计算机英文术语完全介绍.pdf
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1、(计算机)英文术语完全介绍二、英文术语完全介绍在每组术语中,我按照英文字母的排列顺序来分类。1、C PU 3DNow!(3D no waiting,无须等待的 3D 处理)AAM(AMD Analyst Meeting,AMD 分析家会议)ABP(Advanced Branch Prediction,高级分支预测)AC G(Aggressive C lock Gating,主动时钟选择)AIS(Alternate Instruction Set,交替指令集)ALAT(advanced load table,高级载入表)ALU(ArithmeticLogic Unit,算术逻辑单元)Alumin
2、um(铝)AGU(AddressGeneration Units,地址产成单元)APC (Advanced PowerC ontrol,高级能源控制)APIC (Advanced rogrammableInterrupt C ontroller,高级可编程中断控制器)APS(Alternate Phase Shifting,交替相位跳转)ASB(Advanced System Buffering,高级系统缓冲)ATC(Advanced Transfer C ache,高级转移缓存)ATD(AssemblyTechnology Development,装配技术发展)BBUL(BumplessBu
3、ild-Up Layer,内建非凹凸层)BGA(Ball Grid Array,球状网阵排列)BHT(branch prediction table,分支预测表)Bops(Billion Operations Per Second,10 亿操作/秒)BPU(Branch Processing Unit,分支处理单元)BP(Brach Pediction,分支预测)BSP(Boot Strap Processor,启动捆绑处理器)BTAC (Branch Target AddressC alculator,分支目标寻址计算器)C BGA(C eramic BallGrid Array,陶瓷球状网
4、阵排列)C DIP(C eramicDual-In-Line,陶瓷双重直线)C enter Processing UnitUtilization,中央处理器占用率 C FM(cubic feet perminute,立方英尺/秒)C MT(course-grainedmultithreading,过程消除多线程)C MOS(C omplementaryMetal Oxide Semiconductor,互补金属氧化物半导体)C MOV(conditional move instruction,条件移动指令)C ISC(C omplex Instruction Set C omputing,复杂
5、指令集计算机)C LK(C lock C ycle,时钟周期)C MP(on-chipmultiprocessor,片内多重处理)C MS(C ode MorphingSoftware,代码变形软件)co-C PU(cooperative C PU,协处理器)C OB(C ache on board,板上集成缓存,做在C PU卡上的二级缓存,通常是内核的一半速度)C OD(C ache onDie,芯片内核集成缓存)C opper(铜)C PGA(C eramic PinGrid Array,陶瓷针型栅格阵列)C PI(cycles perinstruction,周期/指令)C PLD(C o
6、mplex ProgrammableLogic Device,禊雄可程式化暹申苣元件)C PU(C enterProcessing Unit,中央处理器)C RT(C ooperativeRedundant Threads,协同多余线程)C SP(C hip ScalePackage,芯片比例封装)C XT(C hooper eXTend,增强形K6-2 内核,即 K6-3)Data Forwarding(数据前送)dB(decibel,分贝)DC LK(Dot C lock,点时钟)DC T(DRAMC ontroller,DRAM 控制器)DDT(Dynamic DeferredTrans
7、action,动态延期处理)Decode(指令解码)DIB(DualIndependent Bus,双重独立总线)DMT(DynamicMultithreading Architecture,动态多线程结构)DP(DualProcessor,双处理器)DSM(Dedicated Stack Manager,专门堆栈管理)DSMT(Dynamic SimultaneousMultithreading,动态同步多线程)DST(DepletedSubstrate Transistor,衰竭型底层晶体管)DTV(DualThreshold Voltage,双重极限电压)DUV(DeepUltra-Vi
8、olet,纵深紫外光)EBGA(Enhanced Ball GridArray,增强形球状网阵排列)EBL(electron beamlithography,电子束平版印刷)EC (Embedded C ontroller,嵌入式控制器)EDEC (Early Decode,早期解码)EmbeddedC hips(嵌入式)EPA(edge pin array,边缘针脚阵列)EPF(Embedded Processor Forum,嵌入式处理器论坛)EPL(electron projection lithography,电子发射平版印刷)EPM(Enhanced Power Management
