SoC设计方法与实现IO环设计.pptx

《SoC设计方法与实现IO环设计.pptx》由会员分享，可在线阅读，更多相关《SoC设计方法与实现IO环设计.pptx（18页珍藏版）》请在淘文阁 - 分享文档赚钱的网站上搜索。

1、Package FunctionsSignal distributionPower distributionHeat dissipationCircuit support and protection from environmentA space transformer between the fine pitch grid of IC and the PCB(Printed Circuit Board)pitch grid第1页/共18页SingulationMoldingSolder Ball AttachPackaging ProcessSawingWire BondingDieDie

2、 AttachWaferWireSubstratePackingFinal TestSolder BallMolding Compound第2页/共18页Typical IC PackageBall Grid Array(BGA)Small Outline PackageDual-In-Line PackagePlastic Pin Grid ArrayPlastic Quad Flat PackageChip Scale Package(CSP)System In Package(SIP)Plastic Leaded Chip CarrierThin Outline Package第3页/共

3、18页Industry Packing Trends第4页/共18页Ball Grid Array(BGA)BGA is a die-up design,plastic over-molded BGA using 2-4 layer BT substrate第5页/共18页More Advantage of BGAImproved electrical performance due to shorter distance between the chip and the solder ballsImproved thermal performance by use of thermal vi

4、as,or heat dissipation through power and ground plane incorporated in the substrateReduced handling-related lead damages due to use of solder balls instead of metal leadsWhen reflow attached to boards,the solder balls self align leading to higher manufacturing yields第6页/共18页Flip Chip PackagesPros Go

5、od electrical performance(reduced inductance)Good thermal performance w/heat sink Large number of die pads per die areaSmall die size and low package heightCons High cost solution Board level reliability concernsDirectsolderbumpingontothedie,placingtheinterconnectionbumpdirectlyontothesubstrate,elim

6、inatingtheneedforwirebonding.SUBSTRATE(Organic or Ceramic)CHIPSolder bumpSolder ball第7页/共18页Si WaferSolderUBMPassivationWafer Scale CSP第8页/共18页Multi Chip Package(MCP)It also called SiP(System in Package)High performance Low noiseLow power consumptionOptimizing board space Commonly used in handheld a

7、pplicationProblem:reduced assembly yield,high testing cast第9页/共18页Package DriversElectricalThermalMechanicalCostPackageBodySizeI/OCountDieSizeReliabilityPackageSelectionProcess第10页/共18页Thermal EffectPower consumption generates heat and raises temperatureCircuit performance degrades due to slower MOS

8、FET switching speed in high temperatureMore susceptible to reliability problems in higher temperatureOxide breakdownHot-electron effectHigher leakage current第11页/共18页Thermal Performance and ImprovementlAddingthermalpadstoimprovethermalperformancelAtypicalPowerBGA(PBGA)Structure:ThermalsimulationTher

9、mal BallsPBGAhasthermalpaththroughthermalviaandball第12页/共18页Packaging General GuidelinesPackages affect both power supply delivery and signal integrityWirebond packagesnAlways use package with a ground planenNever use for high power designs(too much IR drop,noise)nNever use above 4GbpsFlip Chip pack

10、agesnAlways use for 4+GbpsnAlways use for high power systemsnCan be the best power,best performancenMore knowledge needed to buildnCan be built poorly 第13页/共18页3CPackageEvolution第14页/共18页Package Technology TrendsReduction in Area,Volume and Weight Increased I/O Count Improved Thermal/Electrical Perf

11、ormance Improved Reliability Potential for Multi-Chip Package,System In Package Reduced Capital Cost for Assembly and Test Green Products(Pb-Free,Halogen-Free)第15页/共18页ConclusionslThereisnoonepackageforallapplicationslFlipChipprovidesthebestelectricalperformancelPBGAprovidesthebestthermalperformancelLeadedpackagesprovidethebestboardlevelreliabilityperformancelTherightpackageistheonethatcanmeetalltherequirementsandconstraintsoftheapplicationfortheleastcost第16页/共18页SoC设计方法与实现设计方法与实现郭炜郭炜 郭筝郭筝 谢憬谢憬Thank you第17页/共18页感谢您的观看！第18页/共18页