【企业管理课程】-新产品开发整体流程介绍.pptx

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1、1Presentation TitleC-System Introduction will coverRole&Responsibility(R&R)ProcessCx Stage:C0:Proposal phase 构想阶段C1:Planning phase 规划阶段C2:R&D Design phase 设计时间C3:Lab Pilot Run phase 样品试作阶段C4:Eng Pilot Run phase 工程试作阶段C5:PD Pilot Run phase 试产阶段C6:Mass Production phase 量产阶段2Presentation TitleRole&Resp

2、onsibilityFunctionResponsibilityPM产品经理-Product Manager(或计划项目经理-Project Manager)为所负责计划或产品线成败之总负责人,将依产品线之性质指定专人负责某类产品,必须对所负责产品线专业领域之发展及营销双方面皆有相当程度的了解.并依照产品之条件及市场状况,做适当的运用,订定技术或产品市场竞争策略,并在适当的时机推出适当之技术或产品.TMTM is responsible to coordinate technical issues conflict among HW,SW,ID and ME and decision-maki

3、ng.TM has to handle all project technical issues.PCC为规划推广、连络及控制项目进行的负责人,掌握项目进行之情况以协助处理异常状况,使新产品能顺畅切入工厂且如期推出,以提高产品竞争力.协助 R&D RELEASE 开发阶段 BOM CHANGE NOTICE.R&DR&D 包括电子部门及工业设计部门,若只写 HW(Hardware Design)则指电子部门,若只写 ID(INDUSTRIAL DESIGN)则指工业设计部门;包括ME,Thermal,Packing design.若只写 SW(Software design)则指软件设计部门有

4、负责 BIOS,Driver 及 Pre-load 不同工作性质之软件开发功能.R&D 人员负责产品之开发、设计、测试规划，包括 H/W、S/W及ID的开发、设计、提出新发明及著作权揭露书.-Wistron Case3Presentation TitleRole&ResponsibilityFunctionResponsibilityHW(Hardware Design)*Hardware is responsible for Electronic Engineering Design*Co-works with S/W and QT to make sure that the every f

5、unction works well according to spec.*H/W should conduct technical transfer to PE.*H/W should input,update,and maintain the bugs/issues information in the bug tracking system.SW(Software Design)*Software is responsible for the design of BIOS,Driver,Utilities,and S/W Preload.*S/W co-works with H/W an

6、d QT to make sure that every function works well according to the specification.*S/W has to release the SCD and the Cert.Team Document.*S/W should conduct technical transfer to TE.*S/W has to input/update/maintain the bugs/issues information in the bug tracking system.ID/ME(Industrial Design/Mechani

7、cal Engineering)*ID/ME is responsible for Mechanical Engineering,Thermal and Packing designs.*ID/ME should conduct technical transfer to PME.*ID/ME should input,update,and maintain the bugs/issues information in the bug tracking system used.-Wistron Case4Presentation TitleRole&ResponsibilityFunction

8、ResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OS Certification)为产品保证暨开发支持Function之总称,主要负责根据 MRS/PES 执行各项产品之测试,诸如 EMC/Safety:REGULATORY TEST,CE:RELIABILITY TEST 及 KEY COMPONENT APPROVAL,PCB:PCB LAYOUT,DC:BOM,OS:OS 认证 etc;EMC/SafetyAll products to meet EMC/Safety requirements and guarantee the leg

9、ality in the international marketing.申请产品之安规、测试、Debug.QT为R&D辖下所属之测试单位人员,主要负责各项产品之测试,诸如COMPATIBILITY TEST,SOFTWARE TEST,S/W PRELOAD TEST,DIAGNOSTIC PROGRAM TEST,ETC.,CE/Reliability组件承认测试、不良品故障分析及其他附件等材料质量之管制及保证 产品相关之可靠度与环境实验，以及可靠度工程之研究与制定.PCBPCB Layout之申请、PCB之设计、Orcad library&Mentor library的建立与管理.信号品