9、,增强形能源管理)EPIC(explicitly parallel instruction code,并行指令代码)EUV(Extreme Ultra Violet,紫外光)EUV(extremeultraviolet lithography,极端紫外平版印刷)FADD(Floationg Point Addition,浮点加)FBGA(Fine-PitchBall Grid Array,精细倾斜球状网阵排列)FBGA(flipchipBGA,轻型芯片 BGA)FC-BGA(Flip-C hip Ball Grid Array,反转芯片球形栅格阵列)FC-LGA(Flip-C hip Land
10、 GridArray,反转接点栅格阵列)FC-PGA(Flip-C hip Pin GridArray,反转芯片针脚栅格阵列)FDIV(Floationg PointDivide,浮点除)FEMMS:Fast Entry/Exit MultimediaState,快速进入/退出多媒体状态FFT(fast Fouriertransform,快速热欧姆转换)FGM(Fine-GrainedMultithreading,高级多线程)FID(FID:Frequencyidentify,频率鉴别号码)FIFOC First Input First Output,先入先出队列)FISC (Fast Ins
11、truction Set C omputer,快速指令集计算机)flip-chip(芯片反转)FLOPs(Floating Point Operations Per Second,浮点操作/秒)FMT(fine-grained multithreading,纯消除多线程)FMUL(Floationg Point Multiplication,浮点乘)FPRs(floating-point registers,浮点寄存器)FPU(FloatPoint Unit,浮点运算单元)FSUB(Floationg PointSubtraction,浮点减)GFD(Gold finger Device,金手
12、指超频设备)GHC (Global History C ounter,通用历史计数器)GTL(Gunning Transceiver Logic,射电收发逻辑电路)GVPP(Generic Visual Perception Processor,常规视觉处理器)HL-PBGA:表面黏著,高耐热、轻薄型塑胶球状网阵封装 HTT(Hyper-Threading Technology,超级线程技术)Hz(hertz,赫兹,频率单位)IA(IntelArchitecture,英特尔架构)IAA(Intel ApplicationAccelerator,英特尔应用程序加速器)IC U(Instructi
13、onC ontrol Unit,指令控制单元)ID(identify,鉴别号码)IDF(Intel Developer Forum,英特尔开发者论坛)IEU(Integer Execution Units,整数执行单元)IHS(Integrated Heat Spreader,完整热量扩展)ILP(Instruction Level Parallelism,指令级平行运算)IMM:Intel Mobile Module,英特尔移动模块 InstructionsC ache,指令缓存 Instruction C oloring(指令分类)IOPs(Integer Operations Per S
14、econd,整数操作/秒)IPC(Instructions Per C lock C ycle,指令/时钟周期)ISA(instruction set architecture,指令集架构)ISD(inbuilt speed-throttling device,内藏速度控制设备)ITC (Instruction Trace C ache,指令追踪缓存)ITRS(International Technology Roadmap forSemiconductors,国际半导体技术发展蓝图)KNI(KatmaiNew Instructions,Katmai 新指令集,即 SSE)Latency(潜伏
15、期)LDT(Lightning Data Transport,闪电数据传输总线)LFU(Legacy Function Unit,传统功能单元)LGA(landgrid array,接点栅格阵列)LN2(Liquid Nitrogen,液氮)Local Interconnect(局域互连)MAC(multiply-accumulate,累积乘法)mBGA(Micro Ball GridArray,微型球状网阵排列)nm(namometer,十亿分之一米/毫微米)MC A(machine check architecture,机器检查体系)MC U(Micro-C ontroller Unit,
16、微控制器单元)MC T(Memory C ontroller,内存控制器)MESI(Modified,Exclusive,Shared,Invalid:修改、排除、共享、废弃)MF(MicroOps Fusion,微指令合并)mm(micron metric,微米)MMX(MultiMedia Extensions,多媒体扩展指令集)MMU(Multimedia Unit,多媒体单元)MMU(MemoryManagement Unit,内存管理单元)MN(model numbers,型号数字)MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)MHz
17、(megahertz,兆赫)mil(PC B或晶片怖局的艮度军位,1 mil二千分之一英寸)MIPS(Million Instruction Per Second,百万条指令/秒)MOESI(Modified,Owned,Exclusive,Shared or Invalid,修改、自有、排除、共享或无效)MOF(Micro Ops Fusion,微操作熔合)Mops(Million Operations Per Second,百万次操作/秒)MP(Multi-Processing,多重处理器架构)MPF(Micro processor Forum,微处理器论坛)MPU(Microproces
