CC2591数据手册.pdf
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1、1FEATURESAPPLICATIONSDESCRIPTIONCC2591 BLOCK DIAGRAMPALogicBias15723411LNA56BIASHGMRF_PRXTXRF_NPAENENBALUNANTCC.SWRS070AMARCH 2008REVISED JUNE 20082.4-GHz RF Front EndAll 2.4-GHz ISM Band SystemsSeamless Interface to 2.4-GHz Low Power RFDevices from Texas InstrumentsWireless Sensor NetworksWireless
2、Industrial SystemsUp to 22-dBm Output PowerIEEE 802.15.4 and ZigBee Systems6-dB Typical Improved Sensitivity on CC24xxWireless Consumer Systemsand CC2500,CC2510,and CC2511Wireless Audio SystemsFew External ComponentsIntegrated SwitchesIntegrated Matching NetworkCC2591 is a cost-effective and high pe
3、rformance RFIntegrated BalunFront End for low-power and low-voltage 2.4-GHzIntegrated Inductorswireless applications.Integrated PACC2591 is a range extender for all existing and futureIntegrated LNA2.4-GHz low-power RF transceivers,transmitters andDigital Control of LNA Gain by HGM PinSystem-on-Chip
4、 products from Texas Instruments.100-nA in Power Down(EN=PAEN=0)CC2591 increases the link budget by providing apower amplifier for increased output power,and anLow Transmit Current ConsumptionLNA with low noise figure for improved receiver(100-mA at 3-V for 20-dBm Out,PAE=33%)sensitivity.Low Receive
5、 Current ConsumptionCC2591 provides a small size,high output power RF3.4-mA for High Gain Modedesign with its 4x4-mm QFN-16 package.1.7-mA for Low Gain ModeCC2591 contains PA,LNA,switches,RF-matching,4.8-dB LNA Noise Figure,including T/R Switchand balun for simple design of high performanceand exter
6、nal antenna matchwireless applications.RoHS Compliant 44-mm QFN-16 Package2-V to 3.6-V Operation1Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end o
7、f this data sheet.Submit Documentation FeedbackCopyright 2008,Texas Instruments IncorporatedABSOLUTE MAXIMUM RATINGSRECOMMENDED OPERATING CONDITIONSELECTRICAL CHARACTERISTICSCC2591SWRS070AMARCH 2008REVISED JUNE These devices have limited built-in ESD protection.The leads should be shorted together o
8、r the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.Under no circumstances must the absolute maximum ratings be violated.Stress exceeding one or more of the limiting valuesmay cause permanent damage to the device.PARAMETERVALUEUNITSupply
9、voltageAll supply pins must have the same voltage0.3 to 3.6VVoltage on any digital pin0.3 to VDD+0.3,max 3.6Input RF level10dBmStorage temperature range50 to 150CThe operating conditions for CC2591 are listed below.PARAMETERMINMAXUNITAmbient temperature range4085COperating supply voltage23.6VOperati
10、ng frequency range24002483.5MHzTC=25C,VDD=3 V,fRF=2440MHz(unless otherwise noted).Measured on CC2591EM reference design including externalmatching components.PARAMETERTEST CONDITIONSMINTYPMAXUNITReceive current,High Gain ModeHGM=13.44Receive current,Low Gain ModeHGM=01.72mATransmit currentPIN=0.5 dB
11、m112Transmit currentNo input signal4050Power down currentEN=PAEN=00.10.3AHigh input level(control pins)EN,PAEN,HGM,RXTX1.3VDDVLow input level(control pins)EN,PAEN,HGM,RXTX0.3Power down-Receive mode switching12stimePower down-Transmit mode switching1stimeRF ReceiveGain,High Gain ModeHGM=111dBGain,Low
12、 Gain ModeHGM=01dBGain variation,2400 2483.5 MHz,HighHGM=11.3dBGain ModeGain variation,2.0V 3.6V,High GainHGM=11.5dBModeGain variation,-40C 85C,High GainHGM=13dBModeHGM=1,including internal T/R switch and externalNoise figure,High Gain Mode4.8dBantenna matchInput 1 dB compression,High Gain ModeHGM=1
13、17dBmInput IP3,High Gain ModeHGM=12dBmInput reflection coefficient,S11HGM=1,measured at antenna port11dB2Submit Documentation FeedbackCopyright 2008,Texas Instruments IncorporatedProduct Folder Link(s):CC2591CC.SWRS070AMARCH 2008REVISED JUNE 2008ELECTRICAL CHARACTERISTICS(continued)TC=25C,VDD=3 V,fR
