SMT元器件知识37690.pptx

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1、元器件知识SMT元器件参照GVC品质检验规范制作人：陈生1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.All the leads footprint is centered on the lands理想状况Target ConditionW SXX1/2W S S5mil5mil 1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil)1.The length of the lead footprint shifted off the land(X)shall less 1/2

2、 width of lead2.The clearance(S)between lead shifted off and land shall over 5 mil允收状况1 Accept Condition拒收状况1 Reject Condition X1/2W S S5mil5mil1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil)3.Whichever is rejected.1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.The le

3、ad had shifted and footprint not over the end of land允收状况2 Accept Condition拒收状况2 Reject Condition 已超過焊墊側端外緣已超過焊墊側端外緣1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI)理想状况Target ConditionTX1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.All the leads footprint is centered on the land

4、s允收状况3 Accept ConditionT X TT 1.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.The lead had shifted the length from lead heel to end of land(X)shall be over the thickness of land(T)TXT1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳厚度(XT)(MI)。拒收状况3 Reject ConditionSW1.各接腳都能座落在焊墊的中央，未發生偏滑。1.All the leads footprint is centered on the

5、 lands理想状况Target Condition1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)The lead had shifted off the land1.The length of lead shifted off the land(X)shall less 1/2 width of lead(W)2.The clearance distance between shifted lead and land edge shall over 5 milX1/2

6、WS5mil5mil允收状况4 Accept Condition拒收状况4 Reject ConditionS1/2W1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whichever is rejected.理想状况Target Condition1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.conc

7、ave fillet between land and lead3.the shape(profile)of lead be clearly visible允收状况5 Accept ConditionLX=2/3Lh1/2TT1.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳長的2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角需90度。1.Width of solder fillet between lead and land(X)shall over 2/3 lead footprint(L)2.Minimum solder

8、fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle 90on heel拒收状况5 Reject ConditionLX2/3Lh1/2TT1.引線腳的底邊與板子焊墊間的銲錫帶不足涵蓋引線腳長的2/3L。2.腳跟(Heel)焊錫帶涵蓋高度 h小於零件腳1/2厚度(h1/2T)。3.腳跟(Heel)沾錫角90度。(MI)4.Whichever is rejected.理想状况Target Condition1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。

9、1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible允收状况6 Accept Condition 1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Good solder flow up and concave fillet between land and lead2.Concave solder fille

10、t between side face of lead and land3.The shape(profile)of lead(footprint)be clearly visible拒收状况6 Reject Condition1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whichever is rejected.1.solder flow cover the end(TIP)of lead2.The shape(profile)of lead not be visible clearly3.Whichever is rejected理想状况Target Con

11、ditionAT B 1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact h 1/2T允收状况7 Accept Condition1.焊錫帶存在於引線的三側2.焊

12、錫帶涵蓋引線彎曲處兩側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up on the lead angle(h)shall over 1/2 angle height(T)拒收状况7 Reject Condition h1/2T1.焊錫帶存在於引線的三側以下(MI)。2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h1/2T)(MI)。3.Whichever is rejected.1.Solder concave fillet is less 3 face2.Height of

13、 solder flow-up on the lead angle(h)under 1/2 angle height(T)3.Whichever is rejected理想状况Target Condition ABDC1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.Solder flow up to the center between B,C point on the heel of lead允收状况8 Accept Condition 1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder

14、 flow up to B point on the heel拒收状况8Reject Condition1.腳跟的焊錫帶延伸到引線上彎曲處的底部(B)，延伸過高，且沾錫角超過90度，才 拒收(MI)。1.Solder flow up over(cross)B point and the wetting angle over 90 degree 沾錫角超過沾錫角超過90度度理想状况Target ConditionAB 1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet

15、on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact允收状况9 Accept Condition1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solder flow up to top of lead angle and not touch the body2.Shape(profile)of l

16、ead angle can be visible clearly拒收状况9Reject Condition1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whichever is rejected.1.Solder had touched the body2.Shape(profile)of lead angle can not be visible clearly3.Excess solder on the side of solder land理想状况Target Condition T 1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/

17、3T以上。2.錫皆良好地附著於所有可 焊接面。1.Solder flow up from land(bottom of component solder termination to the 2/3 Height of component(T)2.Good solder fillet on the all solder able terminations(face)允收状况10 Accept Condition h1/4 T X1/4 T 1.焊錫帶延伸到晶片端電極高度的25%以上。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4 comp

