品质管理英语词汇分类大全教案资料.doc

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1、Good is good, but better carries it.精益求精，善益求善。品质管理英语词汇分类大全-品质管理英语词汇大全CosmeticDefectTermsPlasticPartsNo.中文名称英文名称No.中文名称英文名称1黑条纹BlackStreaking21成品表面模糊SurfaceHaze2破碎Brittleness22扭曲Torsion3烧焦Burning23侧面低陷UnderCut4褪色ColorFading24表面不平坦Unevenness5表面陷痕CraterPit;SinkMark25拖痕DragMark6未着色,异色Discoloration26缩水Sh

2、rinkMark7流纹(痕)Flowlines(Mark);Tear27冲料痕EjectorMark8毛边Burrs;Sharpedge28冷流ColdVariation9成品脆弱Fragile29变色ColorVariation10喷痕JettingMark30反翘Warping11表面无光泽LackofGloss;Glossiness31出料痕GateMark12刮伤Scratches;Nicks;32成品离模不良Stickingofpartsinthemold13银条SilverStreaking33冷流ColdFlow14填充不足ShortShot(Filling)34翘曲Warpag

3、e15表面剥落SurfacePeeling35亮斑FlashMark16气泡Void36异色点Colorstain17结合线WeldLine;KnitLine37油污Oil;Grease;18指印(痕)FingerPrints(Marks)38白点(斑)WhiteSpot(Mark)19粘漆PaintAdhesion39变形20色不匹配ColorMismatch402.MetalPartsNo.中文名称英文名称No.中文名称英文名称1腐蚀,铁锈Corrosion5外被不良PoorCoating2刮伤Scratches6毛刺SharpEdges(sawburrs)3踫伤Bumps7电镀不良Poo

4、rPlating4污点StainsCablePartsNo.中文名称英文名称No.中文名称英文名称1油污Grease;Oils7套子毛边ObviousBurrsattheSleeves2卷曲OverstressedCurls8印字图案不清UnclearLetter,Pictograms3绑带过松UnfunctionalBandages9印刷歪斜Skew4插头损坏DamagedPlugs10色斑ColorStain5SR硫化不良PoorVulcanizationofSR11指痕FingerPrints(Marks)6Conn缝合不良PoorCrimpingofconn.12外被不完整Incomp

5、leteCasingManuals,Packages,PrintedInformationandTypeLablesNo.中文名称英文名称No.中文名称英文名称1内容不完整Uncompleteness7折皱Folds2色彩错误WrongTint8裂纹Flaws3印字图案不清UnclearLetter,Pictograms9覆盖Coverage4印刷歪斜Skew10印刷不良PoorPrinting5一致性不佳PoorLayerCongruence11字体错误IncorrectFont6起泡Bubble12裁边毛边及纸屑BurrsandgrainsfromcuttingProcessDefectT

6、erms1.SolderingQualityNo.中文名称英文名称No.中文名称英文名称1包焊ExcessSolder7锡裂SplitSolder2冷焊ColdSolder8锡桥SolderBridge3浮焊FloatingSolder9开路Open4空焊EmptySolder10短路Short5冰柱Icing11掉件,漏件MissingComponent6锡尖突出SolderTip12虚焊InveraciousSolderingOperationalDefectTermsNo.中文名称英文名称No.中文名称英文名称1漏插MissingParts(component)6踫伤Bumps2错件Wr

7、ongPart7粘胶PaintAdhesion3零件插反BackwardPart8零件错位MisalignedPart4异物ForeignPart9零件损坏BrokenPart5刮伤Scratches10漏焊OpenSolderICTFailCauseandRepairActionsNo.中文名称英文名称No.中文名称英文名称1短路Short11桥焊SolderBridge2错件WrongPart12加锡SolderAdded3零件插反BackwardPart13去锡SolderRemoved4掉件MissingPart14换零件PartReplaced5PCB缺陷PCBDefect15加零件

8、PartAdded6零件损坏BrokenPart16零件修复PartRepaired7零件缺陷DefectivePart17板送去分析BoardSentForAnalysis8PCB开路PCBOpen18板修复BoardRepaired9零件损坏BrokenPart19板报废BoardScrapped10漏焊OpenSolder20板丢失BoardLostTools,Jigs,andEquipmentNo.中文名称英文名称No.中文名称英文名称1电铬铁SolderingIron12超声波焊接机UltrasonicWeldingMachine2吸锡枪De-solderGun13游标卡尺Slidi

