J-STD-033D 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用(中文版).docx

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1、J-STD-033D(中文版)潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用1 FOREWORD/前言The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as cracks and delamination from the solder reflow process. This document describes the standardized levels of floor-life ex

2、posure for moisture/reflow sensitive SMDs along with the handling,packing and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020,J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.SMD 零件的出现直接带来了一类

3、新的质量和可靠性问题，涉及回流焊过程中的“裂纹和分层”等损伤。本文件描述了对潮气/回流敏感的smd 的现场寿命(裸露寿命)暴露的标准化水平，以及为避免潮气/回流相关故障所必需的处理、包装和运输要求。配套文件J-STD-020、J-STD-075和JEP113 分别定义了分类程序和标签要求。For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to p

4、rinted circuit boards (PCBs) expose the entire package body to temperatures higher than 200 During solder reflow, the combination of rapid moisture expansion,materials mismatch, and material interface degradation can result in cracking and/ or delamination of critical interfaces within the device.对于

5、湿度敏感器件，水气会通过包装材料渗透到包装内部，并在不同材料的表面聚结。在组装工艺中， SMD 元件贴装在 PCB 上时会经历超过200的高温，在焊接时因湿气的膨胀会造成一系列的焊接品质问题。Typical solder reflow processes of concern for all devices are convection, convection/ IR, infrared (IR), vapor phase( VPR), hot air rework tools, and wave solder, including full immersion.所有器件所关注的典型回流焊工艺

6、包括对流、对流/IR、 红外 (IR)、 气相 (VPR)、 热风返工工具和波峰焊，包括全浸焊。Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity, flux sensitivity or cleaning process sensitivity.非半导体器件可表现出超过湿度敏感性的额外工艺敏感性，例如热敏感性、熔解敏感性或清洁工艺 敏感性。1.1 Purpose /目的The purpose

7、of this document is to provide manufacturers users with standardized methods for handling,packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture ab

8、sorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved.The dry-packing process defined herein provides a minimun shelf life of 12 months from the seal date.本文旨在为制造商和用户提供处理、包装、运输和

9、使用已分类为J-STD-020或J-STD-075 中定义的潮气/回流和工艺敏感器件的标准化方法。提供这些方法是为了避免因吸湿和暴露，在回流焊过程因温 度变化而造成的损坏，这可能导致产量和可靠性下降。通过使用这些程序，可以实现安全、无损的回流焊接。这里定义的干燥包装工艺提供了从密封日期起12个月的最短保质期。1.2 Scope/范围This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated pa

10、ckages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.)that are exposed to the ambient air.本标准适用于PCB 组装过程中进行批量回流焊工艺的所有器件，包括塑料封装件、工艺敏感器件和其他由暴露在环境空气中的透湿材料(环氧树脂、硅树脂等)制成的湿敏器件。1.3 Assembly Processes/组装工艺1.3.1 Mass Reflow /批量

11、回流焊This standard applies to bulk solder reflow assembly by convection, convection/ IR, infrared (IR), and vapor phase(VPR) processes. It does not apply to bulk solder reflow processes that immerse the device bodies in molten (e.g., wave soldering bottom mounted devices). Such processes are not allow

12、ed for many SMDs and are not covered by the device qualifications standards used as a basis for this document. 本标准适用于通过对流、对流/IR、 红 外(IR)和气相(VPR)工艺进行的散装焊料回流组装。它不适用于将设备本体浸入熔体中的散装焊料回流工艺(例如，波峰焊底部安装的设备)。许多 smd 不允许这样的工艺，并且不包括在作为本文档基础的设备资格标准中。1.3.2 Localized Heating /局部加热This standard also applies to moist

13、ure/reflow sensitive SMD packages that are removed or attached singly by local ambient heating, i.e., hot air rework. See Clause 6.本标准也适用于通过局部环境加热(即“热空气返工”)单独移除或附着的湿气/回流敏感SMD 封装。见第6 条。1.3.3 Socketed Devices/插座器件This standard does not apply to SMD packages that are socketed and not exposed to solder