10、质CAE分析,PCB layout外包厂商之管理，PCB制造厂商之管理.OS Certification执行公司各产品之 OS 兼容性认证测试及 LOGO 申请.O.S.Beta Site 测试 PDM料号编码及控管,BOM制作-Wistron Case5Presentation TitleRole&ResponsibilityFunctionResponsibilityAM(Account Manager)1.争取订单与客户合约协商.2.协调产品SPEC.工程变更 SAMPLE APPROVAL.3.适时反应市场需求与趋势.MM(Material Management)1.MM is res

11、ponsible for new supplier development,parts purchasing2.Controlling mechanical tooling status including the schedule,capacity,parts readiness,concerns3.Manage the dependencies,long lead-time items.4.MM also co-works with SQM and CE for component quality improvement and the key component QVL final ve

12、rsionSQM(Supplier Quality Management)*零件质量管理及参与分包商之评鉴/管理(SQRC Plan/Status)*负责异常材料分析、追踪与改善.*负责进行产品 QVL CANDIDATE APPROVAL 操作系统 AT mfg.GCSD1.开发及推动全球客户服务及支持计划.2.各项售后服务及支持作业.3.参与 Field 质量改善作业(EWG)FI负责评估 Project Cost,决定 Project 是否可行以及 Project 所花费之 Cost.Legal合约及专利审核-Wistron Case6Presentation TitleRole&Res

13、ponsibilityFunctionResponsibilityCFECFE acts on behalf of Wistron global manufacturing operation to deal with the customer,and also acts as a representative of the customer when dealing with internal Wistron teams.Based on the C4/C5 checklist,related reports and project status,CFE is responsible to

14、conclude the exit judgment(Ready or Not ready)during C4/C5 Exit meetings to determine whether a product can move on to PD pilot run/MP or notNPI1.负责规划、协调、整合与提供各 Site制造所需相关信息与技术数据2.协调安排新产品转移至海外生产工厂 3.协调处理海外生产工厂发生之生产相关问题 PE/PME1.产品设计审查,产品问题之发觉及产品移交.2.协助生产良率提升,克服生产瓶颈,提高生产力.3.协助订定制造规格及引进新的制作技术,进行改善以确保产品

15、质量.IE1.设计及管理一个高效率的整合制造系统.2.消除浪费、杜绝不合理，提高生产力 3.生产流程规划、制程改善、标准工时制定 QA1.执行制程及产品之检验并反应质量报告请相关单位改善质量 2.收集及处理市场及客户质量回馈数据反应相关单位改善质量 3.协助工程单位必要之验证测试.4.建立PCBA,Final Assembly之检验标准QE1.执行 DQA.FDI,MTBF,ORT Test2.执行产品开发过程之可靠度及环境测试(C4)3.协助工程测试验证 4.质量工程问题分析与解决 -Wistron Case7Presentation TitleRole&ResponsibilityFunc

16、tionResponsibilityPD(Production)PD has to work with PE,PME and IE respectively to get testing equipment&tools,assembly tools,and SOP ready before C5 Exit.PD is responsible to produce the product.PD is not just for efficiency only but also quality.PSE(Process Engineer)PSE is responsible for SMT proce

17、ss and for releasing the SMT pilot run report.PSE is also responsible for the process continuous improvement(CIP).FAE(Failure Analysis Engineer)or REFAE is responsible for issuing the failure analysis report and forwarding this to related departments for product quality improvement.FAE is also respo

18、nsible for preparing repair SOP if applicable.TETE is responsible for providing and maintaining Test Plan and Test Program.TE also implement all the preload to production line and report the problems related to preload to preload team.PMC/GPMC(Plan Material Control/Global Plan Material Control)GPMC/

