optional)半导体设备供应商介绍半导体设备供应商介绍-前道部分前道部分前道部分前道部分PROCESSVENDORMODELSMT-PRINTERDEKHOR-2ISMT CHIP MOUNTSIMENSHS-60TAPINGNITTODR3000-IIIINLINE GRINDER&POLISHACCRETECHPG300RMSTANDALONE GRINDERDISCO8560DETAPINGNITTOMA3000WAFER MOU
10、NTERNITTOMA3000DICING SAWDISCODFD6361TSKA-WD-300TPROCESSVENDORMODELDIE BONDHITACHIDB700ESECESEC2007/2008ASMASM889898CUREOVENC-SUNQDM-4SWIRE BONDERK&SK&SMAXUMULTRASKWUTC-2000ASMEagle60PLASMA CLEANMARCHAP1000TEPLATEPLA400MoldTOWAYPS-SERIESASAOMEGA3.8半导体设备供应商介绍半导体设备供应商介绍-前道部分前道部分前道部分前道部分半导体设备供应商介绍半导体设备
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