9、ngCallipers3波峰炉WaveSolderingMachine14螺旋测微器MicroMeterCallipers4回焊炉ReflowOven15数字扭力器DigitalTorqueMeter5电锁ScrewDriver16接地阻抗测试仪GroundContinuityTester6电子负载SmartElectronicLoad17高压测试仪AC/DCWithstandingVoltageTester7示波器Oscilloscope18电声分析仪ElectroacousticAnalyzer8万用表Multimeter19恒温恒湿机Temperature/HumidityChamber

10、9功率表PowerMeter20烤箱Oven10漏电流测试仪LeakageCurrentMeter21信号发生器FunctionGenerator11推拉力器Push-PullScale22烫金机HotStampingMachineSafetyandEMCNo.简称英文名称中文名称1EMCElectro-MagneticCompatibility电磁兼容2EMIElectro-MagneticInterference电磁干扰3EMSElectro-MagneticSusceptibility电磁耐受4EMPElectro-MagneticPulse电磁脉冲5ESDElectro-StaticD

11、ischarge静电放电6ULUnderwritersLaboratoriesInc.美国安规(担保实验室)7CSACanadianStandardsAssociation加拿大标准协会8FCCFederalCommunicationCommission美国联邦通讯委员会9IECInternationalElectrotechnicalCommission国际电工委员会10TUV德国技术监护委员会(莱茵公司)11CE欧洲共同市场标准12CCEE/CCIB中国电工产品安全认证委员会13VDE德国电气标准14CBCertificationBody全球性相互认证体系15NCBNationalCert

12、ificationBody国家认证机构QATestNo.中文名称英文名称No.中文名称英文名称1冷藏实验ColdTest9吊重测试Cord/StrainReliefDurability2干热实验DryHeatTest10落下实验DropTest3湿热实验DampHeatTest11扫频振动实验SweepVibrationTest4温度循环实验Temp.CyclingTest12随机振动实验RandomVibrationTest5储藏温湿循环实验Storagetemp./humidityCyclingTest13开/关冲击实验Poweron/offTest6工作温湿循环实验Operatingte

13、mp./humiditycyclingTest14开关寿命测试SwitchDurabilityTest7温度冲击实验ThermalShockTest15标签耐磨测试LabelDurabilityTest8烧机实验BurninTest16印字耐磨测试PrintingDurabilityTest六.AbbreviationNo.简称英文名称中文名称1MTBFMeanTimeBetweenFailure平均失效间隔时间2FMEAFailureModeandEffectsAnalysis失效模式与效应分析3GR&RGaugeRepeatabilityandReproducibility量规仪器重复性与

14、再现性4APQPAdvancedProductQualityPlanning前期产品质量规划5CaCapabilityofAccuracy制程准确度6CpCapabilityofPrecision制程精密度7EIAElectronicIndustriesAssociation电子工作协会8ISOInternationalOrganizationforStandard国际标准组织9SMTSurfaceMountingTechnology表面组装技术10SMDSurfaceMountingDevice表面组装设备11PDPProductDevelopmentProcedure产品开发流程12DVT

15、DesignVerificationTest设计验证测试13MVTManufacturingVerificationTest生产验证测试14MBOManagementByObject目标管理15RMAReturnedMerchandiseAccess退货16MDRMaterialDefectReport材料不良报告17DPMODefectPerMillionOpportunities每百万机会的不良次数18KPIKeyPerformanceIndicating主要绩效指标19BSCBalancedScoreCard平衡绩分卡20OOBAOutOfBoxAudit开箱检验21PPMPiecesP

16、erMillion每百万中的不良数22RPNRiskPriorityNumber风险优先指数23ESGEnergySystemsGroupMotorola的一个事业部的名称24ESPEmployeeSuggestionProgram员工提案制度25BOMBillofMaterial料单26QIIQualityInspectionInstruction质量检验说明书27MOIManufacturingOperationInstruction作业指导书MIManualInProcess手插件28ICTInCircuitTest在线测试29MSDSMaterialSafetyDataSheet材料安

17、全数据表30SPCStatisticalProcessControl统计制程管制31DOEDesignofExperiments实验设计1.缺件（MISSINGPARTS）2.错件（WRONGPARTS）3.多件（EXCESSIVEPARTS）4.短路（SHORT）5.断路（OPEN）6.线短（WIRESHORT）7.线长（WIRELONG）8.拐线（WIREPOORDDRESS）9.冷焊（COLDSOLDER）10.包焊（EXCESSSOLDER）11.空焊（MISSINGSOLDER）12.锡尖（SOLDERICICLE）13.锡渣（SOLDERSPLASH）14.锡裂（SODERCRAC

