电路板制作流程.ppt

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1、PCB Process Introduction(Tenting Process)PCB Process Introduction(Tenting Process)PCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manu

2、facturing Process FlowSHEARINGCNC DRILLPTHD/F PHOTO IMAGE(INNER LAYER)LAMINATIONCNC DRILLPANEL PLATINGD/F PHOTO IMAGE(OUTER LAYER)LIQUID SOLDER MASKHOT AIR LEVELINGROUTINGELECTRICAL TESTO.Q.C.0徐 振 連JOHNNY HSU流流 程程 圖圖 PCB Mfg.FLOW CHARTUPDATED:1999,04,16顧 客 (CUSTOMER)工 程 製 前(FRONT-END DEP.)裁 板(LAMINA

3、TE SHEAR)內 層 乾 膜(INNERLAYER IMAGE)預 疊 板 及 疊 板(LAY-UP)通 孔 電 鍍(P.T.H.)液 態 防 焊(LIQUID S/M )外 觀 檢 查(VISUAL INSPECTION)成 型(FINAL SHAPING)業 務(SALES DEPARTMENT)生 產 管 理(P&M CONTROL)蝕 銅(I/L ETCHING)鑽 孔 (PTH DRILLING)壓 合(LAMINATION)外 層 乾 膜(OUTERLAYERIMAGE)二次銅及錫鉛電鍍(PATTERN PLATING)蝕 銅(O/L ETCHING)檢 查(INSPECTIO

4、N)噴 錫(HOT AIR LEVELING)電 測(ELECTRICAL TEST )出 貨 前 檢 查(O Q C )包 裝 出 貨(PACKING&SHIPPING )曝 光 (EXPOSURE)壓 膜(LAMINATION)前處理(PRELIMINARY TREATMENT)顯 影(DEVELOPIG)蝕 銅(ETCHING)去 膜 (STRIPPING)黑 化 處 理(BLACK OXIDE)烘 烤(BAKING)預 疊 板 及 疊 板(LAY-UP)壓 合(LAMINATION)後處理(POSTTREATMENT)曝 光(EXPOSURE)壓 膜(LAMINATION)二次銅電鍍(

5、PATTERNPLATING)錫 鉛 電 鍍(T/L PLATING)去 膜(STRIPPING)蝕 銅(ETCHING)剝 錫 鉛(T/L STRIPPING)塗 佈 印 刷(S/M COATING)預 乾 燥(PRE-CURE)曝 光(EXPOSURE)顯 影(DEVELOPING)後 烘 烤(POST CURE)多層板內層流程(INNER LAYER PRODUCT)MLB全 板 電 鍍(PANEL PLATING)銅 面 防 氧 化 處 理(O S P(Entek Cu 106A)外 層 製 作(OUTER-LAYER)TENTINGPROCESS鍍 金 手指(G/F PLATING)

6、鍍 化 學 鎳 金(E-less Ni/Au)For O.S.P.選 擇 性 鍍 鎳 鍍 金(SELECTIVE GOLD)印 文 字(SCREEN LEGEND )網 版 製 作(STENCIL)圖 面(DRAWING)工 作 底 片(WORKING A/W)製 作 規 範(RUN CARD)程 式 帶(PROGRAM)鑽 孔,成 型 機(D.N.C.)底 片(MASTER A/W)磁 片,磁 帶(DISK,M/T)藍 圖(DRAWING)資 料 傳 送(MODEM,FTP)A O I 檢 查(AOI INSPECTION)除 膠 渣(DESMER)通 孔 電 鍍(E-LESS CU)DOU

7、BLE SIDE前處理(PRELIMINARY TREATMENT)前處理(PRELIMINARY TREATMENT)前處理(PRELIMINARY TREATMENT)全面鍍鎳金(S/G PLATING)雷 射 鑽 孔 (LASER ABLATION)Blinded Via顯 影(DEVELOPIG)1PCB Manufacturing Process introduction顧顧 客客CUSTOMER裁裁 板板LAMINATE SHEAR業業 務務SALES DEP.生生 產產 管管 理理P&M CONTROLMASTER A/W底 片 DISK,M/T磁 片磁 帶藍 圖DRAWING資