14、F=2440MHz(unless otherwise noted).Measured on CC2591EM reference design including externalmatching components.PARAMETERTEST CONDITIONSMINTYPMAXUNITRF TransmitGain22dBOutput power,POUTPIN=0.5 dBm20.6dBmMaximum output powerPIN=5 dBm22dBmPower Added Efficiency,PAEPIN=0.5 dBm34%Output 1 dB compression19
15、dBmOutput IP332dBmOutput power variation over frequency2400 2483.5 MHz,PIN=0.5 dBm0.5dBOutput power variation over power supply2V 3.6V,PIN=0.5 dBm3.5dBOutput power variation over temperature-40C 85C,PIN=0.5 dBm1.5dBPIN=0.5 dBm.The 2nd harmonic can be reduced to2nd harmonic powerbelow regulatory limi
16、ts by using an external LC filter15dBmand antenna.PIN=0.5 dBm.The 3rd harmonic can be reduced to3rd harmonic powerbelow regulatory limits by using an external LC filter30dBmand antenna.Copyright 2008,Texas Instruments IncorporatedSubmit Documentation Feedback3Product Folder Link(s):CC2591DEVICE INFO
17、RMATIONAVDD_PA112341211109567816151413QFN-16 4x4mmRF_NRXTXRF_PHGMENPAENGNDGNDANTGNDAVDD_BIASBIASGNDAVDD_LNAAVDD_PA2CC2591SWRS070AMARCH 2008REVISED JUNE The CC2591 pinout and description are shown in Figure 1 and Table 1,respectively.PIN AND I/O CONFIGURATION(TOP VIEW)Figure 1.NOTE:The exposed die at
18、tach pad must be connected to a solid ground plane as this is theprimary ground connection for the chip.Inductance in vias to the pad should beminimized.It is highly recommended to follow the reference layout.Changes will alterthe performance.Also see the PCB landpattern information in this data she
19、et.For best performance,minimize the length of the ground vias,by using a 4-layer PCBwith ground plane as layer 2 when CC2591 is mounted onto layer 1.4Submit Documentation FeedbackCopyright 2008,Texas Instruments IncorporatedProduct Folder Link(s):CC2591CC.SWRS070AMARCH 2008REVISED JUNE 2008Table 1.
20、TERMINAL FUNCTIONSTERMINALTYPEDESCRIPTIONNO.NAMEThe exposed die attach pad must be connected to a solid ground plane.SeeGNDGroundCC2591EM reference design for recommended layout.12.0 V 3.6 V Power.PCB trace to this pin serves as inductive load to PA.SeeAVDD_PA1PowerCC2591EM reference design for reco
21、mmended layout.2RF_NRFRF interface towards CC24xx or CC25xx device.RXTX switching voltage when connected to CC24xx devices.See Table 3 and Table 43RXTXAnalog/Controlfor details.4RF_PRFRF interface towards CC24xx or CC25xx device5PAENDigital InputDigital control pin.See Table 3 and Table 4 for detail
22、s.6ENDigital InputDigital control pin.See Table 3 and Table 4 for details.Digital control pin.7HGMDigital InputHGM=1 Device in High Gain ModeHGM=0 Device in Low Gain Mode(RX only)Secondary ground connections.Should be shorted to the die attach pad on the top8,9,12,14GNDGroundPCB layer.2.0 V 3.6 V Po
23、wer.PCB trace to this pin serves as inductive load to PA.See10AVDD_PA2PowerCC2591EM reference design for recommended layout.11ANTRFAntenna interface.2 V 3.6 V Power.PCB trace to this pin serves as inductive load to LNA.See13AVDD_LNAPowerCC2591EM reference design for recommended layout.15BIASAnalogBi
24、asing input.Resistor between this node and ground sets bias current to PAs.16AVDD_BIASPower2 V 3.6 V Power.Copyright 2008,Texas Instruments IncorporatedSubmit Documentation Feedback5Product Folder Link(s):CC2591CC2591EM Evaluation ModuleRF_PRXTXRF_NRF_PRXTXRF_N=TLINE inductorCC2591ANTPAENENHGMBIASVD
25、DAVDD_PA2AVDD_PA1AVDD_LNAAVDD_BIASVDD VDDVDDRF_PRXTXRF_NR151TL11TL101TL131PAENENC111L112C161C11/C12C101/C102C131/C132HGMRXTXC2LDB182G4520C-110BalunSMASMAL111CC2591SWRS070AMARCH 2008REVISED JUNE Figure 2.CC2591EM Evaluation ModuleTable 2.List of Materials(See CC2591EM Reference Design)DEVICEFUNCTIONV
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