18、K）15.锡洞（PINHOLE）16.锡球（SOLDERBALL）17.锡桥（SOLDERBRIDGE）18.滑牙（SCREWLOOSE）19.氧化（RUST）20.异物（FOREIGNERMATERIAL）21.溢胶（EXCESSIVEGLUE）22.锡短路（SOLDERBRIDGE）23.锡不足（SOLDERINSUFFICIENT）24.极性反（WRONGPOLARITY）25.脚未入（PINUNSEATED）26.脚未出（PINUNVISIBLE）27.脚未剪（PINNOCUT）28.脚未弯（PINNOTBENT）29.缺盖章（MISSINGSTAMP）30.缺标签（MISSINGLA

19、BEL）31.缺序号（MISSINGS/N）32.序号错（WRONGS/N）33.标签错（WRONGLABEL）34.标示错（WRONGMARK）35.脚太短（PINSHORT）36.J1不洁（J1DIRTY）37.锡凹陷（SOLDERSCOOPED）38.线序错（W/LOFWIRE）39.未测试（NOTEST）40.VR变形（VRDEFORMED）41.PCB翘皮（PCBPEELING）42.PCB弯曲（PCBTWIST）43.零件沾胶（GLUEONPARTS）44.零件脚长（PARTSPINLONG）45.浮件（PARTSLIFT）46.零件歪斜（PARTSTILT）47.零件相触（PAR

20、TSTOUCH）48.零件变形（PARTSDEFORMED）49.零件损坏（PARTSDAMAGED）50.零件脚脏（PINDIRTY）51.零件多装（PARTSEXCESS）52.零件沾锡（SOLDERONPARTS）53.零件偏移（PARTSSHIFT）54.包装错误（WRONGPACKING）55.印章错误（WRONGSTAMPS）56.尺寸错误（DIMENSIONWRONG）57.二极管坏（DIODENG）58.晶体管坏（TRANSISTORNG）59.振荡器坏（XTLNG）60.管装错误（TUBESWRONG）61.阻值错误（IMPEDANCEWRONG）62.版本错误（REVWRO

21、NG）63.电测不良（TESTFAILURE）64.版本未标（NONREVLEBEL）65.包装损坏（PACKINGDAMAGED）66.印章模糊（STAMPSDEFECTIVE）67.标签歪斜（LABELTILT）68.外箱损坏（CARTONDAMAGED）69.点胶不良（POORGLUE）70.IC座氧化（SOCKETRUST）71.缺UL标签（MISSINGULLABEL）72.线材不良（WIREFAILURE）73.零件脚损坏（PINDAMAGED）74.金手指沾锡（SOLDERONGOLDENFINGERS）75.包装文件错（RACKINGDOCWRONG）76.包装数量错（PACK

22、INGQTYWRONG）77.零件未定位（PARTSUNSEATED）78.金手指沾胶（GLUEONGOLDENFINGERS）79.垫片安装不良（WASHERUNSEATED）80.线材安装不良（WIREUNSEATED）81.立碑（TOMBSTONE）SMT不良描述中英文对照1露底材Basematerialexpose2偏位Shift3短路/连锡Short4少锡Insufficientsolder5多锡/包焊Excesssolder6漏印Missingprint7反白Upsidedown8少件Missingcomponent9反向Wrongorientation10错件Wrongcompo

23、nent11多件/残件Extracomponent12破损Damaged13空焊Nosolder14立碑Tombstoning15锡珠Solderballs16侧立Sidetermination17零件氧化Partsoxidation18锡尖Solderprojection19浮高Float20翘脚Liftedlead21PAD不上锡PADdiscoloration22针洞Pinholes23压件Covercomponent24残异物Residues25助焊剂残留Fluxresidues26少胶Insufficientglue27溢胶Overflowglue28误判NoFail29其它Othe

24、r30印刷不良PrintDefect31上盖脱落/断裂Topcovermissing/crack32掉件/撞件Dropcomponent33内PIN翘起（缺PIN/短PIN/翘PIN）Liftedinside-pin34版本混装Mixededition35线路偏移Circuitshift36错位Errorposition37脚歪/变形Leaddeformed/deformation38混料Mixedmaterial39胶未固化Gluenotbesolidified40烫伤Scald41堵孔Obstacleonvia42PCB白化/分层PCBDelamination43漏洞Exposedcopp