8、料傳送MODEM,FTP網版製作STENCIL DRAWING圖 面RUN CARD製作規 範PROGRAM程 式 帶鑽孔,成型機D.N.C.工工 程程 製製 前前FRONT-END DEP.工作底片WORKING A/W(1)Front-end Process(Tooling)2PCB Manufacturing Process introduction(2)多多 層層 板板 內內 層層 製製 作作 流流 程程曝 光EXPOSURE 壓 膜LAMINATION前 處 理 PRELIMINARYTREATMENT去 膜STRIPPING 蝕 銅ETCHING顯 影 DEVELOPING黑化處理

9、 BLACK OXIDE烘 烤BAKINGLAY-UP 預疊板及疊板後 處 理 POST TREATMENT壓 合LAMINATION內層乾膜內層乾膜INNERLAYER IMAGE預疊板及疊板預疊板及疊板LAY-UP 蝕蝕 銅銅I/L ETCHING鑽鑽 孔孔DRILLING壓壓 合合LAMINATION多層板內層流程 INNER LAYER PRODUCTMLBAO I 檢檢 查查AOI INSPECTION裁裁 板板LAMINATE SHEARDOUBLE SIDE雷雷 射射 鑽鑽 孔孔LASER ABLATIONBlinded Via裁板初初 裁裁破靶捞边3PCB Manufactur

10、ing Process introduction通通 孔電鍍孔電鍍P.T.H.鑽鑽 孔孔DRILLING外外 層層 乾乾 膜膜OUTERLAYER IMAGE二次銅及錫鉛電鍍二次銅及錫鉛電鍍PATTERN PLATING檢檢 查查 INSPECTION 前 處 理 PRELIMINARYTREATMENT二次銅電鍍PATTERN PLATING蝕 銅 ETCHING全板電鍍全板電鍍PANEL PLATING外 層 製 作OUTER-LAYERO/L ETCHING蝕蝕 銅銅TENTINGPROCESSDESMER除膠 渣 E-LESS CU通孔電鍍 前 處 理 PRELIMINARYTREAT

11、MENT剝 錫 鉛 T/L STRIPPING去 膜STRIPPING 壓 膜LAMINATION錫鉛電鍍T/L PLATING曝 光EXPOSURE(3)Outer Layer Process Flow顯 影 DEVELOPING4PCB Manufacturing Process introduction液態防焊液態防焊LIQUID S/M 外觀檢外觀檢 查查VISUAL INSPECTION 成成 型型FINAL SHAPING檢檢 查查 INSPECTION 電電 測測ELECTRICAL TEST 出貨前檢查出貨前檢查O Q C 包包 裝裝 出出 貨貨PACKING&SHIPPING

12、 塗佈印刷 S/M COATING前 處 理 PRELIMINARY TREATMENT曝 光EXPOSUREDEVELOPING顯 影POST CURE後 烘 烤預 乾 燥 PRE-CURE噴噴 錫錫HOT AIR LEVELING銅面防氧化處理O S P(Entek Cu 106A)HOT AIR LEVELING G/F PLATING鍍金手指鍍化學鎳金E-less Ni/AuFor O.S.P.印印 文文 字字SCREEN LEGEND 選擇性鍍鎳鍍金SELECTIVE GOLD (4)Surface Finished&Final Inspection全面鍍鎳金GOLD PLATING

13、5PCB Manufacturing Process introductionTypical PCB Manufacturing Process 1.（基板）THIN CORE2.（压膜）Dry Film Resist CoatEtch Photoresist Etch Photoresist(D/F)D/F)LaminateCopper Foil6PCB Manufacturing Process introductionTypical PCB Manufacturing Process4.（显影）Develop3.（曝光）ExposeA/W(Photo Tools)A/W(Photo To

14、ols)7PCB Manufacturing Process introductionTypical PCB Manufacturing Process 5.（蚀刻）Etch6.（剥膜）Strip Resist8PCB Manufacturing Process introductionTypical PCB Manufacturing Process7.（叠合）Lay-up8.（压合）LaminationLAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 69PCB Manufacturing Process introductionTypical PCB Ma

15、nufacturing Process9.（钻孔）Drilling(Primary)10.（PTH&镀铜）PTH&Copper Deposition10PCB Manufacturing Process introductionTypical PCB Manufacturing Process11.（外层压膜）Dry Film Lamination(Outer layer)12.（曝光）Expose11PCB Manufacturing Process introductionTypical PCB Manufacturing Process13.（显影）Develop14.（镀二铜）Patt