19、PMC is responsible for product fulfillment,final shipping model,supply site and capacity plan,and ramp up plan for all sites.-Wistron Case8Presentation TitleWistron C-System Quality ControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngineeringPilot-runPhaseProductionPilot-runPhaseMassP

20、roductionPhaseC0C1C2C3C4C5CheckPointWistron C-PhaseNPIFDI/MTBFDQA/PQC/FQC Compatibility/Diagnostic-Simulation Test-Layout&drawing-Signal Integrity-DFX Check-AVL-C-Test Plans Reliability/Stress EMI/Safety OS&Pre-LoadWIH/WPH/WZS/WKS-MRS Check-Service Cost Estimate-Simulation-Design Peer Review-Lessons

21、 LearnedAvailabilityDevelop PlanLaunch FAI&SPCMTBF DemoCIP/CLCAPareto AnalysisEWG ReadyAFRTest ReportsPre-QVL ReadyDiagnostics ProgramBug List&ActionDCN/ECN/ECR FAI report PFMEASQRCTrainingMTBF ReviewQMP/QPA/QSAFPYRPPAPServiceability DesignTest PlansIntegrate Design Review Signal QualityDFX IndexIni

22、tial Supplier AuditMemorandumDFMEASimulationMTBF EstimateMVPConcept/ProposalMRS Definition ScopeSCEInvestigation&ProposalDesign&SourcingIntegrationValidationReleaseProduct Life CycleMDRR/C4MDRR/C4Go/No Go?Go/No Go?MRR/C5MRR/C5Go/No Go?Go/No Go?C6OOB/OBAORT/StressEWG/FQHAFR/DOA9Presentation TitleNew

23、C System ArchitectureProgressC0 ExitC0 ActivityC0 EntryC1 ExitC1 ActivityC1 EntryC2 ExitC2 ActivityC2 EntryC3 ExitC3 ActivityC3 EntryC4 ExitC4 ActivityC4 EntryC5 ExitC5 ActivityC5 EntryC6 ExitC6 ActivityC6 EntryTimeDetail ActivitiesSubjectScopeDefinitionProcedure.Activities DefinitionRecord&ReportFo

24、rmat DefinitionEscalation RuleMeasurementStandardProject Management&System Maintenance10Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5

25、meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report(prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus&bug list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/Diagnosti

26、cRelease EE Eng.P/R report SMT WS P/R reportPCBA WS P/R reportME Eng.P/R reportEng.P/R QA review reportSchematics&jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts

27、 listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPMC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon

28、QVL/Sampleapproval request formC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout(prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC0 ChecklistMRSC0/PM C0 Meeting11Presentation Title阶段 C0构想阶段(Proposal Phase)负责单位 计划经理(Project Manager

29、)或产品经理(Product Manager)目的*确订提案构想或市场需求规格书(MRS)*可行性分析 工作重点 *相关提案之市场资料搜集*相关提案之关键技术资料搜集*R&D 提出技术可行性分析*PM 执行可行性及效益评估审核会议 C0目的 评估是否成立项目计划，进行研发 检核项目 计划提案书或市场需求规格书(MRS)C0-C0-工作重点及检核项目工作重点及检核项目12Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseE

30、ng.Pilot Run PhaseProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report(prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus&bug

31、list reviewC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng.P/R report SMT WS P/R reportPCBA WS P/R reportME Eng.P/R reportEng.P/R QA review reportSchematics&jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompat

32、ibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSC2 c

33、hecklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout(prel.)Outsourcing modulespecificationPMNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC1 checklistInventiondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval

34、 request formC1/PMC1 Meeting13Presentation TitleC1-C1-工作重点及检核项目工作重点及检核项目阶段 C1规划阶段(Planning Phase)负责单位 计划经理(Project Manager)或产品经理(Product Manager)目的*规格的拟订*项目组织的成立*项目时程的规划 工作重点 *选任技术经理(Technical Manager,简称TM)并成立项目组织*计划项目经理(Project Manager)或产品经理，规划项目时程*召开C1审核会议*法务确认Legal Concern、如Potential Patent List,