14、reflow temperatures during either bulk reflow or rework of adjacent devices. Such SMD packages are not at risk and do not require moisture precautionary handling.本标准不适用于在批量回流焊或相邻器件的返工过程中没有暴露在回流焊温度下且带有插座的 SMD 封装。这种 SMD 封装没有风险，也不需要防潮处理。1.3.4 Point-to-Point Soldering/点对点焊接This standard does not apply t

15、o SMD packages in which only the leads are heated to reflow the solder,e., hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot air rework an

16、d moisture precautionary measures are typically not needed.本标准不适用于只有引线被加热以回流焊料的SMD 封装，例如手工焊接、鸥翼引线的热棒连接以及通过波峰焊接的通孔。封装体从这种操作中吸收的热量通常比大体积表面安装回流焊或热空气返工 低得多，并且通常不需要湿气预防措施。1.3.5 Aqueous Cleaning /水清洗For non-cavity SMDs typical short term aqueous cleaning processes will not impact the floor life (internal

17、moisture content).Special consideration should be given to non-hermetic cavity packages.对于非空腔SMD,典型的短期水清洗工艺不会影响现场寿命(裸露寿命) (内部含水量)。应特别考虑非密封空腔封装。1.4 Reliability /可靠性The methods set forth in this specification ensure that an adequate SMD package reliability can be achieved durin and after the PCB assem

18、bly operation. when the SMD packages are evaluated and verified by J-STD-020,J-STD-075,and/or by JESD22-A113 plus environmental reliability testing.本规范中提出的方法确保在 PCB 组装操作期间和之后可以实现充分的SMD 封装可靠性。当SMD 封装通过J-STD-020、J-STD-075和/或JESD22-A113加上环境可靠性测试进行评估和验证时。注：本规范不涉及或保证连接器件的外部互连的焊点可靠性。1.5 Terms and Definiti

19、ons/术语和定义15.1 Actlve Desiccant /活性干燥剂Desiccant that is either fresh( new ) or has been baked according to the manufacturers recommendations to renew it to original specifications.新鲜的干燥剂，或者根据商家的推荐进行过特定烘烤处理的干燥剂。1.5.2 Bar Code Label/条码标签A label that Includes Information in a code consisting o of parall

20、el bars and spaces or a 2-D matrix format.一种标签，包括由平行条和空格或二维矩阵格式组成的代码中的信息。Note :For the purpose of this standard , the bar code label is on the lowest-level shipping container and includes information that describes the product , e.g., part number,quantity ,lot information, supplier identification, a

21、nd moisture-sensitivity level.注：就本标准而言，条形码标签位于最低级别的运输运输包装箱上，包括描述产品的信息，例如零 件号、数量、批次信息、供应商标识和湿度敏感度等级。1.5.3 Bulk Reflow 批量回流焊Reflow of multiple devices with simultaneous attachment y an infared (R convecton / R convection or vapor phase reflow(VPR)process.对许多器件同时进行回流焊接。焊接工艺包括 IR、IR对流/气相回流 (VPR)。1.5.4 C

22、arrier 载体A pocket tape , tray , tube , or other container used to store and transport packaged devices.直接用来盛放器件的容器，如：托盘、管、卷带或其他容器。1.5.5 Desiccant 干燥剂An absorbent material used to maintain a low relative humidity.一种吸湿材料，用来保持低水平的湿度。1.5.6 Floor Life 现场寿命(裸露寿命)The allowable time period after removal of

23、moisture-sensitive devices from a moisture-bamier bag,dry storage ,or dry bake and before the solder process.从防潮袋中拿出起到回流焊接为止，湿度敏感器件在工厂环境条件下存放不超过所允许的最长的暴 露时间。1.5.7 Humidity Indicator /湿度指示卡 (HIC)A card on which a moisture-sensitive chemical is applied as a spot that will make a significant, perceptib

24、le change when the indicated relative is exceeded.上面印有湿度敏感化学剂的卡片。当超过规定的相对湿度时，将湿敏化学品作为一个点施加在卡片 上，从而产生显著的、可感知的变化。注1: 已定义了两种类型的湿度指示卡 (HIC)Type 1 HIC (reversible): For reversible spots the change is temporary and occurs as a change in color (hue), typically from blue (dry) to pink( wet).A perceptible ch