18、onent height be fillet by solder at least2.Solder flow spread on the land shall 1/4 width of component height at least,(Count from tip of component)拒收状况10Reject Conditionh1/4 TX1/4 T1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whichever is rejected.理想状况Target Condit

19、ion1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。2.錫皆良好地附著於所有可焊接面。1.Solder flow up from land(bottom of component solder termination to the 2/3 Height of component(T)2.Good solder fillet on the all solder able terminations(face)T允收状况11 Accept Condition h1/4 TX1/4 T拒收状况11Reject ConditionX1/4 Th 10mil 不易被剝除者不易被剝除者L 1

20、0mil1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長度L10mil。(D,L10mil)(MI)且Lmax判定拒收(MI)。5.Whichever is rejected.1.Protrusion lead can not be visible2.Protrusion lead out of spec(include Lmin or Lmax)3.Lead bend/missing/no-through4.Special spec of protrusion lead out of spec(Lmax)5.Whichever is rejected理想状况Target Condit

21、ion +1.零件平貼於機板表面。2.浮高判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating height is measured from face of PCB substrate to the lowest point of component允收状况17 Accept Condition傾斜傾斜/浮高浮高Lh2.0 2.0 mm傾斜傾斜Wh2.0 2.0 mm1.量測零件基座與PCB零件面之最大距離須2.0mm。(Lh2.0

22、mm)2.零件腳未折腳與短路。3.臥式COIL之Lh2mm.Wh2mm)不受第1點之限制1.The height of the component body above the land“Lh”is 2.0mm maximum2.No leads be shorted or bended of component3.Coil floating be specified to 2mm maximum拒收状况17 Reject Condition傾斜傾斜/浮高浮高Lh2.0 mm傾斜傾斜Wh2.0 mm1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Lh2.0mm)2.零件腳折腳、未

23、入孔、缺件等缺點影響功能(MA)。3.臥式COIL之Lh或Wh2mm判定拒收(MI)。4.Whichever is rejected 理想状况Target Condition1.單獨跳線平貼於機板表面。2.固定用跳線不得浮高,跳線需平貼零件。1.Jumper wire lay flat and touch the board2.Jumper wire used for fixing component shall touch the component body允收状况18 Accept ConditionLh1.0 1.0 mmWh1.0 1.0 mmX1.0mmY1.0mmZ0.8mmZ1

24、.單獨跳線Lh,Wh1.0mm。2.被固定零件浮高1.0mm 。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm。(X1.0mm)4.固定用跳線浮高Z0.8mm(被固定零件平貼於PCB時)1.The height of jumper wire above the land is 1.0mm Maximum2.Jumper wire used for fixing component is 0.8mm maximum3.The shift length of reflection of jumper wire used for fixing component on t

25、he board is 1.0mm maximum measuring from the edge of PTH4.The height of jumper wire above the component is 0.8mm maximum since component lay flat拒收状况18 Reject ConditionLh1.0 1.0 mmWh1.0 1.0 mmX1.0mmY1.0mmZ0.8mmZ1.單獨跳線Lh,Wh1.0mm(MI)。2.被固定零件浮高1.0mm(MI)。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm(MI)。(X1.0mm

26、)4.固定用跳線浮高Z0.8mm(被固定零件平貼於PCB時)(MI)5.Whichever is rejected 理想状况Target ConditionCARDabcd1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為量測依據。2.機構零件基座平貼PCB零件面，無浮高傾斜。(a,b,c,d四點平貼於PCB）。1.The floating height is measure from face of PCB substrate to the lowest point of component2.The base of constructive component shall tou

27、ch the face of PCB substrate(a,b,c,d point touch PCB)允收状况19 Accept ConditionCARDLh0.8mmabcd1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高0.8mm。(Lh 0.8mm)2.錫面可見零件腳出孔3.無短路。1.The height of component short axis side above the land is 0.8mm maximum2.Lead protrusion can be identified on solder side3.No solder bridge拒收状况19

28、Reject ConditionLh0.8mmCARDabcd1.短軸a,b兩點平貼PCB或垂直上浮,但c,d兩點浮高0.8mm(MI)。(Lh 0.8mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected.Thank You!谢谢观看/欢迎下载BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES.BY FAITH I BY FAITH