25、er44无极性Missingpolarity45压伤Crush46漏点胶Missingglue47气泡Airbubble48屏蔽架变形ShieldDeformation49屏蔽架毛刺ShieldBurr50刮伤Scraped51弹片翘起Springlifted52弹片失效Springfailure53弹片无法复位Springcantreplace54零件沾锡Solderonparts序号汉语意义英文翻译焊锡质量类1冷焊coldsolder2零件偏移componentshifted3污损contamination4坏件damagedcomponent5锡多excessivesolder6装插不良

26、improperinsertion7绝缘不良insulationdamaged8线脚长leadprotrusionoutofspec9漏点胶missingglue10漏标示missingmarking11近似短路nearshort12无线尾noleadprotruded13翘皮peelingoff14极性反polarityreversed15成型不良poorpreforming16锡桥solderbridge17锡裂soldercrack18锡尖soldericicle19锡少solderinsufficient20防焊漆胶落soldermaskpeelingoff21锡渣solderspat

27、ter22锡洞soldervoid23错件wrongpartICTFailCauseandRepairActions1短路Short2零件插反BackwardPart3板丢失BoardLost4板修复BoardRepaired5板报废BoardScrapped6板送去分析BoardSentForAnalysis7零件损坏BrokenPart8零件缺陷DefectivePart9掉件Missingpart10加零件PartAdded11零件修复PartRepaired12换零件PartReplaced13PCB缺陷PCBDefect14PCB开路PCBOpen15加锡SolderAdded16桥

28、焊SolderBridge17去锡SolderRemovedSoldingquality1空焊EmptySolder2包焊ExcessSolder3浮焊FloatingSolder4冰柱Icing5虚焊InveraciousSoldering6掉件，漏件MissingComponent7开路Open8漏焊OpenSolder9锡桥SolderBridge10锡尖突出SolderTip11锡裂SplitSolderOperationaldefectterms1零件插反BackwardPart2零件损坏BrokenPart3碰伤Bumps4异物ForeignPart5零件错位MisalignedP

29、art6漏件MissingParts(component)7粘胶PaintAdhesion8刮伤Scratches9错件WrongPartOthers1不正常Abnormal2附件Accessory3外观Apperance4装配Assembling5附着，贴附Attached6弯曲Bent7束线Bind8翘皮Blister/peeling9接Bridge10破损Broken11毛边Burrs12裂纹Chip/crack13夹住Clip14污染Contamination15腐蚀Corrosion16交叉Cross17损坏Damage18减少Decrease19深刮伤DeepScratch20缺点

30、Defect21变形Deformed22凹痕Dent23偏差Deviation24尺寸Dimension25变色(白化)Discoloration26化状箱Displaybox27双重Double28脱落Drop,Talloff29超过Excess30假焊FalseSolder(Cold)31频率Fequency32塞住FillUp33浮Float34异物ForeignMaterial35碎片塞Fragement36胶Glue37溢胶Glueoverflow38重Heavy39不清楚illegible40不完全Incomplete41增加Increase42确认Indentify43指示灯In

31、dicateLamp44不合治具Ingagued45未固定Insecurely46插配Insertion47内部Inside48干扰Interference49间断，不安定Intermittent50杂物Junk51纠缠Kink52布置，配置Layout53线脚Lead54浅音LeakageSound55翘起Lifted56轻Light57位置Location58松Loose59方向不对Misorientation60未镀表层Misplating61欠缺Missing62混Mix63多重Multiple64不良NoGood(NG)65偏心Offcenter66振荡Oscillation67外部

32、Outsid68脱漆Paintdrop69部分Partial70铜箔Pattem(PAD）71太差Poor72凸Protrude73残留物Residue74粗糙Roughness75生锈Rust76LED数字分节Segment77陷Sink78滑动Slide79脱落Slip80锡珠SolderBall81流锡SolderFlow82分开，分隔Sparation83污点Stain84粘Stick85薄Thickness86紧Tight87透明Transparent88不平Uneven89不顺Unsmooth90上下颠倒Upsidedown91漆VarnishPaint92缺洞Void(Holes)93弱WeakSMT中英文对照1.FundamentalsofSoldersandSoldering（焊料及焊接基础知识）SolderingTheory（焊接理论）MicrostructureandSoldering（显微结构及焊接）EffectofElementalConstituentsonWetting（焊料成分对润湿的影响）EffectofImpuritiesonSoldering（杂质对焊接的影响）2.SolderPasteTechnology（焊膏工艺）SolderPowder(锡粉)SolderPasteRheology（锡膏流变学）SolderPasteCompo