25、ange will be seen if the humidity threshold is only momentarily surpassed.类型1HIC (可逆): 对于可逆斑点，变化是暂时的，并以颜色(色调)变化的形式出现，通常从蓝色(干)变为粉色(湿)。如果仅暂时超过湿度阈值，则会看到明显的变化。Type 2 HIC(nonreversible): For nonreversible spots the change is not temporary and can be a spot colormigration outside of the spot border or som

26、e other nonreversible indicator. A nonreversible HIC includes at least a 60% RH indicator spot, but can have other nonreversible RH% indicators that do not revert after exposure to a humidity threshold.类型2HIC (不可逆): 对于不可逆班点，变化不是暂时的，可能是斑点边界外的斑点颜色迁移或其他一些不可逆指示器。不可逆HIC 包括至少一个60%RH 指示点，但也可以具有其他不可逆RH%指示点，

27、这些指示点在暴露于湿度阈值后不会恢复。注 2 :HIC与干燥剂一起包装在防潮袋内，以帮助确定湿度敏感器件所受的湿度水平。 暴露于60%或更高相对湿度的I型和2型湿度指示卡 (HIC) 将不再被认为是准确的。1.5.8 Manufacturers Exposure Time /制造商暴露时间 (MET)The maximum cumulative time after bake that devices may be exposed to ambient conditions prior toshipment to end user.器件烘烤后在交付给最终用户之前，可能暴露在工厂环境条件下的最长

28、累积时间。1.5.9 Moisture-Barrier Bag/防潮袋 (MBB)A bag designed to restrict the transmission of water vapor and used to pack moisture-sensitive devices.一种用于限制水蒸气传输的袋子，用于包装湿度敏感的器件。1.5.10 Moisture-Sensitive ldentification/潮湿敏感标签 (MSID)A symbol indicating that the contents are moisture-sensitive.表示内装物品对湿气敏感度的标

29、签。1.5.11 Moisture-Sensitivity Level/湿气敏感度等级 (MSL)A rating indicating a devices susceptibility to damage due to absorbed moisture whensubjected to reflow soldering as defined in J-STD-020.在JSTD-020 中定义的回流焊时，指示器件因吸收湿气而损坏的易感性的等级。1.5.12 Rework/返工The removal of a device for scrap, reuse, or failure analy

30、sis; the replacement of an attached device; or the heating and repositioning of a previously attached device.拆除器件以进行报废、再利用或故障分析；更换连接的器件；或者加热和重新定位先前连接的器件。1.5.13 Process-Sensitivity /工艺敏感水平 (PSL)A rating used to identify a device that is solder-process-sensitive because the devicecannot be used in one

31、 or more of the base solder process conditions defined in J-STD-075.用于识别对焊接工艺敏感的器件的等级，因为该器件不能用于J-STD-075 中定义的一个或多个基础焊接工艺条件。1.5.14 Shelf Life (of a device in a sealed MBB)/保存期限(密封在防潮袋中的器件)The allowable time that a dry-packed moisture or reflow-sensitive device can be stored in an unopenedmoisture-bar

32、rier bag(MBB).干燥包装防潮或回流敏感器件在未开封防潮袋 (MBB)中储存的允许时间。1.5.15 SMD /表面贴装器件Note: For the purpose of this standard, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.1.5.16 Solder Reflow/回流焊接通过熔化的锡膏或锡来把器件和PCB 焊接到一起的过程。1.5.17 Water Vapor Tran

33、smission Rate/水蒸汽渗透率 (WVTR) 衡量塑料胶片或钢化胶片材料对湿气的渗透性指标。2 APPLICABLEDOCUMENTS(Normative)/引用文件(标准)2.1 美国材料与测试协会 (ASTM)ASTMF1249使用调制红外传感器通过塑料薄膜和薄膜的水蒸气透射率的标准试验方法ASTMF392柔性屏障材料弯曲耐久性的标准试验方法2.2 电子工业联盟 (ECIA、ESDA、JEDEC)ANSVESD S541 ESD 敏感物品包装材料2 ANSI/ESD S541 防静电敏感物品包装材料标准JESD625s 操作静电敏感器件的要求JEP160电子固态晶片、晶片和器件的

