【精品】SoC设计方法与实现第十四章 IO环设计2精品ppt课件.ppt

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1、SoC设计方法与实现第十四章 IO环设计2 OutlinesBasic structure of I/O cellsNoise Cancellation ESD Protection SchemeI/O ring designPackage SelectionPackage FunctionsSignal distributionPower distributionHeat dissipationCircuit support and protection from environmentA space transformer between the fine pitch grid of IC

2、 and the PCB(Printed Circuit Board)pitch gridSingulationMoldingSolder Ball AttachPackaging Process SawingWire BondingDieDie AttachWaferWireSubstratePackingFinal TestSolder BallMolding CompoundTypical IC PackageBall Grid Array(BGA)Small Outline PackageDual-In-Line PackagePlastic Pin Grid ArrayPlastic

3、 Quad Flat PackageChip Scale Package(CSP)System In Package(SIP)Plastic Leaded Chip CarrierThin Outline PackageMore Advantage of BGAImproved electrical performance due to shorter distance between the chip and the solder ballsImproved thermal performance by use of thermal vias,or heat dissipation thro

4、ugh power and ground plane incorporated in the substrateReduced handling-related lead damages due to use of solder balls instead of metal leadsWhen reflow attached to boards,the solder balls self align leading to higher manufacturing yieldsFlip Chip PackagesPros Good electrical performance(reduced i

5、nductance)Good thermal performance w/heat sink Large number of die pads per die areaSmall die size and low package heightCons High cost solution Board level reliability concernsDirect solder bumping onto the die,placing the interconnection bump directly onto the substrate,eliminating the need for wi

6、re bonding.SUBSTRATE(Organic or Ceramic)CHIPSolder bumpSolder ballSi WaferSolderUBMPassivationWafer Scale CSPMulti Chip Package(MCP)It also called SiP(System in Package)High performance nLow noisenLow power consumptionnOptimizing board space Commonly used in handheld applicationProblem:reduced assem

7、bly yield,high testing castPackage DriversElectricalThermalMechanicalCostPackage Body SizeI/O CountDie SizeReliabilityPackage Selection ProcessThermal EffectPower consumption generates heat and raises temperatureCircuit performance degrades due to slower MOSFET switching speed in high temperatureMor

8、e susceptible to reliability problems in higher temperaturenOxide breakdownnHot-electron effectnHigher leakage currentThermal Performance and ImprovementlAdding thermal pads to improve thermal performancelA typical Power BGA(PBGA)Structure:Thermal simulationThermal BallsPBGA has thermal path through

9、 thermal via and ballPackaging General GuidelinesPackages affect both power supply delivery and signal integrityWirebond packagesnAlways use package with a ground planenNever use for high power designs(too much IR drop,noise)nNever use above 4GbpsFlip Chip packagesnAlways use for 4+GbpsnAlways use f

10、or high power systemsnCan be the best power,best performancenMore knowledge needed to buildnCan be built poorly 3C Package EvolutionPackage Technology TrendsReduction in Area,Volume and Weight Increased I/O Count Improved Thermal/Electrical Performance Improved Reliability Potential for Multi-Chip P

11、ackage,System In Package Reduced Capital Cost for Assembly and Test Green Products(Pb-Free,Halogen-Free)ConclusionslThere is no one package for all applicationslFlip Chip provides the best electrical performancelPBGA provides the best thermal performancelLeaded packages provide the best board level reliability performancelThe right package is the one that can meet all the requirements and constraints of the application for the least costSoC设计方法与实现设计方法与实现郭炜郭炜 郭筝郭筝 谢憬谢憬Thank you