35、Invention Disclosure*成立项目团队 审核会议 C1目的 成立项目团队、确定开发时程 检核项目 Time ScheduleProject TeamInvention DisclosureGreen Design Check ListSample Request Form 14Presentation Title15Presentation TitleCase-bottle Coca in England开采铝矿开采铝矿一吨铝土提炼半吨氧化铝一吨铝土提炼半吨氧化铝半小时加工半小时加工半吨氧化铝熔炼成半吨氧化铝熔炼成1/4吨金属铝吨金属铝再加工二周成铝锭再加工二周成铝锭瑞典或梛威

36、瑞典或梛威熔炉工厂熔炉工厂澳大利亚澳大利亚澳大利亚澳大利亚化学还原工厂化学还原工厂加热至华氏加热至华氏900度度压延成压延成1/8 inch薄片薄片瑞典和德国瑞典和德国压延厂压延厂船运一个月船运一个月冷轧成冷轧成1/80 inch薄片薄片冷轧厂冷轧厂英国易拉罐厂英国易拉罐厂成型，清洗，烘干，防锈成型，清洗，烘干，防锈装填，印刷装填，印刷英国可乐厂英国可乐厂消费消费铝罐回收尽铝罐回收尽16%16Presentation TitleEcological Rucksack(生态包袱生态包袱)生产一片半导体芯片所产生之废料为产生产一片半导体芯片所产生之废料为产品重量之品重量之十万倍十万倍生产一台笔记本

37、电脑所产生之废料为产生产一台笔记本电脑所产生之废料为产品重量之品重量之四千倍四千倍生产一公升佛罗里达橘子汁需要生产一公升佛罗里达橘子汁需要两公升两公升汽油及一千公升之水汽油及一千公升之水生产一吨纸需用掉生产一吨纸需用掉九十八吨九十八吨之其他资源之其他资源 数据源数据源:绿色资本主义绿色资本主义 天下出版社天下出版社17Presentation TitleEU RoHS Directive指令期程指令期程2003.01.27 指令发布指令发布2003.02.13 欧盟公报发行欧盟公报发行,指令生效指令生效2004.08.13 转为会员国当地法律转为会员国当地法律,法规或行政指令法规或行政指令20

38、06.07.01 新投入之产品不得含有禁用物质新投入之产品不得含有禁用物质指令要求指令要求/禁用项目禁用项目铅铅(Pb)镉镉 (Cd)汞汞(Hg)六价铬六价铬(Cr6+)多溴联苯多溴联苯(PBB)多溴化二苯乙醚多溴化二苯乙醚(PBDE)(The restriction of the use of certain hazardous substances in electrical and electronic equipment)18Presentation TitleEU RoHS 管制规格管制规格SubstancesE.U.建议值Lead(Pb)铅;焊锡1000 PPMLead(Pb)铅;

39、塑料,线材,涂料1000 PPMCadmium(Cd)镉100 PPMMercury(Hg)汞1000 PPMHex.Chromium(Cr6+)六价铬1000 PPMPBB(聚溴联苯)1000 PPMPBDE(聚溴二苯醚)1000 PPM重金属：重金属：汞、铅、镉、六价铬汞、铅、镉、六价铬溴性耐燃剂：聚溴联苯溴性耐燃剂：聚溴联苯(PBBPBBs)s)、溴联苯醚溴联苯醚(PBDEPBDEs)s)注：另有注：另有管制规范外管制规范外的项目的项目19Presentation TitleEU WEEE DirectiveDirective 2002/96/ECDirective 2002/96/EC