34、长期储存指南JESD22-A113可靠性测试前非密封表面安装装置的预处理JESD22-A120 集成电路用有机材料中水分扩散率和水溶解度测量的试验方法2.3 IPC 标准IPC-7711/21 电子组件的返工、修改和修理2.4联合工业标准J-STD-020 非密封固态表面安装器件的湿度/回流敏感性分类J-STD-075 装配工艺用非集成电路电子元件的分类2.5 美国国防部MIL-PRF-81705I型无静电、可热密封的柔性屏障材料MIL-D-3464型干燥剂，活性，袋装，包装使用和静态除湿3 DRY PACKING/干燥包装3.1 要求表3-1显示了各种湿气敏感度等级器件的干燥包装要求。这些等

35、级根据J-STD-020、J-STD-075 和/或JESD22-A113 以及可靠性测试确定。干燥包装中使用的所有材料至少应符合ANSI/ESD S541。表3-1 Dry-packing requirements/干燥包装要求MSL等级包装前干燥带湿度指示卡的防潮袋干燥剂潮湿敏感度标签(MSID)警告标签1可选可选需要不需要如果分级温度在220-225,则不需要； 如果分级温度超出220-225,则需要*2可选需要需要需要需要2a-5a需要需要需要需要需要6可选可选可选需要需要仅插座不适用不适用不适用不适用不需要注：如果贴在最小包装箱上的条形码标签以目视可读的形式给出了等级和回流温度，则不

36、需要贴“警告”标签。3.2 密封于防潮袋(MBB)之前， SMD 封装和载体材料的干燥3.2.1 干燥要求-等级2a-5a等级为2a至 5a的 SMD 在密封进MBBs 之前必须进行干燥(见第4条)。干燥到密封之间的时间不能超过MET (制造商暴露时间)减去分销商打开袋子和重新包装零件所允许的时间。如果供应商的实际 MET 超过默认的24小时，则必须使用实际 MET。 如果经销商的做法是用活性干燥剂重新包装进MBB 中，那么这个时间不需要从MET 中减去。3.2.2 载体材料的干燥要求放置在防潮袋 (MBB) 中的托盘、管道、卷轴等载体材料会影响MBB 内的湿度水平。因此，这些材料的影响必须通

37、过烘烤或(如果需要)在MBB 中添加额外的干燥剂来补偿，以确保SMD 的保质期计算。3.2.3 Drying Requirements/干燥要求Suppliers may use the drying effect of normal in-line processes such as post mold cure,marking cure,and burn-in to reduce the bake time.An equivalency evaluation is recommended to ensure that high temperature processing maintain

38、s moisture weight gain to an acceptable level. The total weight gain for the SMD package at the time it is sealed in the MBB must not exceed the moisture gain of that package starting dry and then being exposed to 30/60% RH for MET hours (less the time for distributors).供应商可以使用正常在线工艺的干燥效果，如模后固化标记固化和

39、老化，以减少烘烤时间。建议进行等 效评估，以确保高温处理将水分增重维持在可接受的水平。 SMD 密封在MBB 中的总增重，不得超过该包装开始干燥然后暴露在30/60%RH 下MET 小时(少于分销商的时间)的增湿量。3.2.4 烘烤和装袋之间超出的时间1. MBE2. Desiccant3. HIC4. Foam End1. 防潮袋2. 干燥剂3. 湿度指示卡4. 尾部泡沫护垫如果超过了烘烤和装袋之间的允许时间， SMD 封装必须根据第4条再次干燥。3.3Dry Pack/干燥包装3.3.1 DESCRIPTION/说明Dry pack consists of desiccant materi