16、ern Plating12PCB Manufacturing Process introductionTypical PCB Manufacturing Process15.（镀锡铅）Tin Plating16.（剥膜）Film Stripping13PCB Manufacturing Process introductionTypical PCB Manufacturing Process15.（蚀刻）Etch16.（剥锡铅）Tin Stripping 14PCB Manufacturing Process introductionTypical PCB Manufacturing Proc

17、ess18.（表面处理）Surface Finished(Electroless Ni/Au,HAL)17.（防焊）Solder Mask(Spray Coating)15PCB Manufacturing Process introductionLay-up Structure.COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core,FR-4Thin Core,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core,FR-4Thin Core,FR-4prepreg prepreg C

18、OPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZCaul PlateCaul PlateCaul PlateCaul Plate10-12 10-12 BookingBookingHot PressHot PressHot PressHot PressCOPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core,FR-4Thin Core,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core,FR-4Thin Core,FR-4prepreg prepreg COPPE

19、R FOIL 0.5 OZCOPPER FOIL 0.5 OZCaul PlateCaul PlateCaul PlateCaul Plate16PCB Manufacturing Process introduction1.1.下料裁板下料裁板 Laminate ShearLaminate Shear (Panel Size)Panel Size)COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.2.內層板壓乾膜內層板壓乾膜 Dry Film Resist Coat Dry Film Resist Co

20、at(Inner Layers)(Inner Layers)17PCB Manufacturing Process introduction3.3.曝光曝光 ExposeExpose 4.4.曝光後曝光後 After ExposeAfter Expose ArtworkArtworkArtworkArtworkPhoto ResistPhoto ResistUV Light18PCB Manufacturing Process introduction5.5.內層板顯影內層板顯影 DevelopDevelop Photo ResistPhoto Resist 6.6.酸性蝕刻酸性蝕刻 Powe

21、r/GroundPower/Ground/SignalSignal (Etch)(Etch)Photo ResistPhoto Resist19PCB Manufacturing Process introduction8.8.黑化黑化 Oxide TreatmentOxide Treatment 7.7.去乾膜去乾膜 Strip ResistStrip Resist 20PCB Manufacturing Process introduction9.9.疊板疊板 Lay-upLay-up Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Lay

22、er 4Copper FoilCopper FoilInner LayerPrepregPrepreg21PCB Manufacturing Process introduction10.10.壓合壓合 LaminationLamination11.11.鑽孔鑽孔 (Drill&Deburr)Drill&Deburr)(P.T.H.&P.T.H.&Blind Via)Blind Via)Back-UpEntry Material22PCB Manufacturing Process introduction12.12.鍍通孔及一次電鍍鍍通孔及一次電鍍 Desmear&Copper Deposi

23、tionDesmear&Copper Deposition13.13.外層壓膜外層壓膜 D/F Photo Resist CoatD/F Photo Resist CoatPhoto Resist23PCB Manufacturing Process introduction14.14.外層曝光外層曝光 Expose(Outer-Layer)Expose(Outer-Layer)15.15.曝光後曝光後 After ExposeAfter ExposeUV24PCB Manufacturing Process introduction16.16.外層顯影外層顯影 DevelopDevelop1

24、7.17.線路蝕刻線路蝕刻(酸性蝕刻酸性蝕刻)(Etch)Etch)25PCB Manufacturing Process introduction18.18.去乾膜去乾膜 Strip ResistStrip Resist19.19.防焊防焊 Solder Mask CoatSolder Mask Coat26PCB Manufacturing Process introduction20.20.防焊曝光防焊曝光 ExposeExpose21.21.顯影顯影 DevelopDevelopUVS/M A/W27PCB Manufacturing Process introduction22.22

25、.文字文字 Legend(Silk Screen)Legend(Silk Screen)23.23.噴錫噴錫(浸金浸金)HAL,Immersion goldHAL,Immersion goldR105WWEI94V-0R105WWEI94V-028PCB Manufacturing Process introduction Positive-Acting(working)Positive-Acting(working)29PCB Manufacturing Process introduction Negative-Acting(working)Negative-Acting(working)3031