40、期程期程2003.01.27 2003.01.27 指令发布指令发布2003.02.13 2003.02.13 欧盟公报发行，指令生效欧盟公报发行，指令生效2004.08.13 2004.08.13 转为会员国当地法律转为会员国当地法律,法规或行政指令法规或行政指令2005.08.13 2005.08.13 完成回收系统建构完成回收系统建构,制造商因应回收之制造商因应回收之 财务规划就绪财务规划就绪2006.12.31 2006.12.31 回收再利用率达每人每年回收再利用率达每人每年4 4kgkg2008.12.31 2008.12.31 订定下阶段目标订定下阶段目标回收回收Target o

41、f Recovery and RecyclingTarget of Recovery and Recycling(Waste Electrical and Electronic Equipment)WEEE Category LargehouseholdappliancesSmallhouseholdappliancesIT&telecommunicationsappliancesConsumerequipmentLightingequipmentElectricalandelectronictoolsToys,leisure&sportsequipmentMedicaldevicesMoni

42、toringandcontrolinstrumentsAutomaticdispensersRate of Recovery Rate of Recycling 80%75%70%50%75%65%75%65%70%50%70%50%70%50%*70%50%80%75%*Tobedeterminedby31December200620Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run Phas

43、eProduction Pilot run PhaseMass production phaseC2 meetingC3 meetingC4 meetingC5 meetingC3 checklistHW DV test reportSW FV test reportME test reportReliability test report(prel.)ME/Artwork/packing drawingPAL/ROM data listingC3 manufacturability review reportSample approvestatus&bug list reviewC4 che

44、cklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng.P/R report SMT WS P/R reportPCBA WS P/R reportME Eng.P/R reportEng.P/R QA review reportSchematics&jumper settingTest program/ProcedureSOP for PCBA/FAUser manual R/NPacking standardCompatibility test repo

45、rtReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMPMC0 meetingC1 meetingPM C0 ChecklistMRSPMC1 checklistInventi

46、ondisclosureTime scheduleProject teamModel number defineGreen design guide and reviewcheck listNon QVL/Sampleapproval request formNPIC0C1C2C3C4C5C6C6 meetingGCSDC6 checklistProduct phaseout noticeC2 checklistPESEMC/Safety Request FormBOM/QVL(Prel.)PCB Layout(prel.)Outsourcing modulespecificationC2/P

47、MC2 Meeting21Presentation TitleC2-C2-工作重点及检核项目工作重点及检核项目阶段 C2设计时间(R&D Design Phase)负责单位 技术经理(Technical Manager)研发部门 目的*软、硬件、机构设计*证实设计可行性*修正软、硬件、机构规格 工作重点 *电路设计并完成电路图*机构设计并完成机构设计图*机电整合设计并完成机电接口设计*软件设计并完成初步版本*电路设计Review*机构设计Review*机电整合设计Review*建立初步之测试计划(硬件、软件、机构)审核会议 C2目的*确定计划规格*检讨设计时间之工作成效*决定是否进入样品试作*

48、查核是否发出专利之申请 检核项目 Schematics(Preliminary)S/W SpecificationMechanical&ThermalTest PlanInvention Disclosure Invention Disclosure22Presentation TitleNew C System Product DevelopmentProposal PhasePlanning PhaseR&D Design PhaseLab Pilot Run PhaseEng.Pilot Run PhaseProduction Pilot run PhaseMass production

49、 phaseC2 meetingC3 meetingC4 meetingC5 meetingC4 checklistBOMQVLTime standardSystem BIOS/KBCFW releaseS/W Driver/AP/Utility/DiagnosticRelease EE Eng.P/R report SMT WS P/R reportPCBA WS P/R reportME Eng.P/R reportEng.P/R QA review reportSchematics&jumper settingTest program/ProcedureSOP for PCBA/FAUs

50、er manual R/NPacking standardCompatibility test reportReliability and C4 Reliability test reportKey Component verificationSpare parts listC5 checklistService Guide EMC Safety reportPD P/R yield rate analysis rptPCBA inspection instructionProduct inspection instructionMTBF DEMO test reportPMC0 meetin