芯片制造流程复习课程.ppt

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1、芯片制造流程Tomakewafers,polycrystallinesiliconismelted.Themeltedsiliconisusedtogrowsiliconcrystals(oringots)thatareslicedintowafers.首先融化多晶硅，生成晶柱，然后切割成晶圆。Raw Material for Wafers 晶圆制作所需原料Toremovethetiniestscratchesandimpurities,onesideofeachwaferispolishedtoamirror-likesurface.Chipsarebuiltonthissurface.切下

2、的晶圆要经过清洁、磨光等步骤以去除杂质，使平面光滑。Raw Material for Wafers(Contd)晶圆制作所需原料(接上页)Alayerofsilicondioxide(SiO2)glassisgrownonthewaferbyexposingthewafertooxygenatveryhightemperatures.Aprocesscalledchemicalvapordeposition(CVD)isthenusedtocoatsilicondioxideontothewafersurface.Becauseitwillnotconductelectricity,thisl

3、ayeriscalled“dielectric”.Later,channelswillbeetchedorotherwiseformedinthedielectricforconductingmaterials.SiO2mayalsobegrownordepositedduringlaterstepsintheprocessaslayersofthecircuitarebuiltontothechips:制作晶片的第一步是在晶圆上沉积一层不导电的二氧化硅。在晶片的后续制作过程中，二氧化硅层的成长、沉积会进行很多次。在高温下使晶圆曝氧可以使二氧化硅层成长。然后使用化学气相沉积方法使二氧化硅层沉积

4、在晶圆表面。Chip Manufacturing Process Deposition 芯片制作过程 沉积 SMICWhat is microlithography?Microlithography:transfer the pattern of circuitry from a mask to a wafer.Photolithography,orlithographyforshort,isusedtocreatemultiplelayersofcircuitpatternsonachip.First,thewaferiscoatedwithalight-sensitivechemicalc

5、alledphotoresist.Thenlightisshonethroughapatternedplatecalledamaskorreticletoexposetheresistmuchthesamewayfilmisexposedtolighttoformaphotographicimage.下面使用光刻制程在芯片建立多层电路图案。首先，晶圆表面上覆盖上一层感光性强的化学制品光刻胶。象光透过电影底片形成图象一样，光透过光掩膜在晶圆上形成图案。Chip Manufacturing Process Photolithography 芯片制作过程 光刻SMICThewafersexposur

6、etolightinlithographycausesportionsoftheresistto“harden”(orbecomeresistanttocertainchemicals).The“non-hardened”resistiswashedaway.Thenthematerialbelowit,forexampleSiO2,isetchedaway.Finally,the“hardened”resistisstrippedoffsothatthematerialunderneathformsathree-dimensionalpatternonthewafer.Thefirstlit

7、hographyandetchprocesswillresultinapatternofSiO2.光刻制程后，感光部分的光刻胶具有强的抗腐蚀性，抗腐蚀性弱的光刻胶在接下来的制程里被洗去。接着光刻胶下面的部分被蚀刻制程除去。最后，抗腐蚀性强的光刻胶也被剥离。光刻与蚀刻制程在晶圆表面形成3D的图案。Chip Manufacturing Process Etching 芯片制作过程 蚀刻SMICThroughseverallithographyandetchsteps,subsequentlayersofvariouspatternedmaterialsarebuiltuponthewafertof

8、ormmultiplelayersofcircuitpatternsonasinglechip.经过几次光刻与蚀刻步骤，在晶圆表面叠加成多层不同图案Chip Manufacturing Process Forming Multiple Layers芯片制作过程 生成多层SMICTocontroltheflowofelectricitythroughachip,certainareasofthewaferareexposedtochemicalsthatchangeitsabilitytoconductelectricity.Atomsfromthechemicals,calleddopingm

9、aterials,canbe“diffused,”orforced,intoareasofthesiliconwaferthroughchemicalexposureandheating.为了能在晶片上控制电流，加热晶圆，使晶圆部分区域接触添加剂。添加剂里的原子能够替换晶圆里的部分硅原子来改变其导电性。Chip Manufacturing Process Ion Implantation 芯片制作过程 离子植入SMICTheportionsofachipthatconductelectricityformthechipsinterconnections.Aconductingmetal(usu

10、allyaformofaluminum)isdepositedontheentirewafersurface.Unwantedmetalremovedduringlithographyandetchingleavesmicroscopicallythinlinesofmetalinterconnects.Allthemillionsofindividualconductivepathwaysmustbeconnectedinorderforthechiptofunction.Thisincludesverticalinterconnectionsbetweenthelayersaswellas

11、horizontalInterconnectionsacrosseachlayerofthechip.进行电连接。导电金属（通常是铝）在晶圆表面沉积。使用光刻和蚀刻制程去除没有用的金属。现在复杂的晶片都需要很多层绝缘体。一个正常运作的晶片需要连接数以百万计的传导线路，包括层上水平连接和各层之间的垂直连接。Chip Manufacturing Process Electroplating 芯片制作过程 电路连接SMICSMIC 0.13u Cu BEOL FlowSMIC 0.13u Cu BEOL FlowSMIC is currently running 1P6M,1P8M processE

12、achchiponacompletedwaferistestedforelectricalperformance.Anychipsthatfailaremarkedsotheycanbediscardedwhensawedintoindividualdies.Thechipsareputintoindividualpackageswhichwillprotectthechipsandprovideconnectionsfromthechipstotheproductsforwhichtheyaredesigned.Forexample,chipsdestinedforcomputersarep

13、lacedInpackagingthatcanbepluggedintocomputercircuitboards.Oncepackaged,chipsaretestedagaintomakesuretheyfunctionproperlybeforebeingshippedtodistributorsorplacedinelectronicproducts.晶圆上的每一个晶粒都需要进行测试。有缺陷的晶粒被标记起来，在进行晶圆切割时这些晶粒被剔除。每个晶粒都按要实现功能的不同进行单独封装。比如要应用在电脑上的晶粒被封装后能够插入电脑集成电路板。封装好后，在进行最终使用前，晶粒将进行再一次测试以

14、确保功能正常。Chip Manufacturing Process Assembly&Testing 芯片制作过程 切割、封装SMICPackage Types and Applications(1)Conventional Leadframe Type(PDIP,SOP,TSOP,QFP)Advanced Substrate Type(BGA)Molding compoundLeadframeGold wireDieEpoxy(Silver paste)Die attach padMolding compoundEpoxy(Silver paste)DieGold wireSolder ba

15、llBT resinThrough holeDieGold wireLOC tapeLeadframe with Down-setLOC(Lead-on-chip)Introduction of the Semiconductor Introduction of the Semiconductor Packages and AssemblyPackages and Assembly晶柱晶柱Silicon Ingot晶圆晶圆Wafer离子植入切割、封装电镀(Die,晶粒)(Chip,晶芯)蚀刻沉积Ion ImplantationAssembly&TestingElectroplatingEtchingDeposition SMIC Business应用领域Applications 应用领域应用领域光罩制作/光刻Mask Making/Photolithography中中芯芯业业务务Chip Manufacturing Process Summary 芯片制作过程总结Thanks 谢谢谢谢Q&A 请您提问请您提问此课件下载可自行编辑修改，仅供参考！此课件下载可自行编辑修改，仅供参考！感谢您的支持，我们努力做得更好！谢谢感谢您的支持，我们努力做得更好！谢谢