40、al and a Humidity Indicator Card( HIC) sealed with the SMD packages inside a Moisture Barrier(MBB).A representative dry-pack configuration is shown in Figure 3-1.干燥包装由干燥剂材料和湿度指示卡 (HIC) 组成，湿度指示卡与防潮袋 (MBB) 内的SMD 封装密封。典型的干燥包装配置如图3-1所示。3.3.2 Materials/材料图3-1:常见的运输盛料管内的潮湿敏感SMD 封装的干燥包装形式3.3.2.1 Moisture B

41、arrier Bag /防潮袋 (MBB)防潮袋的各项参数必须符合MIL-B-81075, 第一类型必须要求的是弹性，防静电放电，机械强度和抗穿刺能力，袋子必须是可热封的。以 ASTMF392 条件E做弯曲测试，水蒸汽渗透率测试采用 ASTMF 1249。水汽渗透速度不可大于0.0310g/m 0.002g/100in 在24小时内。3.3.2.2 干燥剂干燥剂材料应符合 MIL-D-3464 TYPEII。 干燥剂必须满足无尘、无腐蚀性，吸潮能力符合标准。干燥剂的现场寿命(裸露寿命)非常有限，在装入MBB 之前应按照制造商的建议进行储存和处理。干燥剂应包装在湿气可渗透入的袋子里。每个防潮袋的

42、干燥剂用量必须标注在在袋子上和WVTR ( 水 蒸汽渗透率) , 以便在计算的保质期结束时，在25下将MBB 的内部相对湿度限制在10% 以下。For companson between vanous desiccant types , military specifications adopted the UNITas the basic unit of measure of quantity for desiccant matenal. A UNIT of desiccant is defined as the amount that will absorb a minimum of 2.

43、85 g of water vapor at 20%RH and 25.为了比较各种干燥剂类型，美军标规定用“UNIT” 作为干燥剂材料数量的基本计量单位。 一单位干燥剂的定义是在20%RH 和25条件下，至少能吸收2.85g 的水气。3.3.2.2.1 Desiccant Quantity Calculation 干燥剂数量计算When the desiccant capacity at 10%RH and 25 is known,the following equation should be used:当已知10%RH 和25环境条件下的， 一包所需的干燥剂数量的计算公式如下：U=(0.

44、304*M*WVTR*A)/D解释如下：U= 干燥剂的数量0.304=Average number of days per month/100 in(30.4/100)M= 期望的保存期限WVTR= 水蒸汽渗透率J-STD-033D ( 中 文 版 )A= 防 潮 袋 的 表 面 积 ， 单 位 为 平 方 分 米 ( 平 方 英 寸)D =在相对湿度为1 0 % 、温度为2 5 的情况下， 一 单位干燥剂吸收的水量( 单位： 克)当湿度为1 0 % 、温度为25 条件下的干燥剂的吸水能力未知时， 可采用保守值 D= 1 . 4 0 。Note 1: If it is desired to m

45、inimize the amount of desiccant used for dry-packing level 2 devices a value of D based on the amount of water in grams , that a UNIT of desiccant will absorb at 60% RH and 25 must be used n the formula .This alue should to be obtained from the desiccant manufacturer .When this option is used it mus

46、t be verified that when the device was classified per J-STD-020 it must have achieved full saturation during moisture soak.注 1 : 如果希望将用于 2 级干燥包装器件的干燥剂的数量减至最小， 则公式中必须使用基于克数的D 值 ， 即 一 单位干燥剂在6 0 % RH 和2 5 条件下吸收的水分。该值应从干燥剂制造商处获得。当使用该选项时，必须验证当根据J- STD- 0 2 0 对设备进行分类时， 其在湿浸期间必须达到完全饱和。Note 2: No moisture-a

47、bsorbing material (e.g. trays , tubes , reels , foam end caps )shoul ld be placed in the dry bag without low temperature baking Any such material that is included increases the amount of desiccant needed to meet the calculated shelf life(see 5.3.1) by an amount based on the moisture content of the material. This can be determined by weighing a representative quantity of material known to be at equilibrium with the manufacturing environment, baking to a new constant weight, and subtracting the final from the initial weight. 注 2 : 在未经低温烘烤的情况下，