18、sor Unit,微处理器)MPS(MultiProcessorSpecification,多重处理器规范)MSRs(Model-SpecificRegisters,特别模块寄存器)MSV(MultiprocessorSpecification Version,多处理器规范版本)NAOC(no-account OverC lock,无效超频)NI(Non Intel,非英特尔)NOP(no operation,非操作指令)NRE(Non-Recurring Engineering charge,非重性工程费用)OBGA(Organic Ball Grid ArraL 有机球状网阵排列)OC P
19、L(Off C enter Parting Line,远离中心部分线队列)OLGA(Organic Land Grid Array,有机平面网阵包装)OoO(Outof Order,乱序执行)OPC (Optical Proximity C orrection,光学临近修正)OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)OPN(Ordering Part Number,分类零件号码)PAT(Performance Acceleration Technology,性能加速技术)PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)PD
20、IP(Plastic Dual-In-Line,塑料双重直线)PDP(Parallel Data Processing,并行数据处理)PGA(Pin-Grid Array,引脚网格阵列),耗电大 PLC C (PlasticLeaded C hip C arriers,塑料行间芯片运载)Post-RISC (加速 RISC,或后 RISC)PR(Performance Rate,性能比率)PIB(Processor In a Box,盒装处理器)PM(Pseudo-Multithreading,假多线程)PPGA(Plastic PinGrid Array,塑胶针状网阵封装)PQFP(Plas
21、tic Quad FlatPackage,塑料方块平面封装)PSN(Processor Serialnumbers,处理器序列号)QFP(Quad Flat Package,方块平面封装)QSPS(Quick Start Power State,快速启动能源状态)RAS(Return Address Stack,返回地址堆栈)RAW(Read after Write,写后读)REE(Rapid ExecutionEngine,快速执行引擎)Register C ontention(抢占寄存器)Register Pressure(寄存器不足)Register Renaming(寄存器重命名)Re
22、mark(芯片频率重标识)Resourcecontention(资源冲突)Retirement(指令引退)RISC(Reduced Instruction Set C omputing,精简指令集计算机)ROB(Re-Order Buffer,重排序缓冲区)RSE(registerstack engine,寄存器堆栈引擎)RTL(Register TransferLevel,暂存器斡换眉。硬it描述 言的一槿描述眉次)SC 242(242-contact slot connector,242 脚金手指插槽连接器)SE(Special Embedded,特别嵌入式)SEC (SingleEdge
23、 C onnector,单边连接器)SEC C (Single Edge C ontactC artridge,单边接触卡盒)SEPP(Single Edge ProcessorPackage,单边处理器封装)Shallow-trench isolation(浅槽隔离)SIMD(Single Instruction Multiple Data,单指令多数据流)SiO2F(Fluorided Silicon Oxide,二氧氟化硅)SMI(System Management Interrupt,系统管理中断)SMM(System Management Mode,系统管理模式)SMP(Symmet
24、ric Multi-Processing,对称式多重处理架构)SMT(Simultaneous multithreading,同步多线程)SOI(Silicon-on-insulator,绝缘体硅片)SOIC (PlasticSmall Outline,塑料小型)SONC (System on a chip,系统集成芯片)SPGA(Staggered Pin Grid Array 交错式针状网阵封装)SPEC (System Performance EvaluationC orporation,系统性能评估测试)SQRT(Square RootC alculations,平方根计算)SRQ(S
25、ystem Request Queue,系统请求队列)SSE(Streaming SIMD Extensions,单一指令多数据流扩展)SFF(Small form Factor,更小外形格局)SS(Special Sizing,特殊缩放)SSP(Slipstreamprocessing,滑流处理)SST(Special Sizing Techniques,特殊筛分技术)SSOP(Shrink Plastic Small Outline,缩短塑料小型)STC (Space Time C omputing,空余时间计算)Superscalar(超标量体系结构)TAP(Test AccessPor
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